Press Releases

DOVER, DE – Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, is set to exhibit at PCB East 2025 on Wednesday, April 30 at the Boxboro Regency Hotel and Conference Center in Boxborough, MA. Attendees will have the opportunity to experience how Luminovo’s innovative platform is transforming PCB manufacturing and trading operations by automating workflows, enhancing decision‑making, and streamlining quoting and procurement.

Luminovo’s comprehensive supply chain platform is designed to help PCB suppliers, EMS providers, and distributors operate more efficiently. By eliminating inefficiencies, automating critical processes, and bridging data silos, Luminovo empowers companies to make faster, smarter decisions in procurement and production. The AI‑powered software simplifies and accelerates the quotation process, enabling businesses to digitize operations and gain a competitive edge in the evolving electronics industry.

With a strong focus on the U.S. electronics industry, Luminovo is committed to bringing its collaborative supply chain platform to North American manufacturers. By centralizing data, automating processes, and enabling seamless collaboration, Luminovo helps companies eliminate spreadsheet headaches, reduce miscommunication, and embrace a new standard of efficiency. For more information, meet the team at PCB East or visit www.luminovo.com.

AURORA, CO - AdvancedPCB is proud to announce the appointment of Gary Stoffer as its new Chief Commercial Officer (CCO). In this role, Stoffer will lead all sales, marketing, and commercial strategy initiatives as the company continues its mission to deliver cutting-edge PCB solutions to industries worldwide.

Stoffer brings over 20 years of global leadership experience across industries like Medical Technology, Aerospace & Defense, Semiconductor and a range of diversified industrials. He's known for building scalable growth strategies, nurturing strong customer partnerships, and leading with a people-first mindset.

Stoffer's previous roles include senior executive positions at Bal Seal Engineering (A Kaman Company) and Dover Corporation, where he helped drive commercial success in EMS-focused markets both in the U.S. and abroad.

"We are excited to welcome Gary to the AdvancedPCB leadership team," said Greg Halvorson, CEO, AdvancedPCB. "His extensive global commercial experience, especially in medtech and advanced manufacturing, is a powerful asset as we scale operations and deepen relationships across key industries."

Stoffer holds a Bachelor of Science in Business Administration with a marketing emphasis from the University of Southern California and is a graduate of Dover's Executive Leadership Academy. He's also a certified instructor in the Wilson Learning Consultative Sales Process and has spoken at leading electronics and medtech conferences globally. This appointment reflects AdvancedPCB's continued investment in industry expertise, customer alignment, and strategic growth as a trusted U.S.-based partner to Aerospace, Defense, Medtech, and Industrial innovators.

About AdvancedPCB:

AdvancedPCB is a leading U.S. manufacturer of comprehensive printed circuit board solutions— offering turnkey design, fabrication, and assembly solutions across six U.S.- based factories, consistently faster than the industry standard. Our full-service solutions meet the unique demands of innovative PCB customers while providing best-in-class technical service at every touchpoint. With broad certifications supporting commercial and military work, AdvancedPCB's capabilities include HDI/UHDI, flex & rigid-flex circuits, design services, and turnkey assembled solutions. For more information, please visit www.advancedpcb.com.

CHINA - OurPCB, a leading provider of PCB manufacturing and assembly services, has developed a new line of aluminium-based printed circuit boards (PCBs) aimed at addressing the growing need for efficient thermal management in electronic devices. These aluminium PCBs are designed to dissipate heat effectively, offering a solution for applications where temperature control is crucial. Industries such as automotive, telecommunications, and consumer electronics stand to benefit from these advancements, as the demand for devices capable of performing under high thermal stress continues to increase.

Hommer Zhao, Owner of OurPCB, shared insights on the development of aluminium PCBs: "As electronic devices become more powerful, managing heat dissipation has become increasingly important. Aluminium PCBs provide a practical solution for controlling thermal build-up in a variety of applications. Our focus on developing these PCBs reflects the growing need for high-performance, reliable thermal management solutions, particularly in sectors that rely on high-density power systems and compact electronic designs."

Aluminium PCBs are a preferred choice in applications where heat needs to be managed efficiently, such as in LED lighting, power supplies, automotive systems, and telecommunications equipment. The material’s thermal conductivity allows for better heat dissipation than standard FR4 boards, making it an ideal choice for devices that generate significant heat during operation. By using aluminium as a base material, these PCBs help maintain optimal operating temperatures, extending the lifespan and reliability of the components they support.

The new line of aluminium PCBs developed by OurPCB is part of the company’s ongoing commitment to providing innovative solutions for industries facing complex thermal challenges. These PCBs offer several key advantages, including better heat resistance, durability, and overall performance in high-temperature environments. Additionally, the ability to integrate thermal management directly into the PCB design helps reduce the need for external cooling components, further enhancing the overall efficiency of the system.

"Our focus on aluminium PCBs is a direct response to the increasing demand for better thermal management in electronic devices," said Zhao. "As the industry moves toward more compact and powerful electronics, efficient heat dissipation is essential for maintaining performance and reliability. These PCBs provide a simple yet effective solution for improving the thermal performance of critical components, allowing businesses to create more reliable and efficient products."

In addition to offering aluminium PCBs, OurPCB continues to provide a wide range of services that support clients throughout the PCB development lifecycle. These services include PCB design, rapid prototyping, and turnkey PCB assembly. The company’s comprehensive service offering ensures that clients receive the support they need from the initial concept phase through to the final product, optimizing the design and manufacturing process for each unique application.

Looking forward, OurPCB plans to expand its research and development efforts to further enhance the thermal performance of its PCBs. The company is committed to exploring new materials and technologies that can offer even greater heat resistance and durability. This continued investment in innovation is part of OurPCB’s strategy to stay ahead of the evolving demands of industries where thermal management is a critical factor.

Zhao commented, “The development of aluminium PCBs is just the beginning of a broader effort to address the growing need for better thermal solutions in electronic systems. As power density in electronics continues to increase, the company is committed to continuing its work in this area, with a focus on expanding its range of thermal management solutions. Future advancements will build upon this foundation, ensuring that OurPCB remains at the forefront of PCB innovation for industries that require both high performance and reliable thermal control."

The company’s focus on aluminium PCBs also supports its broader goal of providing high-quality, reliable solutions for industries with demanding requirements. By incorporating advanced materials and design features, OurPCB ensures that its products meet the high standards expected by clients in sectors where performance under stress is essential.

For more information, OurPCB, a leading aluminium PCB manufacturer, can be reached at +86-199-30589219 or via email at This email address is being protected from spambots. You need JavaScript enabled to view it.. The company is located on the 3rd Floor, Nanhai Plaza, NO. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China.

AUSTIN, TX – Cetec ERP is excited to announce its participation at the Electrical Wire Processing Technology Expo (EWPTE) 2025, taking place May 6-8 at the Wisconsin Center in Milwaukee, WI. Attendees can visit Cetec ERP in booth 1347 to explore how its all-in-one platform helps manufacturers streamline operations, enhance quality management, and reduce costs.

As part of the event’s technical conference, Jordan Jolly, Director at Cetec ERP, will present a session titled "Integrating Internal Failure Tracking and Cost of Quality into Manufacturing Processes" on Wednesday, May 7 at 10:30 a.m. This session will provide valuable insights into tracking internal failures, optimizing cost allocation, and leveraging integrated ERP systems to improve profitability and quality management.

In manufacturing, understanding the Cost of Quality (CoQ) is essential for identifying inefficiencies and improving bottom-line performance. Jolly’s presentation will focus on the importance of tracking labor, finished goods material, and raw material costs associated with internal failures. By integrating real-time inspection failure tracking into ERP systems, manufacturers can visualize total material and labor costs, enabling data-driven quality improvements.

“With proper inspection and failure tracking, companies can gain actionable insights to reduce costs and enhance operational efficiency,” said Jordan Jolly, Director, Cetec ERP. “Our goal is to help manufacturers integrate CoQ principles seamlessly into their ERP systems for smarter decision-making.”

Manufacturers attending EWPTE 2025 are encouraged to visit Cetec ERP’s booth to learn how its fully integrated platform simplifies quality tracking, cost management, and production optimization. Cetec ERP provides an affordable, cloud-based solution that combines ERP, MES, QMS, CRM, MRP, and Accounting into a single, streamlined system tailored for modern manufacturers.

For more information, stop by Cetec ERP’s booth at EWPTE 2025 or visit www.cetecerp.com.

HANAU – Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled to take place May 6-8, 2025 in Nuremberg, Germany. Visitors can explore Heraeus Electronics' wide range of material solutions at Hall 6, Booth 6-310.

Among the highlights at PCIM will be the debut of DTS® Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost. The Heraeus Die Top System (DTS®) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS® enhances electrical and thermal conductivity, strengthens die connection reliability, and optimizes overall module performance. The innovative solution DTS® Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.

Heraeus Electronics will also showcase Condura®.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura®.ultra maintains outstanding reliability. Condura®.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (>80 W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.

Experts from Heraeus will deliver two insightful presentations at the e-Mobility & Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:

  • “Heraeus Electronics Introduces the Next Generation DTS®”
    • Speaker: Christian Kersting
    • Date & Time: May 6, 12:30 PM
  • “Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications”
    • Speaker: Oliver Mathieu
    • Date & Time: May 7, 12:55 PM

Heraeus Electronics will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials:

  • DTS® Silver – The innovative solution for cost-optimized, high-performance applications
  • Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
  • Condura®.ultra – A cost-effective, silver-free Silicon Nitride AMB for demanding applications
  • Live Presentation: May 6th, 11:00 PM and May 8th, 13:00 PM
  • mAgic PE360 – Pressure silver sinter paste for module attach applications
  • Live Presentation: May 6th, 14:00 PM
  • Fastlane – An EU-funded project accelerating the European value chain for power electronics
  • Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM

Heraeus Electronics invites attendees to visit Hall 6, Booth 6-310 to experience these solutions and more firsthand and engage with technical experts.

About Heraeus

The Heraeus Group is a broadly diversified and globally leading family-owned technology company, headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660. Today, Heraeus bundles diverse activities in the Business Platforms Metals and Recycling, Healthcare, Semiconductor and Electronics as well as Industrials. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership. In the 2022 financial year, the group generated revenues of €29.1 billion (US$30.6 billion*) with approximately 17,200 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets. (* calculated with 2022 average exchange rate, 1€ = 1.0530 US$)

About Heraeus Electronics

Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio - from materials and material systems to services.

WALTHAM, MA -- Nano Dimension Ltd., a digital manufacturing leader, today announced the appointment of Mr. Ofir Baharav as its new Chief Executive Officer, effective immediately. This strategic move underscores the Company's commitment to swiftly realizing merger synergies, restoring profitability, and delivering substantial shareholder value.

The Board of Directors, having worked closely with Mr. Baharav as Chairman, recognized his unique qualifications. Mr. Baharav has a proven track record in transformation and innovation, along with a deep background in capital equipment for the electronics industry and additive manufacturing, 3D printing technologies, making him the ideal candidate to lead Nano Dimension through this pivotal phase.

“Mr. Baharav’s proven ability to drive strategic change and operational efficiency is precisely what Nano Dimension needs at this critical juncture,” stated Robert Pons, Nano Dimension new Chairman of the board of directors, “His deep industry expertise and leadership will be instrumental in navigating the integration, achieving rapid profitability, and delivering significant value to our shareholders.”

Mr. Baharav brings nearly three decades of experience in capital equipment, spanning additive manufacturing and electronics. His prior roles as CEO of Maxify, VP Products at Stratasys, CEO at Xjet, EVP Products at Credence Systems, and President at Optonics, demonstrate a consistent pattern of driving strategic vision, technological innovation, cost optimization, and accelerated growth.

Driven by a passion to build disruptive manufacturing technology organizations, but also the capabilities to drive necessary transformation, Mr. Baharav has already stewarded significant changes since becoming Chairman on December 15th, 2024, including:

  • Strategic Realignment: Refocused R&D and sales on products and services where the Company can innovate, maintain long-term competitiveness, and partner with customers in the fabrication of high-value, high-performance applications.
  • Cost Reduction: Implemented immediate measures to reduce G&A expenses, which are expected to deliver over $20 million of fully annualized savings by year-end; with further reductions expected from post-merger operational consolidation
  • High-impact Negotiations: Successfully negotiated with CFIUS to remove restrictive limitations on post-merger cost reductions and synergy realization, enabling the company to achieve projected operational efficiencies.
  • Governance Enhancement: Initiated amendment proposals to the Articles of Association (pending shareholder approval) along with removal of poison pill to better align with shareholder interests, which reinforces transparency and accountability.
  • Operational Optimization: Streamlined and relocated field operations to enhance sales in the U.S. and China, improving market penetration and customer responsiveness.

Accountability and Transparency: Implemented comprehensive performance metrics and reporting systems, ensuring clear accountability and data-driven decision-making.

“We are confident that Mr. Baharav’s leadership will drive the rapid and decisive actions necessary to achieve profitability and refocus the company,” said David Stehlin, a Board Director, “His combined expertise in electronics and additive manufacturing is uniquely suited to our strategic direction, ensuring we capitalize on the significant opportunities ahead.”

The board wishes to thank Mr. Julien Lederman for his strong leadership and execution having stepped into the role of Interim CEO in the most challenging of times with both board and management completely afresh. As Nano Dimension’s Chief Business Officer, Mr. Lederman will be leading the corporate transformation with a strategic focus on post merger integration, communications, investor relations, along with spearheading a systematic operational planning and performance tracking framework to drive organizational excellence and accountability.

“It is a privilege to lead Nano Dimension in creating value for shareholders, working with a talented cohort of colleagues and partnering with industry leading customers. Nano Dimension, which now includes Desktop Metal and is expected to include Markforged, is composed of exciting opportunities to build an enduring digital manufacturing leader. Strategic integration efforts and transformations are underway, creating an exceptional company - one with a sustainable business model built upon innovative technologies focused on high value applications for digital manufacturing that will deliver financial results. I want to thank Mr. Lederman for his leadership during this time, and I look forward to working closely with him.”

Mr. Zivi Nedivi, President, and Mr. Tomer Pinchas, Chief Financial Officer and Chief Operating Officer are departing the Company. Mr. Baharav has resigned from the Board, while Robert Pons, a director since December 2024, becomes Chairman of the board.

About Nano Dimension

Driven by strong trends in onshoring, national security, and increasing product customization, Nano Dimension (Nasdaq: NNDM) delivers advanced Digital Manufacturing technologies to the defense, aerospace, automotive, electronics, and medical devices industries, enabling rapid deployment of high-mix, low-volume production with IP security and sustainable manufacturing practices.

For more information, please visit https://www.nano-di.com/.

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