In-Mold Electronics (IME) will one day become a well-established process with a well-developed ecosystem and a mature, easy-to-use design-to-product workflow. This process will become the basis of many novel structural electronic designs and products. This art-to-production platform transformation will take further time. It is often asked when and how this will happen. In this article, Dr Khasha Ghaffarzadeh, Research Director at IDTechEx, will share some insights and analysis. This analysis is drawn from the IDTechEx report, In-Mold Electronics 2019-2029: Technology, Market Forecasts, Players, which is the result of years research into IME or associated technologies such as inks, pick-and-place, printing, and so on.
(Waterbury, CT USA) - February 17, 2020 – MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 3-5, 2020.
Southington, CT. Feb. 18, 2020. Uyemura National Sales Manager Mark Eonta has announced the appointment of Troy McNulty as Midwest Technical Sales Manager for a high-activity sales region that includes Minnesota, Wisconsin, Illinois and Michigan.
BANNOCKBURN, Ill., USA, February 17, 2020 — IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts for IPC E-TEXTILES 2020, to be held September 29-30, 2020 at the University of Minnesota Coffman Memorial Union in Minneapolis, Minn.
BANNOCKBURN, Ill., USA, February 14, 2020 — IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
VANCOUVER, BC / ACCESSWIRE / February 13, 2020 / Vancouver, BC, February 13, 2020, EnviroLeach Technologies Inc. (the "Company "or "EnviroLeach"), (CSE:ETI) (OTCQB: EVLLF) (FSE:7N2) is pleased to announce it has completed preliminary lab-scale testing on the recovery of tin metal from printed circuit board (PCB) material.