Taoyuan, May 8, 2026 — As AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation. According to the latest report by the Taiwan Printed Circuit Association (TPCA) and the Industry, Science and Technology International Strategy Center of ITRI, the global copper-clad laminate (CCL) market is expected to exceed US$21.5 billion in 2026, driven by AI demand, with annual growth projected to reach 34.2%.
While Taiwanese suppliers have established competitive advantages in high-speed materials and key process consumables, high-end IC substrate materials and glass fabrics remain largely dominated by Japanese manufacturers. In response to supply bottlenecks and geopolitical uncertainties, Taiwan’s supply chain is accelerating high-value positioning through deeper independent R&D, further strengthening its critical role in the global AI supply chain.
CCL: AI Demand Drives Growth in Both Volume and Price, Highlighting Taiwanese Suppliers’ Competitiveness
In the CCL sector, strong demand from AI servers for large-format, high-layer-count PCBs with more than 40 layers and ultra-low-loss characteristics has placed the market in a strong growth cycle driven by both volume and pricing. The global CCL market reached US$16.02 billion in 2025 and is forecast to expand sharply to US$21.5 billion in 2026, supported by AI-related specification upgrades, representing annual growth of up to 34.2%.
Taiwanese manufacturers have demonstrated outstanding competitiveness in this segment. As of 2025, Taiwanese suppliers held a combined global market share of 37.4%, with Elite Material Co. taking the global lead at 18.9%. To address high-speed transmission requirements, Taiwanese suppliers are also actively developing next-generation materials such as Low Dk2 glass fabric, quartz fabric and PTFE, aiming to strike an optimal balance between high-speed signal integrity and processing reliability, and to reinforce the material foundation for high-performance computing.
FCCL: Automotive Electronics Support Steady Growth, While Consumer Electronics Recovery Remains Limited
In the flexible copper-clad laminate (FCCL) market, PI-FCCL, the most widely used category, benefited from demand for battery management systems and advanced driver assistance systems driven by electric vehicles, along with a recovery in the PC market. These factors lifted the market size to US$1.01 billion in 2025. However, rising memory prices have increased downstream device costs, and PI-FCCL output value is projected to edge down slightly to US$990 million in 2026
In high-frequency applications, MPI and LCP remain key materials for advanced communications. However, growth momentum has been constrained by moderate smartphone market expansion and design changes. The MPI-FCCL market is forecast to reach approximately US$240 million in 2026. Meanwhile, LCP-FCCL, known for its ultra-low-loss advantages, saw demand decline by more than 10% in 2025 due to changes in iPhone antenna designs. Looking ahead to 2026, the market is expected to remain weighed down by weak consumer electronics demand, with overall scale estimated at around US$280 million.
IC Substrate Materials: Japanese Dominance Persists as Supply Gaps Emerge
In the semiconductor substrate materials segment, Japanese manufacturers continue to maintain a high level of technological dominance, extending their influence to the very upstream end of the industry chain. Data for 2025 show that in the ABF substrate materials market, which is indispensable to advanced packaging, Ajinomoto held a market share of 97.1%, effectively controlling a critical material supply point for global AI chip packaging.
Japanese suppliers also held more than 70% market share in BT substrate materials and low-CTE glass fabrics. Since AI applications are relatively less price-sensitive, suppliers have prioritized AI-related orders, resulting in structural supply bottlenecks. This has even begun to affect capacity allocation for automotive and traditional consumer electronics glass fabrics.
High-End Raw Materials and Process Consumables: AI Specification Upgrades Reshape the Supply Chain
As AI servers evolve toward B300 and GB300 platforms, the PCB supply chain is benefiting from both higher value-added requirements and incremental demand growth. Taking HVLP copper foil as an example, demand for HVLP4 products with extremely low surface roughness, such as Rz 0.5 μm, is rising rapidly. Driven by the AI wave, global HVLP copper foil capacity grew significantly by 48.1% in 2025 to 23,400 metric tons. Although Japanese suppliers currently account for more than 60% of supply, Taiwan’s Co-Tech has secured a position among the world’s top three suppliers with a 10.3% market share.
At the same time, the high-layer-count and thick-board structure of AI servers has significantly increased processing complexity, directly raising technical requirements for PCB drill bits, a key process consumable. To address challenges such as chip evacuation and drill breakage, the market is accelerating its shift toward high-performance coated drill bits to enhance processing stability. As micro-hole drilling shortens drill-bit service life, the global drill-bit market climbed to US$860 million in 2025. In 2026, supported by rising drilling volume and the high-value transformation of consumables, drill-bit output value is expected to grow by 29.1% to US$1.11 billion.
Deepening Strategic Positioning to Strengthen Taiwan’s Core Role in the AI Supply Chain
Amid global political and economic volatility, building resilient supply chains and strengthening technological autonomy have become core priorities for Taiwan’s PCB industry. The rise of AI demand is driving a new wave of technological upgrades and supply chain restructuring, creating opportunities to adjust supply structures that have long been dominated by Japanese manufacturers. To ensure supply stability, brand customers are actively introducing second-source suppliers, allowing Taiwanese companies to gain entry into key areas such as high-speed materials and precision processing. Looking ahead, the global PCB supply chain is expected to move toward a higher degree of specialization, while the competitive landscape will continue to be shaped by technological evolution, computing demand and geopolitical factors. Taiwanese suppliers should seize this wave of transformation by deepening independent R&D and strengthening their global footprint, thereby securing their strategic position in the AI industry chain.
Woburn, Massachusetts, USA – TopLine and TANAKA Precious Metals will team up for an IMAPS Wire Bonding Workshop at the Crowne Plaza Boston-Woburn hotel in Woburn, MA, May 12-13, 2026. The workshop is co-located with the IMAPS New England Chapter Symposium.
TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TANAKA offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding. Tanaka also offers high performance flat Gold and flat Al ribbon for RF modules and power applications. Pt alloy wire is also available.
At the workshop, TopLine CEO Martin Hart will present “Non-Traditional Use of Bonding Wire in Solder Columns as an Alternative Interconnect for Large Heterogeneous Packages” from 11:15 am to 11:45 am on 5.12.
Hart will speak on the topic of untraditional use of Palladium coated copper bonding wire to make solder columns.
PHOENIX, AZ, May 6, 2026 — Entrepix, Inc., a globally recognized expert in CMP and wafer cleaning and a subsidiary of Amtech Systems, Inc., today announced that it has entered into a representative agreement with CWI Technical Sales to support sales of its DSS-200 Ontrak wafer cleaning system as well as Entrepix CMP parts, services and upgrades in the Eastern United States from Florida to Eastern Canada.
Under the agreement, CWI Technical Sales will focus on expanding market adoption of the DSS-200 platform, Entrepix’s industry-leading double-sided wafer cleaning system, serving semiconductor and advanced substrate manufacturers seeking high-performance, cost-effective cleaning solutions. The DSS-200 wafer cleaning system has been fully modernized by Entrepix and features a modern control system and optimized handling for thin or fragile substrates. In addition, the system can be configured for odd wafer sizes making it well suited for the production of novel substrates.
“We are excited to partner with CWI Technical Sales, whose deep technical expertise and hands-on understanding of wafer processing enable them to quickly diagnose challenges and deliver practical, high-impact solutions for our mutual customers,” said Jason Brown, Vice President and General Manager for Entrepix.” Their problem-solving approach and close engagement with end users make them an ideal partner to drive adoption of our DSS-200 platform,” added Brown.
“Entrepix has a great reputation for not only making a quality product but for innovation and technical problem solving’” said Nat Weil, President of CWI Technical Sales. “The applications in the Eastern US are diverse technically, and driven by trends like optical interconnect, defense, aerospace and others – the DSS platform is uniquely positioned to provide the performance and reliability that these customers demand,” added Weil.
AURORA, CO ― May 2026 ― AdvancedPCB has completed the installation of two Falcon small-hole drilling systems from Schmoll Maschinen GmbH at its U.S. facilities in Maple Grove, Wisconsin and Santa Clara, California.
The investment is part of the company’s 2026 Technology Acceleration Initiative, focused on advancing precision circuit board fabrication capabilities to support increasingly complex designs and substrate applications.
Designed for high-precision microdrilling, the Falcon Series addresses the growing demands of substrate manufacturing, including smaller hole diameters, tighter tolerances, and higher hole counts. The systems combine high-speed spindles reaching up to 300,000 rpm with advanced linear drives and CNC control technology to deliver consistent accuracy and repeatability.
With accuracy down to ±12-15 µm (CpK > 1.67) and temperature-controlled processing, the Falcon systems are built to maintain stability during long production runs. Additional features such as CCD alignment and automated collet cleaning support reliable, high-quality output across a range of advanced materials.
By adding these systems in both Midwest and West Coast operations, AdvancedPCB is enhancing its ability to support high-density and substrate-driven applications while improving process consistency and throughput across its U.S. facilities. These capabilities further position AdvancedPCB to meet the stringent quality and reliability requirements of industries such as aerospace and defense, AI and data centers, medical technologies, and robotics.
AdvancedPCB’s 2026 Technology Acceleration Initiative includes coordinated investments across multiple U.S. facilities to expand advanced fabrication technologies, increase capacity, and elevate support for next-generation electronic systems.
DOWNERS GROVE, Ill. -- SWEP, part of Dover (NYSE: DOV) and a world-leading supplier of brazed plate heat exchangers (BPHEs), today announced a partnership with Microchannel Devices (MCD) to expand SWEP's market offering with printed circuit heat exchangers (PCHE).
Both companies provide high-performing heat exchangers designed to optimize system efficiency, reduce footprint, and support more sustainable energy solutions. MCD's printed circuit technology complements SWEP's brazed plate technology and further enhances its portfolio of energy-efficient solutions.
"This partnership provides SWEP access to complementary products, while MCD benefits from accelerated market reach through SWEP's global sales channels and strong customer relationships. Our collaboration is a valuable opportunity to strengthen SWEP's position in existing markets and enhance our ability to serve customers through an expanded BPHE offering," says Ulrika Nordqvist, SWEP President.
SWEP and MCD share a strong commitment to the green energy transition and market development in areas such as hydrogen infrastructure, energy storage, and CO2 applications. The partnership enhances SWEP customer value by leveraging expanded application and technical expertise to meet demanding development requirements, particularly in applications characterized by space constraints, ultra-high working pressures, and extreme temperatures.
Through the buy-resell agreement, SWEP customers will gain access to a broad portfolio of ultra-compact heat transfer solutions through their trusted, long-term business partner, ensuring seamless dialogue and established procurement processes. The expanded PCHE offering is supplied by MCD, an Italy-based specialist in chemical etching, which delivers high-quality, certified PCHEs through its patented diffusion bonding and fully integrated design, production, and testing capabilities.
Canton, MA — April 2026 — Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026, at the Renaissance Los Angeles Airport Hotel.
Recognized as the premier event focused on the design, reliability, and application of electronic components for aerospace, defense, and space systems, CMSE 2026 brings together leading engineers, technologists, and innovators to address the industry’s most pressing technical challenges.
As part of the conference’s Day 1 technical program, Chandra Gupta, Director of Business Development at Remtec, will present “Innovative Ceramic Sub-Mounts and Heat Spreaders.” His session will explore advanced thermal management strategies critical to improving the reliability and performance of high-power electronic systems.
High-power semiconductor devices—such as amplifiers and DC-DC converters—face significant thermal challenges that can impact performance and long-term reliability. Dr. Gupta’s presentation will address how advanced ceramic materials and engineered sub-mount designs can dramatically improve heat dissipation, reduce thermal resistance, and extend mean time before failure (MTBF) in mission-critical applications.
“CMSE is one of the most important technical gatherings in our industry because it brings together the people who are solving the toughest reliability challenges in aerospace, defense, and space electronics,” said Mr. Buyea. “For Remtec, it’s an opportunity not just to showcase our technology, but to contribute to the collective advancement of high-performance, high-reliability electronic systems. The conversations that happen here—especially around thermal management and materials innovation—are critical to the future of our industry and the systems that depend on it.”
CMSE 2026 is designed to foster deep technical engagement through high-quality presentations, keynotes, and interactive discussions. The event also plays a vital role in educating the next generation of engineers, ensuring the continued advancement of technologies that support national defense and space exploration. Remtec’s participation underscores its commitment to solving complex thermal and reliability challenges through advanced materials and integrated manufacturing solutions.
About Remtec
Remtec is a leading provider of advanced ceramic substrates and microelectronic assembly solutions, specializing in high-performance applications where thermal management, reliability, and signal integrity are critical. Leveraging proprietary technologies such as plated copper thick film (PCTF®), Remtec delivers solutions using materials like alumina and aluminum nitride to support demanding environments across aerospace, defense, telecommunications, and power electronics.
From substrate design to fully integrated assembly—including die attach, wire bonding, and system-level integration—Remtec provides end-to-end solutions that help customers improve performance, reduce risk, and accelerate time to market. With a strong focus on engineering collaboration and innovation, Remtec continues to push the boundaries of what’s possible in high-reliability electronics.
