New Products

TWLS and TZA electrodeposited copper foils are now arsenic-free. All traces of arsenic have been removed from the treatment process.

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XJTAG DFT Assistant free software interface for Mentor Xpedition Designer increases design for test and debug capabilities of the schematic capture and PCB design environment.

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BondFilm HF is for treatment of innerlayer cores.

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Electra v. 7.20 shape-based autorouter has improved completion rate and quality for high-density designs.

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9176-800 series low-profile insulation displacement connectors reduce Z-axis height of 9176-400 series 1mm; reduce volume of standard 00-9176 series IDCs more than 50%.

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Carbon Zebra connector makes electrical contact using 140 conductive pads per in. when placed between PCB and LCD display.

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