New Products
Amalga enables fabrication of hollow, metal waveguide and coaxial structures inside and on top of electronic substrates.
IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates.
AD300D 4th gen. commercial microwave and RF laminate material extends capabilities of AD300 product.
BR series raised element through-hole current sense resistors have 1W, 3W, and 5W power ratings.
CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.
RO4450T bonding materials are 3.2-3.3Dk, low loss, spread-glass reinforced, and ceramic-filled.
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