Doosan's new high-end copper-clad layer lineup features products suitable for memory, system semiconductors, communications networks and smart devices.
DuPont's Pyralux ML double-sided metal-clad laminates were developed for optimal thermal management for high-reliability markets such as aerospace, defense, electric vehicles, AI-related networking and other electronic devices.
Würth Elektronik's WRIS-RSKS family of anti-sulfur resistors is aimed at manufacturers of durable electronics for applications susceptible to exposure from sulfur compounds.
HCLTech's cloud hybrid EDA solution uses NetApp's Design Anywhere to streamline the semiconductor design process, from concept to manufacturing.
Würth Elektronik's WL-ICLED series combines a red, green and blue LED with a programmable controller IC.
Ventec's new range of pro-bond and thermal-bond bond ply dielectrics are formulated for high-speed signal integrity with low losses and thermal management in ML PCB stack ups.