The Torayfan biaxially oriented polypropylene (OPP) release film supports processing temperatures up to 160°C while maintaining thermal dimensional stability and release performance. The uncoated film is intended for use in IC substrate manufacturing, carbon fiber-reinforced plastic prepreg processing and other molding applications where fluorinated release films are commonly used. Compared with standard OPP film, the material exhibits reduced heat distortion at elevated temperatures, low moisture absorption, and low wettability, supporting clean release in contamination-sensitive processes. The film is suitable for dry-room environments and vacuum-based manufacturing steps such as vapor deposition and sputtering. 

The Gen 2 TMBS rectifier module series consists of 100V trench MOS barrier Schottky devices designed for industrial power conversion applications. Offered in a fully insulated, industry-standard SOT-227 package, the modules deliver forward voltage drops as low as 0.83V and support high current ratings with negligible reverse recovery charge. The lineup includes dual-diode parallel configurations rated at 100A, 200A and 400A, as well as a 150A single-phase bridge. Devices support operation up to +150°C and are intended for use in high-frequency converters, industrial SMPS, welding equipment, telecom power systems, 48V battery-powered vehicles and large battery blocking applications. 

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The RNAN series is a thin film precision chip resistor line built on an aluminum nitride substrate to support higher power dissipation. Uses a high-thermal-conductivity aluminum nitride base to enable increased power density compared with alumina substrates, allowing thin film nichrome resistors to be applied in higher-power designs. Supports power ratings up to 0.5W in 0603, 1W in 0805, 2W in 1206 and 6W in 2512 while maintaining acceptable hot-spot and terminal temperatures. Designed for applications requiring precision resistance, thermal performance and reliability in space-constrained layouts.