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  • PCB Design and Fabrication Concerns for Millimeter-Wave Circuits

    PCB Design and Fabrication Concerns for Millimeter-Wave Circuits

    Essential for mmWave applications, phase accuracy is affected by a host of variables.  READ MORE...

  • Automation, Flexibility and the ‘Electronics Supercycle’

    Automation, Flexibility and the ‘Electronics Supercycle’

    One year in, Covid-19 has shifted priorities in the industry – or has it?  READ MORE...

  • Analysis Paralysis

    Analysis Paralysis

    The "founder" of TMI asks, How much is more analysis worth?  READ MORE...

  • An Industry in Need

    An Industry in Need

    US defense suppliers have begged for help. A pandemic helped them get it.   READ MORE...

  • Getting Embedded with IPC-2581C

    Getting Embedded with IPC-2581C

    The new data transfer format provides comprehensive support for embedded components.  READ MORE...

  • From the Archives: Reducing PCB Costs through Panel Optimization

    From the Archives: Reducing PCB Costs through Panel Optimization

    You think you’re buying boards, but you’re paying for panels.  READ MORE...

Homepage Slideshow

  • PCB Design and Fabrication Concerns for Millimeter-Wave Circuits

    Essential for mmWave applications, phase accuracy is affected by a host of variables.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15484-pcb-design-and-fabrication-concerns-for-millimeter-wave-circuits

  • Automation, Flexibility and the ‘Electronics Supercycle’

    One year in, Covid-19 has shifted priorities in the industry – or has it?

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15473-2021-automation-flexibility-and-the-electronics-supercycle

  • Analysis Paralysis

    The "founder" of TMI asks, How much is more analysis worth?

    https://pcdandf.com/pcdesign/index.php/current-issue/266-material-matters/15478-winning-the-war-against-analysis-paralysis

  • An Industry in Need

    US defense suppliers have begged for help. A pandemic helped them get it.

     

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15449-us-defense-suppliers-have-begged-for-help-a-pandemic-helped-them-get-it

  • Getting Embedded with IPC-2581C

    The new data transfer format provides comprehensive support for embedded components.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15483-getting-embedded-with-ipc-2581c

  • From the Archives: Reducing PCB Costs through Panel Optimization

    You think you’re buying boards, but you’re paying for panels.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/12160-panelization-1711

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  • 2019 Magazine Archives
1912cover

December 2019

  • View the Digital Edition
  • AI and machine learning effects on electronics manufacturing
  • Flex circuit solderability
  • Printed circuit design layout and placement
  • Nickel corrosion in ENIG and ENEPIG 
  • Transparent flexibile circuits
  • The relationship between epoxy resin and signal behavior
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  • Who should pay for tooling and test?
  • A look back at those who left us in 2019
  • The latest happenings among the Designers Council chapters
1911cover

November 2019

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  • 1080 glass alternatives
  • Additive manufacturing / 3-D printing
  • Dealing with PCB vendors
  • EMA Automation profile
  • Chiplets/MCMs
  • The latest happenings among the Designers Council chapters
1910cover

October 2019

  • Emerging challenges in modeling, simulation and design tools
  • DDR5 sockets
  • Ventec interview
  • Mechatronics
  • Lab-on-a-chip
  • Circuit Connect profile
  • When to source dual-ply glass
  • The latest happenings among the IPC Designers Council chapters
  • View the Digital Edition
1909cover

September 2019

  • View the Digital Edition
  • The annual NTI-100 list of the world's largest fabricators
  • PCB procurement strategies
  • Calculating trace length from time delay values
  • The impact of glass styles on precipitating or mitigating skew
  • Reliability implications of self-driving vehicles
  • Prototron Circuits profile
  • Eco-design
  • IPC Designers Council chapter updates
  • Download the pdf
1908cover

August 2019

  • ECTC 2019 recap
  • The paperless factory
  • Signal integrity
  • Assembly data documentation
  • Extra-long flex circuits
  • Glass skew mitigation techniques
  • View the Digital Edition
1907cover

July 2019

  • Producing an ECO/updating design
  • Is the PCB Industry ready for 5G?
  • The true cost of tariffs
  • Prepping files for assembly
  • Glass-weave skew causes
  • Vendor managed inventory
  • Designing for buildup processes
  • Signal integrity design fundamentals
  • View the Digital Edition
1906cover

June 2019

  • Zuken Innovation World
  • Old fabrication equipment
  • Board buyer certification
  • Routing guidelines
  • Glass styles
  • The San Diego IPC Designers Council Chapter
  • Via-in-pad on SMT flex
  • View the Digital Edition
1905cover

May 2019

  • Material selection for high-speed PCB Design
  • Stackups
  • Minimizing impedance deviations
  • Artificial intelligence in ECAD
  • View the Digital Edition
1904cover

April 2019

  • CAD data transfer
  • Impedance control
  • Stack-up strategies
  • High-speed laminate selection
  • LED emitters
  • Switching the top and signal layers
  • View the Digital Edition
1903cover

March 2019

  • Annual PCD&F designers' salary survey
  • Designing for higher power in smaller form factors
  • IPC Apex Expo 2019 recap
  • Designing for in-circuit test (ICT)
  • Nepcon Japan 2019 recap
  • Electric-field orientation of measurement equipment
  • View the Digital Edition
1902cover

February 2019

  • Mitigating nickel corrosion in ENIG deposits
  • Has automotive supplanted military in high-reliability electronics?
  • Design setup and placement processes
  • Dk/Df measurement standards
  • Technology and quality audit processes
  • Comparing rigid-flex and rigid boards
  • View the Digital Edition
1901cover

January 2019

  • Using Maxwell’s equations for designing transmission lines
  • Advantages of being small in electronics manufacturing 
  • PCB schematics
  • Determining Df and Dk tradeoffs among various laminates
  • Bare board x-ray inspection
  • Ten steps for achieving good DfX
  • View the Digital Edition

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Press Releases

  • Elmatica welcome Senior Advisor from UK manufacturing
  • Altium and AWS Collaborate to Advance Electronic Design
  • IPC Commends President Biden for Executive Order on Industrial Supply Chains
  • MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference
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