New Products

Amalga enables fabrication of hollow, metal waveguide and coaxial structures inside and on top of electronic substrates.

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IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates.

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AD300D 4th gen. commercial microwave and RF laminate material extends capabilities of AD300 product.

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BR series raised element through-hole current sense resistors have 1W, 3W, and 5W power ratings.

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CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.

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RO4450T bonding materials are 3.2-3.3Dk, low loss, spread-glass reinforced, and ceramic-filled.

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