Oslo, Norway – 3 March 2021 - IDEX Biometrics ASA, a leading provider of advanced fingerprint identification and authentication solutions, has signed an agreement with Multi-Fineline Electronix, Inc. (MFLEX), a subsidiary of Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ), and a leading global provider of high-quality, technologically advanced flexible printed circuits and assemblies. The agreement forms a key part of IDEX’s mass production ready supply chain, essential to meet the growing demand for biometric payment cards.
Santa Clara, CA March 4, 2021 – Averatek Corporation has launched the A-SAP Community of Interest. This web-based content platform was developed as a central resource for the industry: so that all members of the supply chain - from designers to end users - can exchange information and insights about the A-SAP leading-edge PCB fabrication process.
BANNOCKBURN, Ill., USA, March 4, 2021 – In a letter to U.S. President Joe Biden, IPC applauds the Biden administration’s early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.
Company Invests Over $2 Million in New Equipment and Expands Building to Further Increase Speed of PCB Fabrication
DoD supply chain to benefit from Calumet Electronics’ SBA HUBZone designation
POWAY, Calif.--(BUSINESS WIRE)--Cohu, Inc. (NASDAQ: COHU), a global leader in back-end semiconductor equipment and services, today announced that it has commenced an underwritten public offering of 4,500,000 shares of its common stock.