LAKE FOREST, CA – Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, has promoted longtime employee Chris Hunrath to Chief Operating Officer (CTO).
Insulectro President and CEO Patrick Redfern made the announcement, “For many years, Chris Hunrath has been a visible, trusted technical voice across the business and markets Insulectro serves, engaging daily with customers, suppliers, and OEMs that power the North American electronics market. I am pleased to announce his promotion from Vice President of Technology to CTO.
“Chris is relentless about educating the industry on current and leading-edge technologies, from materials to design best practices through seminars, conference sessions, and customer enablement programs. He has been instrumental in introducing and scaling advanced technologies and partnerships with fabricators and OEMs helping activate new materials ecosystems and distribution relationships that expand what our customers can build.”
Ken Parent, Chief Operating Officer, agrees, “Chris embodies our mission: real depth of technical knowledge, customer obsession, and the courage to push the industry forward. This promotion recognizes his daily impact and the trajectory he’s setting for our company and customers.”
In his new position, Hunrath will lead Insulectro’s technology strategy across Printed Circuit Board (PCB), UHDI and Substrate, and Printed Electronics markets. He will remain based in Insulectro’s San Jose branch facility.
Hunrath commented, “It’s a great honor to take on the responsibilities of CTO for Insulectro. Our industry is evolving rapidly, and new technologies require new materials and a thorough understanding of how to deploy them for maximum benefit. I look forward to continuing my engagement with customers, OEMs, designers, and supplier partners to help them create the best microelectronics possible. It’s a great time to be at Insulectro.”
Freudenstadt, Germany – Sept. 25th, 2025 - SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI). The AI revolution is reshaping the semiconductor landscape. Global industry analysts project a compound annual growth rate (CAGR) of around 10% for the semiconductor and Advanced Packaging sector over the next 5 years. Market leaders such as TSMC and NVIDIA are driving innovation in chipmaking and pushing for new Advanced Packaging strategies.
At the same time, the tradionell PCB industry is projected to grow at an 8% CAGR, with the strongest momentum in AI server boards (CAGR of about 20%). IC-Substrates are expected to expand with a 15% CAGR, propelled by miniaturization trends and the need for new interconnect technologies.
SCHMID expanded its Equipment Portfolio
To address these growth markets, SCHMID has broadened its InfinityLine product family:
The existing InfinityLine H+ remains SCHMID’s top-selling equipment and continues to grow strongly in line with the market.
The existing InfinityLine V+ meets the demands for increasingly complex high-end PCBs. • The new InfinityLine C+ is on the way to becoming SCHMID’s second-largest revenue contributor.
The new InfinityLine L+, a Chemical Mechanical Planarization (CMP) solution for panel-level substrates and
The new InfinityLine P+, SCHMID’s next-generation single panel plating equipment, both to be launched in late 2025, are required to realize next generation substrate and AI-Server-PCB requirements.
With the existing product lines and the newly developed and introduced production equipment, SCHMID is positioned as a leader in enabling next-generation package substrates and AI-server PCBs with a now even broader product portfolio.
Enabling Next-Generation Substrates
Beyond the InfinityLine product family, SCHMID is driving technology leadership with:
SCHMID ET-Board technology, supporting Cu-damascene manufacturing at panel level to deliver miniaturization at scale.
As AI companies increasingly demand Chip-on-Wafer-on-PCB (CoWoP) solutions, SCHMID is uniquely positioned to deliver best-in-class yield and the lowest cost of ownership across the industry.
Strong Outlook
With its expanded product portfolio and strong positioning in high-growth markets, SCHMID expects 2025 to remain a transition year. From 2026 onwards, the company anticipates above-market growth, particularly with its AI-driven product lines. These segments are projected to deliver disproportionate growth in 2026 and 2027, establishing themselves as the primary drivers of SCHMID’s overall revenue expansion.
Executive Statement
“The AI era is fundamentally transforming the electronics and semiconductor industries. SCHMID is proud to provide the critical technologies that enable glass core substrates, panel-level Cu damascene, and manufacturing solutions for next-generation AI-server boards. With our expanded InfinityLine portfolio, we are ready to lead this transformation together with our customers”, said Christian Schmid, CEO of SCHMID Group.
WESTFORD, MA, USA, September 4, 2025 – Zuken Inc. (President: Katsube Jinya, hereinafter “Zuken”) has joined "JOINT3" consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers.
Based on Zuken’s track record and expertise as an EDA vendor supporting customers in advanced packaging design, we participate in the practical implementation of next-generation semiconductor packaging design, manufacturing, and verification with panel-level organic interposers in JOINT3. And Zuken contributes to the establishment of optimal design and manufacturing process by developing tools and features to solve issues that emerge in the process.
In recent years, packaging for back-end processes has emerged as a key technology in the field of next-generation semiconductors. This includes 2.xD packages, whereby multiple semiconductor chips are arranged in parallel and connected via interposers, demand for which is expected to grow in line with the need for increased data communication capacity and speed. As semiconductor performance improves, interposers are becoming larger, and there is a shift from silicon interposers to organic interposers made from organic materials.
Conventional manufacturing methods involve cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of them that can be obtained from a single wafer decreases, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular wafer shapes to square panel shapes is gaining attention, as it allows for an increased number of interposers to be produced from a given area of wafer.
Zuken has participated in various 2.5D and 3D package design, manufacturing, and verification projects, in addition to providing customers with advanced package design environments. Throughout the course of these projects, we have a proven track record in supporting the design and tool development for various technologies such as Chip stacking, Organic Package stacking, and various interposers. These experiences and technologies are consolidated into the CR-8000 Design Force's 2.5DIC/3DIC design and verification features, and the SoC/package/PCB collaboration design environment.
In JOINT3, Zuken engages in the practical implementation and validation of next-generation semiconductor packaging design and manufacturing using panel-level organic interposers. In addition to verifying the physical structure design and electronics design, Zuken is also planning to develop new functions such as preliminary verification in the design stage that takes into account the physical properties and chemical characteristics of various materials.
By collaboration and co-creation with other JOINT3 members, Zuken contributes to the evolution of design, manufacturing, and verification process for the next-generation semiconductor packaging with panel-level organic interposers. And Zuken aims to play a key role in the next-generation ecosystem and supply chain.
Overview of JOINT3
Name
JOINT3 (JOINT:Jisso Open Innovation Network of Tops)
Objectives
Accelerate the development of materials, equipment, and design tools optimized for panel-level organic interposers through co-creation with participating companies.
Participating Companies (listed in alphabetical order)
Hitachi High-Tech Corporation, JX Advanced Metals Corporation, Kao Corporation,
Lam Research Corporation, LINTEC Corporation, MEC COMPANY LTD., Mitutoyo Corporation,
NAMICS Corporation, Nikko-Materials Co., Ltd., OKUNO CHEMICAL INDUSTRIES CO., LTD.,
Synopsys, Inc., Tokyo Electron Ltd., Tokyo Ohka Kogyo Co., Ltd., TOWA Corporation, ULVAC, Inc.,
Ushio Inc., ZUKEN Inc., 3M Company
Location
Advanced Panel Level Interposer Center “APLIC”
(Yuki City, Ibaraki Prefecture, Japan (within the Resonac Shimodate Plant (Minami-yuki)))
Packaging Solution Center
(Kawasaki City, Kanagawa Prefecture, Japan)
Activities
Developing materials, equipment, and design tools for organic interposers using a panel-level (515 x 510 mm) prototype production line
Promoting development through co-creation by having material and equipment manufacturers produce common prototypes
Utilizing JOINT3 as a “training ground” for technology and equipment manufacturers to further enhance technologies related to panel-level organic interposers
DOVER, DE – September 2025 – Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, will hold its first-ever Spanish-language webinar tailored to the Mexican market. The online session, “How to optimize electronic component purchases and save costs,” will take place on September 5, 2025 at 1 PM EST, and will run for approximately 45 minutes.
The session will be hosted by Roberto J. Cantero of Luminovo and will feature Victor H. Madero, CEO & Founder of SMTVYS, as the guest speaker. Together, they will share strategies to centralize electronics purchasing data and maximize pricing efficiency. Attendees will discover how to achieve up to a 200% increase in purchasing efficiency and cut annual component costs by as much as 10%.
Key topics include:
Electronics Supply Chain Trends – Insights into the latest industry shifts and approaches to tackle a rapidly changing market.
Solutions for 2025 – Proven strategies and innovative methods to manage growing complexity and volatility.
Proactive Risk & Cost Management – Leveraging real-time data—covering compliance, lifecycle tracking, availability, and pricing—to drive savings and resilience.
The session will conclude with an introduction to Supply Chain Intelligence, showing how to transition toward a more data-driven, agile electronics procurement model. The webinar is ideal for EMS providers and OEMs with substantial electronics content—especially procurement, strategic sourcing, costing engineers, and supply chain managers.
This event marks a milestone in Luminovo’s regional engagement, offering localized expertise in Spanish tailored to the needs of the Mexican electronics industry.
ICZOOM Group Inc., a leading B2B electronic component e-commerce platform, has announced the introduction of its integrated printed circuit board (PCB) manufacturing and surface mount technology (SMT) assembly services at the IIC Shenzhen 2025. This announcement was made during the International Integrated Circuit & Component Exhibition and Conference held from August 26-28, 2025, at the Shenzhen Convention & Exhibition Center.
This strategic move signals ICZOOM's expansion beyond electronic component distribution, creating a more comprehensive profit model and service offering. The company's new services include a full-process suite—ranging from electronic component procurement, customs declaration, and smart warehousing to PCB manufacturing and SMT assembly, specifically designed to support small and medium-sized enterprises (SMEs).
By partnering with high-quality manufacturers, ICZOOM aims to leverage its industry relationships to execute a capital-efficient expansion without significant upfront investments. This allows the company to enhance its existing one-stop order fulfillment services, strengthening its supply chain solutions for SME customers who often face challenges managing fragmented supply chains and multiple vendor relationships.
The launch at the high-profile IIC Shenzhen 2025 positions ICZOOM to capture additional revenue streams beyond its traditional component sales, potentially increasing its service offerings to include design, manufacturing management, and assembly services.
Founded in Shenzhen, China, ICZOOM Group Inc. continues to cater to the needs of SMEs in the consumer electronics, Internet of Things (IoT), automotive electronics, and industry control segments, with a focus on providing transparent and efficient e-commerce solutions for electronic component products.
Eltek Ltd., a global manufacturer of printed circuit boards, has received a $2.4 million order from a leading Israeli defense company. The products will be delivered mainly in 2026 and 2027 and are critical components in the customer's systems, requiring advanced technological capabilities. This order is a continuation of previous supplies to the same customer.
Eltek Ltd. (NASDAQ: ELTK), a global manufacturer of printed circuit boards (PCBs), has received a significant order worth $2.4 million from a leading Israeli defense company. The order, announced on August 25, 2025, is set to be delivered primarily in 2026 and 2027. The products are critical components that require advanced technological capabilities, and this order is a continuation of previous supplies to the same customer [1].
Eltek specializes in the manufacture and supply of complex and high-quality PCBs, including HDI, multilayered, and flex-rigid boards, catering to high-end markets such as defense, aerospace, and medical industries. The company's headquarters and R&D center are located in Israel, with operations extended through subsidiaries and distributors in North America and various other regions [2].
The CEO of Eltek, Eli Yaffe, commented on the order, stating that the products have been previously supplied to the same customer. This indicates a strong, established relationship and a high level of trust between Eltek and the defense company. The order highlights Eltek's ability to meet the advanced technological requirements of the defense sector, which is critical for the integration of PCBs into sophisticated defense systems.
Eltek's order book continues to grow, reflecting the company's strong market position and technological expertise. As a global player in the PCB industry, Eltek's focus on innovation and high-quality products is evident in its ability to secure such significant orders from leading defense companies. The company's certifications, including ITAR compliance, AS-9100, and NADCAP electronics, further underscore its commitment to quality and reliability.
For more information about Eltek Ltd., visit their website at www.nisteceltek.com.
