China Silver Technology Holdings Limited has announced new procurement agreements with Shenzhen Zhengjiaxing Electronics Co., Ltd. and Shenzhen Xiaobai Assistant Technology Co., Ltd. to supply printed circuits and AI electronics products, respectively. These agreements align with the company’s strategy to diversify into higher-end products, generating stable income and enhancing innovation capabilities, thereby supporting sustainable growth and resource integration.
More about China Silver Technology Holdings Limited
China Silver Technology Holdings Limited, previously known as TC Orient Lighting Holdings Limited, is an investment holding company with major subsidiaries engaged in the manufacturing and trading of LED lighting and printed circuit boards (PCBs), including single-sided, double-sided, and multi-layered PCBs. The company is focused on developing business opportunities to enhance long-term growth and shareholder value.
LYON, FRANCE – Yole Group today announces the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC substrates, glass core substrates, substrate-like PCBs, and Embedded Die technologies.
After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is expected to reach $31 billion by 2030, driven by AI and HPC, as well as broader penetration into consumer, automotive, and defense segments….
Bilal Hachemi, PhD, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, comments: “This growth reflects sustained demand for larger, complex, high-ASP substrates capable of supporting generative AI, data center, and advanced package requirements, including finer interconnects, higher yield, and controlled lead times.”
ICEPT 2025, Shanghai: Ask for a meeting with our advanced packaging expert at, with Yik Yee Tan, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group. Contact: This email address is being protected from spambots. You need JavaScript enabled to view it.
Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
“Lincstech has been supporting the electronics industry with high quality Printed Wiring Boards for over 60 years and are proud to be a mainstay in the industry. We are privileged to play a key role in industries from Semiconductor Test, ensuring the functionality of electronic devices, to life-saving medical devices and beyond in rapidly growing segments such as AI,” said Eijiro Ikegami, President and CEO at Lincstech America Inc. “Lincstech is excited to join HDP User Group, especially as we are now a part of the Global Brands Manufacture (GBM) organization which is a member of the Passive Systems Alliance (PSA) group consisting of businesses producing Passive Components, Printed Circuit Boards, Electronic Manufacturing Services and IC Packaging. We look forward to working with HDP User Group and contributing to the advancement of PCBs and the greater electronics industry.”
“I am pleased to welcome Lincstech to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs and 3D substrates for high-speed computing and data systems will contribute significantly to our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
Taiyo Holdings Co., Ltd. announced a change in its Representative Director following a review of its management structure, as resolved in the recent Board of Directors meeting. This change, effective June 21, 2025, involves Hitoshi Saito assuming the role of President and Group CEO, while Eiji Sato becomes the Senior Corporate Executive Officer, indicating a strategic shift in leadership to potentially enhance the company’s operational efficiency and market positioning.
More about Taiyo Holdings Co., Ltd.
Taiyo Holdings Co., Ltd. operates in the chemical industry, focusing on the production and sale of materials for printed circuit boards and semiconductor packages. The company is listed on the Prime Market of the Tokyo Stock Exchange.
PARAMOUNT, CA – June 23, 2025 – Excellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).
John Strubbe, Plant Manager and Director of Operations at Innovative Circuits, commented on the installation: “Innovative Circuits is growing. We conducted a comprehensive review of the two current vendors we have on-site. A key requirement was a hybrid laser system that included both UV and CO₂ capabilities. After evaluating available solutions in North America using a scoring method I’ve applied throughout my career—based on technology, quality, responsiveness, delivery, and cost—it was clear that Excellon stood out.
What truly set the COBRA laser apart were metrics like MTBF (mean time between failures), consistency, and repeatability. With this system, we’ve reduced operating costs, eliminated production bottlenecks, and improved yields. However, the most significant factor was the lower and more transparent servicing costs. The COBRA helped us achieve the next level in PCB technology.”
Innovative Circuits, Inc. specializes in quick-turn, made-to-order fabrication of rigid-flex and complex rigid PCBs. The company is ITAR registered and ISO 9001:2015 certified, focusing on high-quality domestic manufacturing.
Mike Sparidaens, Vice President of Sales at Excellon, added: “The COBRA Hybrid Laser System is designed to handle the most demanding rigid and flexible circuit board designs. Renowned globally for its reliability and precision, the system is a perfect fit for Innovative Circuits. We've had a long-standing relationship with their team and are proud to support their continued growth with the installation of a second COBRA system.”
Excellon, a U.S.-based, employee-owned company, is a global leader in PCB drilling solutions. Its product lineup ranges from single- and multi-station mechanical drilling machines to advanced hybrid laser systems for precision via formation and routing. In 2024, Excellon opened a new state-of-the-art production facility in Paramount, California, underscoring its commitment to U.S. manufacturing and innovation.
MILPITAS, CA – FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $750,000. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by selected recipients to cover total project cost.
The RFP seeks proposals targeting FHE advances in the following areas:
Advanced Materials
Integrated Digital Twin Platforms for Multiscale, Multimaterial, Additive Electronics Manufacturing
System Integration, Reliability, and Standards for Scalable FHE and Additive Electronics Manufacturing
Restricted Open Topics
Market & Application Landscape Assessment
Process Development Kit for FHE
3D Geometry & Co-Design Tools
Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. See the FlexTech 2025 RFP for more details on the evaluation process.
White Paper Submissions
White paper submissions, the first step in responding to the RFP, are due July 14, 2025. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:
Rationale
Budget
Collaboration value
Dual-use (industry and military) applicability
Relevance to the FHE ecosystem
Schedules and milestones
Reasonable and stretch deliverables
Overall proposal quality
Request for Proposals Webinar
To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on June 24, 2025, at 10:00 a.m. PDT. A recording will be available for registrants unable to attend the event. Register for the webinar.
