Freudenstadt, Germany – August 20th, 2025 - SCHMID Energy System GmbH has been awarded a major contract by Dutch shipping company Portliner to design and construct a large-scale flow battery system with up to 1.5 MW of peak power. This state-of-the-art energy storage solution will serve as the primary power source for the zero-emission propulsion of an all-new container vessel.
This landmark project marks SCHMID Energy System’s entry into the maritime propulsion market and strengthens its position as a pioneer in sustainable energy storage solutions for shipping. The chosen flow battery technology offers high energy density, exceptional longevity, and flexible charging and discharging capabilities- all critical requirements for the reliable operation of large cargo vessels on long-haul routes. It allows charging the battery from onshore electrical charger or for very fast charging swapping of discharged electrolyte with charged electrolyte from charging pontoons will be developed.
“This contract is a major strategic milestone for our company,” said Henrik Buschmann, Vice President BU Energy Systems, SCHMID Group.
“We are leveraging decades of experience in innovative energy systems to enter the maritime sector for the first time, sending a strong signal for sustainable solutions worldwide. Partnering with Portliner allows us to combine technological excellence with a clear commitment to environmental and climate protection.” Portliner is equally enthusiastic about the collaboration.
“With SCHMID Energy Systems, we have found a partner that not only brings deep technical expertise but also shares our vision for clean, future-proof shipping,” said Ton van Meegen, CEO, Portliner.
“The flow battery will enable us to operate our container ships entirely emission-free, making a tangible contribution to reducing CO₂ emissions in global trade.”
The vessel will operate without any fossil fuels, directly contributing to the decarbonization of maritime freight transport and supporting international climate goals.
Upon successful delivery of this project, SCHMID Energy Systems intends to further advance maritime applications of its flow battery technology - from cargo ships and ferries and swimming electrolyte pontoons.
Atlanta – ECIA’s 2025 Executive Conference Committee is pleased to announce that the program for the October conference is complete. The theme for this year’s conference is ‘Amped UP, the Power of Tomorrow.” The 2025 Executive Conference takes place October 19-21, 2025, at a NEW LOCATION, the Westin O’Hare Hotel.
"The 2025 ECIA Executive Conference Core Committee was inspired by the rapid advancements in technology shaping the electronics industry and selected a theme that captures the opportunities ahead,” explained Maryellen Stack, Director of Marketing Communications, Sager Electronics, and this year’s conference chair. “‘Amped Up. The Power of Tomorrow.’ is more than just a theme—it’s a call to action. It reflects the energy, transformative innovation, collaboration, and resilience driving our future. We are committed to delivering a conference that not only tackles the hard topics but also ignites—and powers—new ideas to lead our businesses forward.”
The conference committee considers survey results, feedback from previous years’ attendees, and current market conditions when selecting a theme. With supply chain disruptions, tariff uncertainty and geopolitical upheaval top of mind for strategic planners, theme selection was particularly important.
“Now that the conference program and speakers are finalized, the work of the Speaker Vetting committee really ramps up,” noted Stephanie Tierney, ECIA's Director of Marketing Communications and Member Engagement. ”They must work with each of the speakers to fine tune and prep the presentations to ensure that the topics are specific to our industry and the content flows together logically and doesn’t overlap or repeat. The theme sets the agenda reflecting the excitement of collaboration in our future. The 2025 Executive Conference Core Committee is working hard to deliver a top-notch experience.”
Sponsorships are filling fast! This Conference offers personal access to industry experts, ample time to discuss important issues and critical networking opportunities. Spotlight your company by becoming a sponsor. Several sponsorship levels are available as well as the opportunity to support a particular event or session.
Contact Stephanie Tierney: This email address is being protected from spambots. You need JavaScript enabled to view it. for more information or visit the sponsorship page.
Visit the conference website for more information.
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
In this newly established role, Dr. Bhatkal will report to the Executive Vice President of MacDermid Alpha Electronics Solutions and spearhead strategic initiatives to accelerate business growth and transformation in the Indian market, collaborating closely with global business and commercial leaders. His mandate aligns with India’s national priorities to build a robust and self-reliant electronics manufacturing ecosystem, supported by key government programs such as the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM), which aim to attract investment, boost local innovation, and strengthen supply chain resilience. Dr. Bhatkal brings over two decades of leadership across the electronics, advanced materials, and energy sectors. He most recently led commercial operations in India for the Semiconductor Assembly Solutions division and has held senior roles including Vice President, Energy Technologies, and Managing Director, India, at Element Solutions Inc,. Renowned for driving transformation and building high-performing teams, he has consistently delivered strategic growth and operational excellence.
He serves on the board of iNEMI and advises leading institutions including IIT Madras and the Central Manufacturing Technology Institute. Dr. Bhatkal holds a Ph.D. and M.S. in Materials Engineering and an MBA. He is also a published author and co-inventor on multiple patents.
“Ravi’s appointment marks a pivotal step in advancing our long-term growth strategy for India,” said Julia Murray, Vice President, Global Marketing Communications. “His in-depth understanding of the Indian market, combined with a global perspective and passion for innovation, makes him the ideal leader to drive strategic progress in this critical region.”
This new role reflects MacDermid Alpha’s commitment to expanding its presence in India and delivering long-term value to customers and partners in the region. It also reinforces the company’s intent to actively contribute to India’s vision of becoming a global hub for electronics system design and manufacturing (ESDM).
Abstract submission will open on August 18, 2025, and the deadline for submissions is October 6, 2025. For all details and to submit an abstract, please visit the ECTC 2026 Call for Papers.
The ECTC 2026 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, WLP and PLP, fan-out and fan-in packaging, flip chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing and systems, and other emerging technologies in electronics packaging.
Previously unpublished, non-commercial paper abstracts are requested in areas including:
Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.
The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.
An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.
TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.
The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.
Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.
The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.
An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.
TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.
The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.
