Embedded 4G/LTE FR4 surface-mount antenna measuring 28 x 10 x 3.3mm for long, narrow PCB designs. Supports global cellular bands including LTE 700, GSM850/900, DCS1800, PCS1900, WCDMA2100, LTE Band 7 and LTE Band 40, with efficiency up to 68%. Designed for direct PCB soldering without a ground plane adjacent to the antenna, it is supplied in tape-and-reel packaging for automated SMT assembly and is suited for IoT sensors, smart metering, telematics and M2M applications.

Copper nanopaste for inter-board connections in high-layer-count PCBs that achieves 15μΩ·cm volume resistivity through low-temperature sintering in ambient atmosphere. Designed for AI servers, semiconductor inspection equipment and high-speed communication systems, SAphire B contains more than 90 wt% copper, supports screen printing and other application methods, and demonstrated less than 1% resistance change after 1,000 thermal cycles.

AI-powered design assistant that extends agentic automation beyond chip development to PCB and advanced package design. Integrated within the Allegro AI Studio, AuraStack helps engineers streamline board and package layout by coordinating thermal, signal integrity, mechanical and manufacturing analyses within a unified workflow, reducing design iterations and accelerating system development.

Embedded JTAG system software that adds automatic test program generation tools, virtual test channels for analog instruments, a Measurement Widget, and a customizable UUT Status Panel to streamline boundary scan testing and in-system programming. Includes enhancements to the ViPX Netlist Explorer, expanded VarioTAP processor emulation models, and support for automated test generation, design validation, debugging, and programming using CAD data, netlists, and component lists.