Press Releases

SAN FRANCISCO, CA (September 28, 2022) - Today, SnapEDA, the first search engine for electronics design is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners, includes electronic component distributors, printed circuit board (PCB) tool makers, and engineering media sites.

The SnapEDA Syndication Network connects the electronic designers and engineers who are at the heart of the electronic industry with design content for millions of electronic components.

This content helps engineers design faster, grows revenue and loyalty for distributors, and allows chip and component manufacturers to get valuable design wins.

Over 80% of engineers that download SnapEDA’s design content purchase the product. This creates a competitive advantage for electronic component distributors and manufacturers that are a part of SnapEDA’s network, enabling them to win sales earlier in the design process.

Global spending on digital transformation is expected to reach an all-time high of $6.8 trillion in 2023. As a result of the global pandemic and a heightened demand for self-serve component selection tools, component manufacturers are increasingly investing in digital demand generation technologies. In addition to helping engineers find the parts they need, SnapEDA uniquely translates this demand into seamless design-ins, securing the win for component manufacturers.

“Before meeting SnapEDA we were very reactive with our CAD models and only provided them once they were requested. In today’s self-service approach to design, that strategy is no longer effective. SnapEDA has helped us to not only proactively provide CAD models for over 1 million of our products, but also to reach millions of engineers worldwide via their Syndication Network” Said Daniel Williams, CIO at Samtec.

“At SnapEDA, our mission is to help engineers design electronics faster so they can spend more time innovating. By providing our trusted design content everywhere - including the world’s leading distributors and PCB tools - we’re able to boost productivity for even more engineers worldwide for a frictionless design flow” said Natasha Baker, CEO and Founder of SnapEDA.

Partners in the network include Digi-Key, Autodesk Fusion360, RS Components DesignSpark, Cadence, Mouser, Zuken eCADSTAR, Distrelec, Online Components, Master Electronics, Octopart, DipTrace, Proteus, TraceParts, IHS Markit, PartsBox, Semikart, Devicemart, ExpressPCB, TARGET 3001!, Cadenas, Electronics Lab, Seeed Studio, Inventhub, OEM Secrets, Cofactr, Sourceability, Endeavor Business Media and PCBWay. Five new partners are signed and scheduled to launch in the coming months.

Engineers can also auto-import CAD models with SnapEDA plugins for Altium, KiCAD, Eagle, and PCB123. Supported content includes schematic symbols, PCB footprints, and 3D mechanical models for millions of manufacturer’s parts. This content is compatible with over 20 PCB design formats.

Learn more and join the SnapEDA Syndication Network at

About SnapEDA

SnapEDA helps engineers design electronics faster by removing barriers. Over one million electronics engineers and PCB designers use its search engine for electronics design each year, creating everything from medical devices to automotive electronics. By providing ready-to-use building blocks for design, including symbols and PCB footprints, its library shaves days off product development, allowing designers to focus on optimization and innovation. SnapEDA’s models are created using proprietary and patented creation, verification, and translation technology. Learn more at

Smaller circuits with greater functionality are possible with the advanced circuit materials developed by Isola Group and being shown at the PCB West 2022 Exhibition on Wednesday, October 5, 2022 at the Santa Clara Convention Center in Santa Clara, CA. Combining laminate and prepreg materials optimized for power, RF/microwave, and high-speed-digital (HSD) circuits results in miniaturized and efficient multilayer mixed-signal assemblies that can fit the tightest places and provide the high performance and diverse functionality needed for modern electronic products. Isola’s representatives will offer guidance on the most effective use of their materials, whether for high-volume commercial applications or aerospace and defense (A&D) systems chasing reduce size, weight, and power (SWaP) requirements.

For more than 30 years, the PCB West Conference & Exhibition has linked suppliers and users of printed-circuit-board (PCB) materials. The 2022 edition features the one-day exhibition as well as a highly educational conference scheduled from October 4-7, 2022 aimed at both designers and manufacturers of analog, digital, and hybrid mixed-signal PCBs. More than 2500 visitors are expected to attend the one-day exhibition to gather information from more than 100 exhibitors. Isola Group has reserved Booth #XX on the PCB West 2022 exhibition floor.

With manufacturing facilities in Europe, Asia, and multiple sites in the U. S., Isola is truly a global circuit material developer and manufacturer offering assurance of consistent and dependable supply chains. Backed by robust design and manufacturing service capabilities, the company is constantly evolving and enhancing its product lines for greater ease of manufacturing even for hybrid, mixed-signal designs, employing straightforward baseline FR-4 manufacturing processes for many of its circuit materials. Laminate and prepreg materials cover a wide range of applications spanning aerospace and defense, automotive and transportation, communications, computing, industrial, medical, RF/microwave, and test and measurement systems.

Isola materials at the PCB West 2022 Exhibition include circuit materials that are designed to be used together in hybrid mixed-signal circuits but also to be processed tother with well-established methods, such as material processes used for FR-4. Examples include lead-free-compatible (RoHS-compliant), standard-loss 370HR materials and I-Tera® MT40 low-loss materials for higher-frequency circuits. Based on a patented, multifunction epoxy-resin formulation, 370HR materials support compact circuit designs with high-density interconnections while delivering high thermal reliability from -55 to +125°C. It has a typical dielectric constant (Dk) of 4.17 through the thickness (z-axis) at 1 GHz, decreasing lightly with frequency to 3.92 at 10 GHz. 370HR materials exhibit standard loss, with dissipation factor of 0.0161 at 1 GHz and 0.0250 at 10 GHz

For multilayer circuits requiring lower loss at higher frequencies, I-Tera® MT40 circuit materials has lower Df of typically 0.0028 at 2 GHz and 0.0035 at 10 GHz, with typical Dk through the z-axis of 3.45 at both 2 and 10 GHz. Its thermal characteristics are like those of 370HR, and it can be transformed into PCBs with standard FR-4 manufacturing processes. For extremely low loss at higher frequencies and in HSD circuits, Astra® MT77 has Dk of typically 3.00 at 2 and 10 GHz which remains at that value even with large swings in temperature. It has low Df of 0.0017 at 2 and 10 GHz and is manufactured with the same FR-4-like processes applied to 370HR and I-Tera MT40 materials.

These are several examples of the manufacturing-process-compatible circuit materials on display at the Isola booth at the PCB West 2022 Exhibition. The materials are available as laminates with a wide selection of copper weights and as prepregs, as dielectric materials without metallization. Compatible with FR-4 manufacturing processes, the materials maintain consistent performance across operating temperatures from -55 to +125°C with the high interconnect density needed tor modern circuit miniaturization. For more information about any of these materials, please see Isola at the PCB West 2022 Exhibition on October 5, 2022 or visit the Isola website at

About Isola

Isola Group ( is a leading global developer and supplier of advanced electronic circuit materials for high-voltage, high-power, high-speed, and high-frequency PCBs. By performing ongoing R & D on emerging circuit applications, such as military radar and EW systems, commercial 5G communications networks, and vehicle electronification, and operating a network of global factories, Isola provides cost-effective, high-performance solutions for the most challenging electronic single-layer and multilayer PCB applications.

Auction to Feature Printed Circuit Board Manufacturing Equipment & Plant Support Equipment

Scarborough, Ontario Canada –Surplus Solutions, LLC a Global Industrial Auction Company, in conjunction with Infinity Asset Solutions will conduct A Major Online Auction to sell the assets of Milplex Circuit Canada, Inc. located at 70 Maybrook Drive, Scarborough, (Toronto) Ontario Canada.

Milplex Circuit (Canada), Inc. was an industry leader in the fabrication of thermally conductive Printed Circuit Boards. They had the expertise to fabricate single sided, double side, multilayer, and sequential lamination multilayer thermally conductive constructions. Milplex also provided aluminum copper backed or aluminum and copper core solutions. The Online Auction will open on Monday, October 17th, 2022 and will begin closing on Thursday, October 20th, 2022 at 11:00 AM EST. There will be a preview & inspection open to the public on Monday, October 17th from 9:00 a.m. - 4:00 p.m.

Featured items will include:

• 2008 Orbotech Model Discovery 8000 AOI

• 2010 Camtek Model Orion 860 AOI/ Inner & Outer Layer Inspection

• Mania Vertical Flying Probe Testers

• (4) Multiline Post Etch Auto Artwork Punches

• (10) Excellon & Hitachi CNC Drilling & Routing Machines

• OEM & TMP Lamination Press Machines

• Accuscore AS-200 CNC & AS 150 JN Scoring Systems

• Wet Process, Plating Lines, Solder Mask Equipment

• (8) Olec & ORC Single & Double Sided Exposure Units

• Plant & Facility Support, Spare Parts, Ovens, 2018 Air Compressor, Tools, Racking

• Much More, Invenory, Raw Material, Over 350 Lots

According to Jason Hayne Vice President at Infinity Asset Solutions “the Milplex Circuit Canada Online Auction will provide buyers a unique opportunity to purchase Printed Circuit Board Manufacturing Equipment & Plant Support Assets at a reduced cost with no delays. All of the assets are available immediately with no supply chain issues or any delays. The 50,000 Sq Ft Facility is packed with Printed Circuit Board manufacturing equipment as well as a large quantity of plant support Assets”.

Auctioneer accepting Pre Auction offers on major equipment. All interested parties can find full auction details including equipment listings, photos, videos, lot catalog, and bidding instructions (Create Hyper Link Here)

About: Surplus Solutions, LLC is a recognized leader in surplus industrial machinery and equipment auctions and valuations. Our certified and experienced auctioneers and appraisers value and sell business equipment, entire manufacturing plants, complete warehouses, real estate or intellectual property (IP) across a diverse array of industries. (


Surplus Solutions, LLC

Seth Tavares, 401-526-0051

Director of Marketing

This email address is being protected from spambots. You need JavaScript enabled to view it.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

Wilmington, Del. Sept. 15, 2022 – Today DuPont announced the launch of a new brand, Micromax™, that will encompass the products formerly under the Microcircuit and Component Materials brand. Micromax™ products are used in a wide variety of electronics applications—from automotive, passive components, and 5G communications to healthcare and consumer goods.

“Micromax™ aims to be the leading brand for electronic thick film inks, pastes, and ceramic tapes,” said Tim Chang, Micromax™ global business leader. “The new brand name won’t impact our offerings or how we work with customers. Our high-quality products, exceptional customer service, and broad-based expertise remain the same. It will simply be faster and easier to identify our offerings.” Micromax™ organizes nearly 800 products under a single cohesive brand, simplifying how distributors and customers can identify and specify their preferred products. The changes include:

• GreenTape™, which will now be known as Micromax™ GreenTape™

• Heatel™, which becomes Micromax™ Heatel™

• Intexar™ which becomes Micromax™ Intexar™

• Fodel™ which becomes Micromax™ Fodel™

Because they’re tailored in close partnership with clients, Micromax™ products enable extremely customized solutions. With extensive knowledge of materials science and a breadth of electronics experience, the Micromax™ team helps customers imagine what others don’t, test what others can’t, and deliver true innovation that can positively change markets and improve our world.

To learn more about Micromax™, please visit

About Micromax™

Micromax™ is a leading brand of printable, stretchable, and moldable functional thick film inks, pastes and ceramic tapes. Micromax™ brand products are utilized for circuitry, interconnection and packaging of electronic devices in automotive, passive components, telecom, consumer electronics, healthcare and military applications featuring properties such as enhanced circuit density, improved thermal management, higher reliability and other critical functionality. Micromax™ represents over 60 years of experience in the development, manufacture and sale of specialized electronic materials, and offers leading global customer support and product quality and consistency.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

WILMINGTON Del., September 22, 2022 – DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced today a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.

Integrating Pyralux® AP copper clad laminate into eMPack® traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. The characteristics of Pyralux® AP benefiting this application from Semikron-Danfoss include:

• Robust thermal resistance for temperature stability

• All-polyimide dielectric layer

• Extreme durability

• Excellent bond strength for automotive-grade reliability

• Excellent low dissipation loss characteristics

• Superior electrical performance

• Consistent signal integrity

Further, Pyralux® AP’s dielectric thickness tolerance and low coefficient of thermal expansion make it ideal for rigid flex or multiple layer flex applications. The adhesive-less flexible circuit material has a flammability rating of UL 94-V0, a maximum operating temperature of 200°C, and is certified to IPC 4204A/11.

"Pyralux® AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack® is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux® technology to help eMPack® become a global leader in EV power modules.”

Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack® power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD).

“We are excited how this EV power module application of Pyralux® AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack® power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack® and appreciate the collaboration with Semikron-Danfoss.”

About DuPont Electronics & Industrial

DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products, and technical service to enable next-generation technologies.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

BANNOCKBURN, Ill., USA, September 21, 2022 – IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper-clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully re-qualified their products to IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. TUC first achieved QPL status five years ago for 18 products covering IPC specification sheets 102, 126, 130 and 134.

TUC met or exceeded the IPCs Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at

“In the 1970s, 1980s, and 1990s, having a product posted on the Qualified Product List (QPL) for the USA Military Standard MIL-S-13949 meant that the company met the highest standards for production and quality,” said George Hsin, chief strategy officer, Taiwan Union Technology Corporation. “PWB suppliers made this QPL their first screen when selecting base materials. The facilities and the products on the QPL were trusted by the entire electronics supply chain. At TUC, we were happy to see the QPL concept brought back by IPC five years ago to their base materials standard IPC-4101. TUC is also excited to be the first copper-clad laminate and prepreg manufacturer in the world to pass the qualification testing program at an independent test laboratory for a second time.”

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes that conform to IPC standards.

“TUC has differentiated itself from the competition by demonstrating its commitment to the highest level of quality,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize TUC as a member of the trusted IPC-4101 QPL suppliers.”

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

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