New Products

Web-based schematic analysis service evaluates Altium and KiCad designs prior to layout, generating a 0–100 layout-readiness score with ranked improvement actions. Predicts structural test coverage across inspection and test methods including AOI, AXI, flying probe, in-circuit test and boundary scan, while inserting test points directly into modified native design files. Supports design, test and manufacturing workflows by identifying issues at schematic stage, reducing downstream rework and cycle time. Runs more than 1,000 automated checks covering impedance continuity, interface validation, library completeness, footprint compliance and power distribution. Outputs exportable reports for cross-functional review and provides centralized visibility into design quality and readiness. Available as a web service with free access tiers and planned premium features.

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Surface-mount DIP switches support high-density PCB layouts in space-constrained electronic designs. The devices feature a 1.27mm half-pitch footprint, enabling increased component density while maintaining electrical and mechanical reliability. Gold-plated bifurcated contacts support low-resistance signal integrity, while top-tape sealed construction enables automated SMT soldering and post-reflow aqueous cleaning. Rated up to 50VDC and 100mA steady-state, with 1,000-cycle mechanical and electrical life. Available in 2, 4, 6, 8, and 10-position configurations, supporting flexible design requirements. Compatible with standard SMT processes and offered in tube or tape-and-reel packaging for high-volume production.

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Ultrafast rectifiers support power conversion and protection applications across automotive, industrial and electronics systems. The 200V devices provide current ratings from 6A to 15A and are offered in single and dual configurations, including AEC-Q101 qualified versions. Housed in a 6.5mm x 4.6mm DFN6546A package with a 0.88mm profile, enabling compact PCB layouts. Optimized copper mass design and die placement support thermal performance for higher current operation, while wettable flanks enable AOI inspection without X-ray. Operate from -55°C to +175°C and feature low forward voltage drop of 0.75V, fast reverse recovery and low reverse recovery charge to reduce power losses. Applications include inverters, DC/DC converters, freewheeling diodes, protection circuits and automotive systems such as ECUs, ADAS and battery management.

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Low-loss PCB material with near-zero coefficient of thermal expansion (CTE) supports high-speed signal integrity in advanced electronics. Celeritas HM001 provides stable dielectric performance with low loss characteristics, enabling signal transmission at data rates up to 224Gb/s and beyond. The material is designed for high-frequency applications requiring consistent electrical performance across temperature and frequency ranges, supporting next-generation AI and high-speed computing designs.

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PCB material with negative coefficient of thermal expansion (CTE) supports large-format AI designs by reducing thermomechanical mismatch. Celeritas HM50 features a CTE of -8ppm/°C, enabling PCB stackups to counteract copper expansion and lower overall board CTE. This supports reduced warpage, minimized package bow and improved solder fatigue performance in high-density assemblies. The material supports applications where thermal stability is critical, including advanced AI hardware and high-performance computing systems, enabling improved reliability in large-scale designs.

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High-power chip resistors with aluminum nitride substrates support thermally constrained electronics applications. The RMAN series uses aluminum nitride to enable higher thermal conductivity than standard alumina, allowing improved heat dissipation, lower operating temperatures and stable electrical performance. Designed for power-dense environments, the resistors support applications including IGBT, SiC and GaN modules, power supplies, EV systems and RF circuits. Devices deliver power ratings up to 2.4W in 1206 and 3.4W in 2512 packages while maintaining controlled hotspot temperatures.

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