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  • Reflections from Discontinuities

    Reflections from Discontinuities

    Models for predicting the effects of signal-destroying reflections.  READ MORE...

  • The 5 Pillars of PCB Design Best Practices

    The 5 Pillars of PCB Design Best Practices

    Our newest column shares tips and tricks and lessons learned over 30 years in PCB design.
      READ MORE...

  • PCB Design in a Chip Company

    PCB Design in a Chip Company

    To land the job you want, it pays to be grounded and groomable.  READ MORE...

  • VVDN Goes Vertical

    VVDN Goes Vertical

    India’s largest ODM is looking to add PCB fabrication to complete its end-to-end mix.
      READ MORE...

  • Understanding Electroless Nickel Thickness in ENIG and ENEPIG

    Understanding Electroless Nickel Thickness in ENIG and ENEPIG

    The actual phosphorus content in the deposit must be considered.
      READ MORE...

Homepage Slideshow

  • Reflections from Discontinuities

    Models for predicting the effects of signal-destroying reflections.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/17234-reflections-from-discontinuities-2

  • The 5 Pillars of PCB Design Best Practices

    Our newest column shares tips and tricks and lessons learned over 30 years in PCB design.


    https://pcdandf.com/pcdesign/index.php/current-issue/241-best-practices/17265-the-5-pillars-of-pcb-design-best-practices

  • PCB Design in a Chip Company

    To land the job you want, it pays to be grounded and groomable.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/17231-pcb-design-in-a-chip-company-some-significant-particulars

  • VVDN Goes Vertical

    India’s largest ODM is looking to add PCB fabrication to complete its end-to-end mix.


    https://www.circuitsassembly.com/ca/editorial/menu-features/38991-vvdn-goes-vertical.html

  • Understanding Electroless Nickel Thickness in ENIG and ENEPIG

    The actual phosphorus content in the deposit must be considered.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17196-understanding-electroless-nickel-thickness-in-enig-and-enepig

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  • 2019 Magazine Archives
1912cover

December 2019

  • AI and machine learning effects on electronics manufacturing
  • Flex circuit solderability
  • Printed circuit design layout and placement
  • Nickel corrosion in ENIG and ENEPIG 
  • Transparent flexibile circuits
  • The relationship between epoxy resin and signal behavior
  • Materials supply chain security
  • Who should pay for tooling and test?
  • A look back at those who left us in 2019
  • The latest happenings among the Designers Council chapters
1911cover

November 2019

  • 1080 glass alternatives
  • Additive manufacturing / 3-D printing
  • Dealing with PCB vendors
  • EMA Automation profile
  • Chiplets/MCMs
  • The latest happenings among the Designers Council chapters
1910cover

October 2019

  • Emerging challenges in modeling, simulation and design tools
  • DDR5 sockets
  • Ventec interview
  • Mechatronics
  • Lab-on-a-chip
  • Circuit Connect profile
  • When to source dual-ply glass
  • The latest happenings among the IPC Designers Council chapters
1909cover

September 2019

  • The annual NTI-100 list of the world's largest fabricators
  • PCB procurement strategies
  • Calculating trace length from time delay values
  • The impact of glass styles on precipitating or mitigating skew
  • Reliability implications of self-driving vehicles
  • Prototron Circuits profile
  • Eco-design
  • IPC Designers Council chapter updates
  • Download the pdf
1908cover

August 2019

  • ECTC 2019 recap
  • The paperless factory
  • Signal integrity
  • Assembly data documentation
  • Extra-long flex circuits
  • Glass skew mitigation techniques
  • View the Digital Edition
1907cover

July 2019

  • Producing an ECO/updating design
  • Is the PCB Industry ready for 5G?
  • The true cost of tariffs
  • Prepping files for assembly
  • Glass-weave skew causes
  • Vendor managed inventory
  • Designing for buildup processes
  • Signal integrity design fundamentals
  • View the Digital Edition
1906cover

June 2019

  • Zuken Innovation World
  • Old fabrication equipment
  • Board buyer certification
  • Routing guidelines
  • Glass styles
  • The San Diego IPC Designers Council Chapter
  • Via-in-pad on SMT flex
  • View the Digital Edition
1905cover

May 2019

  • Material selection for high-speed PCB Design
  • Stackups
  • Minimizing impedance deviations
  • Artificial intelligence in ECAD
  • View the Digital Edition
1904cover

April 2019

  • CAD data transfer
  • Impedance control
  • Stack-up strategies
  • High-speed laminate selection
  • LED emitters
  • Switching the top and signal layers
  • View the Digital Edition
1903cover

March 2019

  • Annual PCD&F designers' salary survey
  • Designing for higher power in smaller form factors
  • IPC Apex Expo 2019 recap
  • Designing for in-circuit test (ICT)
  • Nepcon Japan 2019 recap
  • Electric-field orientation of measurement equipment
  • View the Digital Edition
1902cover

February 2019

  • Mitigating nickel corrosion in ENIG deposits
  • Has automotive supplanted military in high-reliability electronics?
  • Design setup and placement processes
  • Dk/Df measurement standards
  • Technology and quality audit processes
  • Comparing rigid-flex and rigid boards
  • View the Digital Edition
1901cover

January 2019

  • Using Maxwell’s equations for designing transmission lines
  • Advantages of being small in electronics manufacturing 
  • PCB schematics
  • Determining Df and Dk tradeoffs among various laminates
  • Bare board x-ray inspection
  • Ten steps for achieving good DfX
  • View the Digital Edition

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