As electronic systems demand higher power and improved thermal performance, heavy copper PCBs have become essential for high-current, high-reliability applications across industries.
San Francisco Circuits latest capabilities page on heavy copper outlines how increased copper thickness enhances current capacity, thermal conductivity, and mechanical strength in demanding environments.
Why Heavy Copper Matters
By utilizing copper weights from 4 oz to 10 oz per square foot, heavy copper PCBs support higher current flow, improved heat dissipation, and greater structural durability compared to standard designs.
Key Advantages:
Current Carrying Capacity – Supports high current with minimal voltage drop.
Thermal Management – Reduces heat buildup for better reliability.
Mechanical Strength – Resists warping and cracking under stress.
Design Efficiency – Enables smaller, more efficient layouts.
Advanced Heavy Copper Production Capabilities
San Francisco Circuits offers fast-turn fabrication and assembly for complex heavy copper builds, including:
Copper plating up to 10 oz/ft²
Integrated thermal vias and heatsinks
Sequential lamination for multilayer designs
Lead times as quick as 72 hours for bare boards
From defense and aerospace to industrial power and automotive systems, heavy copper PCBs deliver the performance needed for today’s high-power electronics. Read more on Heavy Copper PCBs on the San Francisco Circuits website.
Mulino, OR — October 15, 2025 — ASC Sunstone Circuits, a leading U.S. PCB manufacturer, today announced a significant expansion of its OneQuote online quoting tool, giving design engineers more control over complex PCB configurations — making it easier for the quote team to quickly clarify and verify specifications, reducing delays from manual quote reviews. With the enhanced OneQuote platform, engineers can now customize advanced PCB manufacturing options directly within the quoting interface, giving the quote team the information they need to confirm specs early.
Engineers can now choose from these new options:
Silkscreen Color Options: Choose from green, red, blue, orange, and purple for better visibility and branding.
Surface Finishes: ENIPIG, Immersion Tin, Bare Laminate, and OSP now available.
Panelization (Route w/ Score): Optimize manufacturing with greater accuracy in panelized layouts.
Hole Quantity & SMD Count: Drill complexity and component density.
Minimum Pitch: Precision design parameters defined directly in the quote.
Via Plug Options: Soldermask filled, non-conductive epoxy, and conductive fills now selectable.
Back Drill & Etchback: High-speed signal integrity features.
Copper Plating in Holes (1.5 mils): Enhanced conductivity and reliability.
Hi-Pot Testing: Compliance and safety testing now part of the instant quote.
Controlled Dielectrics & Cores Under 4 mils: High-frequency design support with clear specification visibility.
Opt Out of Notes: Limit holds and reduce delays where the print notes don’t apply to your build.
Accurate Quotes. Greater Clarity.
Advanced PCB builds require extra dialog with a quoter and engineering team to confirm complex requirements. With this release, those details can now be captured directly in the quoting tool—providing the detail our team needs from the start to provide more precise and timely quotes. “One of the biggest challenges in PCB quoting has been making sure non-standard requirements are clearly understood,” said Matt Stevenson, VP of Sales & Marketing at ASC Sunstone Circuits. “Our enhanced OneQuote tool allows engineers to capture those advanced specifications directly in the system. This gives our quoting team the clarity they need up front, ensuring greater accuracy and consistency from quote to production.”
Whether it’s a standard 2-layer board or a high-speed, impedance-controlled design, engineers can still move from concept to confirmed order in minutes—all from the Sunstone website.
About ASC Sunstone Circuits
ASC Sunstone Circuits has been a reliable source for U.S.-based PCB manufacturing for over 55 years. The company offers a full range of PCB solutions—including rigid, flex, and assembly-ready options—tailored to meet the needs of engineers and product developers working on everything from quick-turn prototypes to full production runs. Known for its consistent lead times, responsive service, and long-standing commitment to innovation, ASC Sunstone plays a key role in the American electronics manufacturing landscape.
Hillsboro, OR – October 10, 2025 – The Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking. Registration is now open at www.nedme.com.
While NEDME has long been the region’s go-to event for electronics design and PCB manufacturing, it has expanded in recent years to feature a wider range of advanced manufacturing companies—from materials and automation to prototyping and supply-chain partners.
“This expo is about celebrating and strengthening the Pacific Northwest’s innovation ecosystem,” said Kelly Atay, NEDME Board Member. “It’s not just for electronics companies. Local manufacturers, educators, students, and community leaders all have a place here. NEDME is where connections are made that lead to real growth.”
Who should attend
Local businesses & manufacturers seeking new suppliers, technologies, and partners
Engineers & designers looking for practical design-for-manufacturing insight
Educators & students exploring STEM and advanced manufacturing career paths
Entrepreneurs & startups connecting with resources for product development
Community & workforce leaders supporting the future of regional industry
Event highlights
Exhibit Hall: Dozens of exhibitors spanning electronics and advanced manufacturing
Tech Sessions & Panels: Real-world, vendor-neutral talks from experts
Career & Education Corner: A bridge between students and employers
Networking: Opportunities to connect across the supply chain and workforce pipeline
Keynote Speakers: Jim Clarke/Intel Corp & Lupita Maurer/Polar Instruments
Last minute booths still available: This email address is being protected from spambots. You need JavaScript enabled to view it.
About NEDME
The Northwest Electronics Design & Manufacturing Expo (NEDME) is the Pacific Northwest’s longest-running showcase for design and manufacturing innovation—connecting businesses, educators, and community partners to strengthen regional supply chains and workforce development. Learn more at www.nedme.com.
TEWKESBURY, UK – Pulsonix™ (www.pulsonix.com), the Electronic Design Automation (EDA) company delivering technology-leading PCB design solutions, is proud to announce the launch of Pulsonix 14.0, its latest PCB design software platform. This update further strengthens simulation and brings significant enhancements in mechanical-electrical 3D integration, smarter comparison tools, and enhanced usability features - all designed to help Pulsonix reaffirm its commitment to providing engineers with high-performance tools to meet the demands of increasingly complex electronics systems.
Pulsonix 14 introduces PulsonixSim, the new simulation option is built on the ngspice engine and tightly integrated into the Pulsonix schematic environment. It allows designers to attach models, place stimuli and run mixed-mode SPICE analysis, including transient, AC, DC, Monte Carlo, noise, transfer functions, and more - all without leaving the design environment and utilising the same library used for design and PCB layout. Simulation results can be plotted to full screen graph windows or local 'in-design' graphs.
3D Flexi Bend & Clipping Plane Enhancements
A new "lift-off" state for Flexi bend regions allows the flexible portion of the board to originate inside existing boundaries rather than exiting the board edge. The bend region transforms adaptively based on bend-radius parameters.
Additionally, a 3D clipping plane feature lets users selectively hide parts of the design along X, Y or Z axes (and reverse clipping direction) to inspect internal layers or buried elements more effectively.
Interactive HTML BOM & Graphical Comparison Tools
Pulsonix 14.0 supports the Interactive HTML BOM option that exports design and BOM data into a searchable, browser-friendly HTML format.
The Symbol / Footprint Compare and Design Revision Analyser tools highlight differences between design versions or symbols, either in dialog view or using overlaid graphics with dimming/lowlighting.
Usability Upgrades & Window Workflow
The user interface sees multiple enhancements: tear-off windows, dock bars, “find in dialog grids,” and faster category switching to streamline navigation and reduce friction when working with large designs or complex dialogs.
Circular Hatching Style
Pulsonix 14 adds a circular hatching style alongside traditional linear hatching. Circular hatching reduces sharp corner effects during etching, which helps minimise impedance variation for tracks adjacent to hatched copper zones
Major Update to Scripting and Automation
Version 14.0 replaces the legacy ActiveX automation system with a completely re-engineered, modern scripting framework developed in-house by Pulsonix. The new scripting environment provides greater flexibility, improved security, faster execution, and direct access to more Pulsonix objects and functions. Users can now automate complex design operations, customise workflows, and build bespoke productivity tools using industry-standard scripting languages.
Vault Integration & Version Control Enhancements
Vault improvements in Version 14 include visual thumbnail previews of items, “synchronise selected items” folder path alignment, definable permissions, Spice Model and Formal files in Vault and type-specific revision naming schemes - helping design teams maintain data integrity and traceability.
“Version 14.0 represents our commitment to evolve Pulsonix in step with real user needs,” said Bob Williams, marketing director. “By deepening simulation, enhancing 3D inspection, and refining workflows, we believe 14.0 gives engineers a more powerful, cohesive tool - helping them to confidently deliver complex, high-performance electronics designs.”
Pulsonix Version 14.0 is available now. Learn more about the new features and enhancements, by visiting www.pulsonix.com/latestversion or by visiting us at the PCB Carolina exhibition, November 12 in the McKimmon Center at NC State University, NC, USA.
LAKE FOREST, CA – Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, has promoted longtime employee Chris Hunrath to Chief Operating Officer (CTO).
Insulectro President and CEO Patrick Redfern made the announcement, “For many years, Chris Hunrath has been a visible, trusted technical voice across the business and markets Insulectro serves, engaging daily with customers, suppliers, and OEMs that power the North American electronics market. I am pleased to announce his promotion from Vice President of Technology to CTO.
“Chris is relentless about educating the industry on current and leading-edge technologies, from materials to design best practices through seminars, conference sessions, and customer enablement programs. He has been instrumental in introducing and scaling advanced technologies and partnerships with fabricators and OEMs helping activate new materials ecosystems and distribution relationships that expand what our customers can build.”
Ken Parent, Chief Operating Officer, agrees, “Chris embodies our mission: real depth of technical knowledge, customer obsession, and the courage to push the industry forward. This promotion recognizes his daily impact and the trajectory he’s setting for our company and customers.”
In his new position, Hunrath will lead Insulectro’s technology strategy across Printed Circuit Board (PCB), UHDI and Substrate, and Printed Electronics markets. He will remain based in Insulectro’s San Jose branch facility.
Hunrath commented, “It’s a great honor to take on the responsibilities of CTO for Insulectro. Our industry is evolving rapidly, and new technologies require new materials and a thorough understanding of how to deploy them for maximum benefit. I look forward to continuing my engagement with customers, OEMs, designers, and supplier partners to help them create the best microelectronics possible. It’s a great time to be at Insulectro.”
Freudenstadt, Germany – Sept. 25th, 2025 - SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI). The AI revolution is reshaping the semiconductor landscape. Global industry analysts project a compound annual growth rate (CAGR) of around 10% for the semiconductor and Advanced Packaging sector over the next 5 years. Market leaders such as TSMC and NVIDIA are driving innovation in chipmaking and pushing for new Advanced Packaging strategies.
At the same time, the tradionell PCB industry is projected to grow at an 8% CAGR, with the strongest momentum in AI server boards (CAGR of about 20%). IC-Substrates are expected to expand with a 15% CAGR, propelled by miniaturization trends and the need for new interconnect technologies.
SCHMID expanded its Equipment Portfolio
To address these growth markets, SCHMID has broadened its InfinityLine product family:
The existing InfinityLine H+ remains SCHMID’s top-selling equipment and continues to grow strongly in line with the market.
The existing InfinityLine V+ meets the demands for increasingly complex high-end PCBs. • The new InfinityLine C+ is on the way to becoming SCHMID’s second-largest revenue contributor.
The new InfinityLine L+, a Chemical Mechanical Planarization (CMP) solution for panel-level substrates and
The new InfinityLine P+, SCHMID’s next-generation single panel plating equipment, both to be launched in late 2025, are required to realize next generation substrate and AI-Server-PCB requirements.
With the existing product lines and the newly developed and introduced production equipment, SCHMID is positioned as a leader in enabling next-generation package substrates and AI-server PCBs with a now even broader product portfolio.
Enabling Next-Generation Substrates
Beyond the InfinityLine product family, SCHMID is driving technology leadership with:
SCHMID ET-Board technology, supporting Cu-damascene manufacturing at panel level to deliver miniaturization at scale.
As AI companies increasingly demand Chip-on-Wafer-on-PCB (CoWoP) solutions, SCHMID is uniquely positioned to deliver best-in-class yield and the lowest cost of ownership across the industry.
Strong Outlook
With its expanded product portfolio and strong positioning in high-growth markets, SCHMID expects 2025 to remain a transition year. From 2026 onwards, the company anticipates above-market growth, particularly with its AI-driven product lines. These segments are projected to deliver disproportionate growth in 2026 and 2027, establishing themselves as the primary drivers of SCHMID’s overall revenue expansion.
Executive Statement
“The AI era is fundamentally transforming the electronics and semiconductor industries. SCHMID is proud to provide the critical technologies that enable glass core substrates, panel-level Cu damascene, and manufacturing solutions for next-generation AI-server boards. With our expanded InfinityLine portfolio, we are ready to lead this transformation together with our customers”, said Christian Schmid, CEO of SCHMID Group.
