ORLANDO, FL – The 2026 IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers. ECTC 2026 will take place May 26-29, 2026 at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend.

Abstract submission will open on August 18, 2025, and the deadline for submissions is October 6, 2025. For all details and to submit an abstract, please visit the ECTC 2026 Call for Papers.

The ECTC 2026 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, WLP and PLP, fan-out and fan-in packaging, flip chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing and systems, and other emerging technologies in electronics packaging.

Previously unpublished, non-commercial paper abstracts are requested in areas including:

• Applied Reliability
• Assembly and Manufacturing Tmetechnology
• Electrical Design and Analysis
• Emerging Technologies
• Interconnections
• RF, High-Speed Components & Systems
• Materials & Processing
• Thermal/Mechanical Simulation & Characterization
• Packaging Technologies
• Photonics
• Interactive Presentations

• Next