Vishay Intertechnology has released the CRCW0201-AT e3 Series AEC-Q200 qualified thick film chip resistors in an ultra-compact 0201 case size. Measuring 0.6mm × 0.3mm × 0.23mm, the devices are designed to reduce PCB space requirements by approximately 50% compared to 0402 components. Offers a power rating of 0.05W at +70°C, a maximum operating voltage of 30V and an operating temperature range of -55°C to +155°C. Resistance values range from 10Ω to 1MΩ, including a 0Ω jumper option, with tolerances of ±1% and ±5% and a temperature coefficient of ±200ppm/K.

Molex introduced Impress Co-Packaged Copper Solutions, a compression-based connector and cable assembly designed for near-ASIC connectivity in high-speed data center systems. The solution supports data rates up to 224Gbps PAM-4 and is intended for use in next-generation AI and hyperscale computing architectures. Impress places the connection interface directly on the ASIC package substrate, reducing signal path length through the PCB. The two-piece system consists of a compression-attached socket and mating cable assembly, engineered to manage signal integrity and power distribution in high-density environments. The compression attachment method is designed to minimize substrate stress and simplify maintenance or rework. The platform builds on the company’s NearStack On-the-Substrate (OTS) connectors, with more than one million units previously deployed. Impress is designed to provide electrical isolation from substrate to interconnect to reduce signal loss and crosstalk in high-speed channels.

Keysight Technologies introduced 3D Interconnect Designer, a software platform developed to support the design of complex interconnect structures in chiplet and three-dimensional integrated circuit (3DIC) packages used in AI infrastructure and data center applications. The tool addresses manual optimization challenges associated with multi-die and stacked-die designs, including vias, transmission lines, solder balls and micro-bumps. Supports advanced geometries such as hatched and waffled ground planes used in silicon interposers and bridge-based architectures. 3D Interconnect Designer validates designs against emerging standards including UCIe and BoW and incorporates electromagnetic-based simulation for electrical analysis of PCB and package-level 3D interconnect structures. Automated design cycles reduce manual workflow steps and support early compliance validation to mitigate late-stage design failures.

Inneos introduces Cheetah, a 25G optical transceiver built on its OptoBGA platform. Supports high-speed data transmission in applications where copper-based interconnects face constraints related to electromagnetic interference, weight, power and system cost. Targets systems requiring 25G connectivity in wide temperature ranges and harsh operating environments. Supports high-volume assembly processes while maintaining signal integrity at high data rates.