Octopart Discover platform supports electronics component discovery by linking system intent, functional blocks, and design constraints to component and solution evaluation. Platform is designed to move engineers beyond traditional part-number searches by aligning results with architecture requirements and design context during early development stages. Discovery tools retain system context as engineers compare options, allowing constraints, prior selections, and architecture decisions to remain connected during evaluation. When requirements change, results can be adjusted without restarting the discovery process. Platform integrates with design and data environments including CAD, PLM and partner data sources to maintain alignment between system-level decisions and available component options. Discovery tools are intended to support early-stage design exploration where cost structure, performance limits, and reliability decisions are established. Octopart Discover will be demonstrated at embedded world in Nuremberg and is expected to become available in the second half of 2026.

MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.

CI-ONE integrates a Ka-band power amplifier and single-pole double-throw (SPDT) RF switch into a compact surface-mount module designed for satellite communication, aerospace, radar and emerging 5G/6G applications. Built using gallium arsenide (GaAs) pHEMT technology, the modules operate from a 6V supply and offer output power options of 30dBm, 34dBm and 36dBm to support 1W, 2W and 4W system architectures. Switching speeds of 5ns enable agile transmit systems while maintaining approximately 22% efficiency at the 1dB compression point. Reduces component count, simplifies RF routing and lowers thermal complexity for Ka-band front-end designs. The integrated architecture is designed to reduce module size by roughly three times while improving efficiency and cutting system costs compared with traditional discrete implementations. 

Umicore introduced Auruna 8000, a nickel- and cobalt-free gold-iron high-speed electrolyte engineered for sustainable hard gold plating in high-speed and brush plating applications. The weakly acidic process produces low-porosity, wear-resistant coatings with approximately 99.7 wt.% gold and 0.3 wt.% iron, achieving hardness of about 130HV and meeting ASTM B-488-01 Type I, Code C specifications for demanding technical uses. Operating at 45–65°C with a pH range of 4.2–4.6, supports plating speeds of approximately 8µm/min and metal content from 2–30g/l (nominal 12g/l).