PARAMOUNT, CA – June 23, 2025 – Excellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).
John Strubbe, Plant Manager and Director of Operations at Innovative Circuits, commented on the installation: “Innovative Circuits is growing. We conducted a comprehensive review of the two current vendors we have on-site. A key requirement was a hybrid laser system that included both UV and CO₂ capabilities. After evaluating available solutions in North America using a scoring method I’ve applied throughout my career—based on technology, quality, responsiveness, delivery, and cost—it was clear that Excellon stood out.
What truly set the COBRA laser apart were metrics like MTBF (mean time between failures), consistency, and repeatability. With this system, we’ve reduced operating costs, eliminated production bottlenecks, and improved yields. However, the most significant factor was the lower and more transparent servicing costs. The COBRA helped us achieve the next level in PCB technology.”
Innovative Circuits, Inc. specializes in quick-turn, made-to-order fabrication of rigid-flex and complex rigid PCBs. The company is ITAR registered and ISO 9001:2015 certified, focusing on high-quality domestic manufacturing.
Mike Sparidaens, Vice President of Sales at Excellon, added: “The COBRA Hybrid Laser System is designed to handle the most demanding rigid and flexible circuit board designs. Renowned globally for its reliability and precision, the system is a perfect fit for Innovative Circuits. We've had a long-standing relationship with their team and are proud to support their continued growth with the installation of a second COBRA system.”
Excellon, a U.S.-based, employee-owned company, is a global leader in PCB drilling solutions. Its product lineup ranges from single- and multi-station mechanical drilling machines to advanced hybrid laser systems for precision via formation and routing. In 2024, Excellon opened a new state-of-the-art production facility in Paramount, California, underscoring its commitment to U.S. manufacturing and innovation.
MILPITAS, CA – FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $750,000. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by selected recipients to cover total project cost.
The RFP seeks proposals targeting FHE advances in the following areas:
Advanced Materials
Integrated Digital Twin Platforms for Multiscale, Multimaterial, Additive Electronics Manufacturing
System Integration, Reliability, and Standards for Scalable FHE and Additive Electronics Manufacturing
Restricted Open Topics
Market & Application Landscape Assessment
Process Development Kit for FHE
3D Geometry & Co-Design Tools
Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. See the FlexTech 2025 RFP for more details on the evaluation process.
White Paper Submissions
White paper submissions, the first step in responding to the RFP, are due July 14, 2025. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:
Rationale
Budget
Collaboration value
Dual-use (industry and military) applicability
Relevance to the FHE ecosystem
Schedules and milestones
Reasonable and stretch deliverables
Overall proposal quality
Request for Proposals Webinar
To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on June 24, 2025, at 10:00 a.m. PDT. A recording will be available for registrants unable to attend the event. Register for the webinar.
ITALY – With its new Flero STARTEAM (FST) factory in Italy, STARTEAM GLOBAL is setting new standards in the ever-evolving world of printed circuit board (PCB) manufacturing. At the heart of this innovation lies the Additive Solder Mask Process, specifically Digital Inkjet Solder Mask Printing —a technology that redefines efficiency, sustainability, and quality in PCB production.
Unlike traditional solder mask methods, which coat the entire board and rely on photomasks to develop patterns, digital inkjet printing applies the mask precisely where it’s needed. This additive approach slashes waste, cuts production steps, and speeds up turnaround times. Traditional processes can take multiple stages — pre-treatment, coating, drying, exposure, development, and curing — while inkjet printing streamlines this to pre-treatment, printing, and curing. The result? A much higher resolution, comparable to conventional photo-imageable masks, with the added perks of flexibility and eco-friendliness.
For customers, this translates to tangible benefits. Faster production means quicker delivery of high-quality PCBs, keeping projects on schedule. The precision of inkjet technology — enabled by advanced systems like Notion Systems’ n.jet and Peters Group’s Elpejet ink — ensures flawless coverage, reducing defects and enhancing reliability. Design changes? No problem. Digital printing adapts without the costly, time-consuming photomask adjustments required in traditional methods. Plus, with less material waste and energy use, it aligns with sustainability goals — a win for environmentally conscious clients.
At FST, STARTEAM GLOBAL leverages this technology to meet the demands of today’s high-performance PCB applications. The process supports varying resist thicknesses and delivers crack-free performance even after multiple reflow cycles, thanks to cutting-edge ink formulations. While the initial investment in inkjet systems is notable, long-term savings from reduced waste and faster workflows make it a smart choice for both manufacturer and customer.
This shift underscores STARTEAM’s 35-year legacy of expertise, now elevated by a commitment to thought leadership in the PCB industry. By adopting digital inkjet printing, we’re not just keeping pace — we’re setting the standard. For existing customers, expect enhanced service and cost efficiencies. For prospects, this is an invitation to partner with a forward-thinking manufacturer delivering premium, customizable PCBs. Interested in how this technology can transform your next project? Contact us at the Flero STARTEAM (FST) factory LinkedIn page or our main LinkedIn page to explore the future of PCB manufacturing — additive, innovative, and customer-focused. For more details, visit the Flero STARTEAM factory page.
Atg Luther Maelzer, a leading supplier of electrical testing solutions for the PCB industry, recently celebrated with a grand opening of their new office and manufacturing facility in Wertheim, Germany.
“We are excited about our new facility and its successful grand opening,” says Dr. Jochen Kleinertz, President of atg Luther Maelzer.
This new location, with three-stories of office space and a large open production hall with meeting spaces, labs and other workspaces will surely provide a dynamic, people-centric work environment for all team members of the atg business line.
Kleinertz continued, “The modern design, spacious areas, and high-quality technical equipment offer great opportunity for creative work and improved infrastructure. This move marks an important step in our development, and we look forward to upcoming projects and challenges in this new environment!”
GERMANY – Ventec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
“Trading conditions worldwide are challenging the supply chains of high-tech manufacturing businesses, resulting in significant changes to EMEA supply chains for halogen-free laminates and prepregs” commented Mark Goodwin, COO of Ventec. “Our strategic stock investment in these FR4.1 and FR15.1materials strengthens Ventec’s commitment to Europe’s PCB makers and upholds the industry’s commitment to sustainability. While others take a step back from EMEA, Ventec takes a step forward.”
OEMs often look to halogen-free by design, at the substrate level, for compliance with regulations such as RoHS and REACH. Many others make the choice voluntarily to enhance their products’ environmental credentials. A fast and reliable, long-term supply of halogen free laminate and pre-preg materials for PCB production protects the entire value chain, saving costs and delays to source alternative materials. Ventec’s enhanced local stockholding, at the company’s main European base in Kirchheimbolanden, Germany, enhances resilience and turn around with direct shipping to customers throughout the region.
In addition to supporting sustainability, halogen-free FR15.1 materials can deliver superior performance such as thermal stability and reliability compared to FR4 / FR4.1 -based substrates. While FR4 formulas such as Ventec’s VT-481 / VT-47 target general-purpose and cost-sensitive applications, halogen-free FR15.1 VT-441V / VT447V with MOT / RTI ratings over150°C are often chosen for enhanced thermal performance across a wide range of applications including automotive, industrial and increasing commercial aerospace applications.
Ventec’s FR4.1 and FR15.1 materials, VT-441 / VT-441V and VT-447/ VT-447V, provide outstanding thermal reliability, with low Z-axis coefficient or thermal expansion (CTE) and glass transition temperature (Tg) covering the mid-to-high range from 150°C to 190°C. These phenolic-cured materials are resistant to conductive anodic filament (CAF)formation, with electrical and mechanical parameters equivalent to or better than Ventec’s market leading VT-481 and VT-47 FR4 systems.
NORTH AMERICA – We are excited to announce a new partnership aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for our North American customers.
The synergies created by our partnership will benefit all our North American customers through our enhanced Just-In-Time (JIT) and logistics model, supported by our five (5) rapid-response warehouses.
Starting June 9th 2025, we will offer expedited delivery of Ventec’s range of Polyimide, FR4, FR4.1 & FR15.1 materials through our Santa Ana warehouse. Over the next few months, we will ramp up operations and extend expedited delivery services to additional locations, ensuring broader and faster access to our high-quality materials.
