Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • 2019 Magazine Archives
1912cover

December 2019

  • AI and machine learning effects on electronics manufacturing
  • Flex circuit solderability
  • Printed circuit design layout and placement
  • Nickel corrosion in ENIG and ENEPIG 
  • Transparent flexibile circuits
  • The relationship between epoxy resin and signal behavior
  • Materials supply chain security
  • Who should pay for tooling and test?
  • A look back at those who left us in 2019
  • The latest happenings among the Designers Council chapters
1911cover

November 2019

  • 1080 glass alternatives
  • Additive manufacturing / 3-D printing
  • Dealing with PCB vendors
  • EMA Automation profile
  • Chiplets/MCMs
  • The latest happenings among the Designers Council chapters
1910cover

October 2019

  • Emerging challenges in modeling, simulation and design tools
  • DDR5 sockets
  • Ventec interview
  • Mechatronics
  • Lab-on-a-chip
  • Circuit Connect profile
  • When to source dual-ply glass
  • The latest happenings among the IPC Designers Council chapters
1909cover

September 2019

  • The annual NTI-100 list of the world's largest fabricators
  • PCB procurement strategies
  • Calculating trace length from time delay values
  • The impact of glass styles on precipitating or mitigating skew
  • Reliability implications of self-driving vehicles
  • Prototron Circuits profile
  • Eco-design
  • IPC Designers Council chapter updates
  • Download the pdf
1908cover

August 2019

  • ECTC 2019 recap
  • The paperless factory
  • Signal integrity
  • Assembly data documentation
  • Extra-long flex circuits
  • Glass skew mitigation techniques
  • View the Digital Edition
1907cover

July 2019

  • Producing an ECO/updating design
  • Is the PCB Industry ready for 5G?
  • The true cost of tariffs
  • Prepping files for assembly
  • Glass-weave skew causes
  • Vendor managed inventory
  • Designing for buildup processes
  • Signal integrity design fundamentals
  • View the Digital Edition
1906cover

June 2019

  • Zuken Innovation World
  • Old fabrication equipment
  • Board buyer certification
  • Routing guidelines
  • Glass styles
  • The San Diego IPC Designers Council Chapter
  • Via-in-pad on SMT flex
  • View the Digital Edition
1905cover

May 2019

  • Material selection for high-speed PCB Design
  • Stackups
  • Minimizing impedance deviations
  • Artificial intelligence in ECAD
  • View the Digital Edition
1904cover

April 2019

  • CAD data transfer
  • Impedance control
  • Stack-up strategies
  • High-speed laminate selection
  • LED emitters
  • Switching the top and signal layers
  • View the Digital Edition
1903cover

March 2019

  • Annual PCD&F designers' salary survey
  • Designing for higher power in smaller form factors
  • IPC Apex Expo 2019 recap
  • Designing for in-circuit test (ICT)
  • Nepcon Japan 2019 recap
  • Electric-field orientation of measurement equipment
  • View the Digital Edition
1902cover

February 2019

  • Mitigating nickel corrosion in ENIG deposits
  • Has automotive supplanted military in high-reliability electronics?
  • Design setup and placement processes
  • Dk/Df measurement standards
  • Technology and quality audit processes
  • Comparing rigid-flex and rigid boards
  • View the Digital Edition
1901cover

January 2019

  • Using Maxwell’s equations for designing transmission lines
  • Advantages of being small in electronics manufacturing 
  • PCB schematics
  • Determining Df and Dk tradeoffs among various laminates
  • Bare board x-ray inspection
  • Ten steps for achieving good DfX
  • View the Digital Edition

Archives

  • 2022 Issues

  • 2021 Issues

  • 2020 Issues

  • 2019 Issues

  • 2018 Issues

  • 2017 Issues

  • 2016 Issues

  • 2015 Issues

  • 2014 Issues

  • 2013 Issues

  • 2012 Issues

  • 2011 Issues

  • 2010 Issues

  • 2009 Issues

  • 2008 Issues

  • 2007 Issues

  • 2006 Issues

  • 2005 Issues

  • 2004 Issues

  • 2023 Issues

MAY ISSUE
May cover

View the Digital
Edition Here!

Press Releases

  • Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
  • AGS Devices Licenses and Co-Brands CELUS Design Platform to Enable Faster Product Development and Sourcing
  • Duro Launches Technology Partner Program to Deliver Complete Digital Thread for Hardware Engineering
  • TTM Technologies, Inc. Announces Retirement of Founder and Board Member, Kent Alder
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2024 Printed Circuit Engineering Association®, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy