San Francisco Circuits’ PCB Stackup Calculator is an online tool. Helps engineers design and visualize multilayer PCB stackups from 4 to 14 layers. Users can select copper weights, dielectric materials and via options. Allows for a view of a layer-by-layer breakdown aligned with IPC 6012 guidelines.

Hirose's BK11 Series multi-power hybrid FPC-to-board connector delivers a footprint up to 46% smaller than conventional designs. Supporting two main power contacts at 4A per pin, four sub-power contacts at 2.5A per pin and 10 signal contacts.

Vishay Intertechnology's IHDM-1107BBEV-2A and IHDM-1107BBEV-3A edge-wound, through-hole inductors are designed for high-current, high-temperature automotive power applications. Features powdered iron alloy core technology, devices maintain stable inductance and saturation from -40 °C to +180 °C with low DCR down to 0.22 mΩ.

Lexar Enterprise’s BG Series DDR5 RDIMMs are certified for compatibility with AMD’s Ryzen Threadripper PRO 9000WX-Series processors. Supports up to 6400Mbps data rates and is optimized for bandwidth-heavy workloads like 3D rendering, AI model training and 8K video editing.