Europlacer, a global leader in flexible SMT assembly solutions, has received a 2025 Service Excellence Award (SEA), marking the 12th year in a row the company has been honored. The award, presented to Technical Service Manager Scott Huffman by Mike Buetow – President of PCEA, recognizes Europlacer’s high standards in Pick & Place and Printer service.
The Service Excellence Awards, now in their 33rd year and sponsored by CIRCUITS ASSEMBLY, are based entirely on feedback from customers. Companies are evaluated on areas such as reliability, responsiveness, ease of use, manufacturing quality, and overall value. Scott Huffman, Technical Service Manager for Europlacer Americas said:
"Receiving the Service Excellence Award is a great recognition of the commitment our service team shows every day. As service engineers, we are on the front line with our customers, and our priority is always to keep their production running smoothly. This award reflects the trust our customers place in us and the teamwork behind every successful service delivery."
"We are delighted to receive this award, as it reflects the consistent level of support and attention we aim to provide our customers - from initial contact and throughout the life of their equipment."
This 12th consecutive award highlights Europlacer’s continued focus on service and support, a key part of the company’s approach to working with electronics manufacturers worldwide.
OSAKI, JAPAN – Rohde & Schwarz has opened a new larger office in Osaki, Japan, with increased capabilities, to deliver an innovation advantage for the Japanese automotive community.
The new location, which replaces the original one in Shinjuku, has significantly enhanced facilities for service, repair, calibration and engineering support of test equipment as well as increased space for hosting customer events.
Munich/Osaki, - At the new office Rohde & Schwarz hosts demonstrations developed in collaboration with leading automotive industry partners. Noashi Saito, General Manager of Rohde & Schwarz Japan commented, “We are very proud of our new facility in Osaki, and we invite the Japanese automotive community to make the most of this resource and the talented staff who work here.”
EMC measurements under dynamic driving conditions with AIP Automotive
The electromagnetic emissions of vehicles, particularly EVs, change significantly depending on their operational state. Therefore, to get a true understanding of the EMC performance of an electric vehicle, it is essential to test it under dynamic driving conditions. A test system that combines EMC receivers and automation software from Rohde & Schwarz with the AIP EMC Chassis Dynamometer enables vehicle manufacturers and Tier 1s to obtain an evaluation of the EMC performance of their designs under realistic operational conditions. AIP has enhanced this system with R&S radar target simulators to also provide vehicle-in-the-loop testing of radars in a controlled environment. The new R&S office in Osaki has a dedicated space for calibration of EMC equipment and is near AIP’s new office, enabling fast servicing and support turnaround time for AIP.
Rohde & Schwarz strengthens in vehicle network compliance testing in Japan with GRL and Analog Devices
Rohde & Schwarz is further expanding its collaboration with Granite River Labs (GRL) and Analog Devices, Inc. (ADI) to support in-vehicle network compliance testing in Japan. GRL, a provider of compliance test and certification services for standards like multigigabit Ethernet and Automotive SerDes Alliance (ASA), has a history of utilizing Rohde & Schwarz test equipment. ADI, a global semiconductor leader, is working closely with Rohde & Schwarz globally to advance the adoption of the emerging OpenGMSL™ standard via the OpenGMSL Association.
The collaboration is supported by Rohde & Schwarz Japan's new expanded facilities and the availability of leading-edge oscilloscopes and vector network analyzers, designed to ensure fast and reliable standards-compliant testing, including solutions specifically tailored for the Japanese market. This will accelerate testing processes and facilitate the building and delivery of OpenGMSL-based solutions. The availability of local expertise and instruments is considered critical in supporting the global automotive ecosystem.
IPG Automotive, a leader in virtual test driving, partners with Rohde & Schwarz to integrate Automotive Radar Hardware-in-the-Loop (HIL) testing from the proving ground into the development lab. The collaboration combines IPG Automotive’s CarMaker simulation software with Rohde & Schwarz’s scalable AREG800A radar target simulator, the R&S QAT100 advanced antenna array, and the compact R&S RadEsT target simulator.
This combination provides vehicle manufacturers and Tier 1 suppliers with the ability to simulate ADAS/AD scenarios, including those defined in Euro NCAP, in a controlled, safe, time-efficient, and cost-reducing environment. In the expanded office facilities in Osaki both companies jointly set up and demonstrate HIL systems alongside the development of local traffic scenario simulations specific to Japan.
MediaTek and Rohde & Schwarz expand automotive NTN testing to Japan
The automotive industry is actively exploring non-terrestrial networks (NTNs) to provide ubiquitous wireless connectivity for always-connected vehicles. The capabilities of pioneering chipset developer MediaTek’s latest NR-NTN device have been demonstrated using the Rohde & Schwarz CMX500 radiocommunication tester, a versatile solution for testing various NTN technologies including NR-NTN, NB-NTN, and Direct-To-Cell (D2C, DTC). The CMX500 offers multiband and multi-orbit support, along with a dedicated NTN workspace for visualizing deployed networks and their parameters.
Rohde & Schwarz leverages its wireless and automotive expertise to help navigate the challenges associated with NTN, identify key vehicle components, and explain the role of testing in creating NTN-enabled vehicles. A global collaboration between MediaTek and Rohde & Schwarz, spanning Europe, North America, and China, is now expanding to Japan.
The office in Osaki will facilitate a greater number of projects for Japanese automotive partners, including faster support for local NTN projects with MediaTek. The R&S CMX500 empowers customers in Japan to test and optimize the entire NTN integration chain — from chipsets and modules to antennas, TCUs, and vehicles and validates NTN vehicle connectivity tailored to the Japanese market.
The new location, which replaces the original one in Shinjuku, has significantly enhanced facilities for service, repair, calibration and engineering support of test equipment as well as increased space for hosting customer events. Munich/Osaki, - At the new office Rohde & Schwarz hosts demonstrations developed in collaboration with leading automotive industry partners. Noashi Saito, General Manager of Rohde & Schwarz Japan commented, “We are very proud of our new facility in Osaki, and we invite the Japanese automotive community to make the most of this resource and the talented staff who work here.”
EMC measurements under dynamic driving conditions with AIP Automotive The electromagnetic emissions of vehicles, particularly EVs, change significantly depending on their operational state. Therefore, to get a true understanding of the EMC performance of an electric vehicle, it is essential to test it under dynamic driving conditions. A test system that combines EMC receivers and automation software from Rohde & Schwarz with the AIP EMC Chassis Dynamometer enables vehicle manufacturers and Tier 1s to obtain an evaluation of the EMC performance of their designs under realistic operational conditions. AIP has enhanced this system with R&S radar target simulators to also provide vehicle-in-the-loop testing of radars in a controlled environment. The new R&S office in Osaki has a dedicated space for calibration of EMC equipment and is near AIP’s new office, enabling fast servicing and support turnaround time for AIP.
Rohde & Schwarz strengthens in vehicle network compliance testing in Japan with GRL and Analog Devices Rohde & Schwarz is further expanding its collaboration with Granite River Labs (GRL) and Analog Devices, Inc. (ADI) to support in-vehicle network compliance testing in Japan. GRL, a provider of compliance test and certification services for standards like multigigabit Ethernet and Automotive SerDes Alliance (ASA), has a history of utilizing Rohde & Schwarz test equipment. ADI, a global semiconductor leader, is working closely with Rohde & Schwarz globally to advance the adoption of the emerging OpenGMSL™ standard via the OpenGMSL Association.
The collaboration is supported by Rohde & Schwarz Japan's new expanded facilities and the availability of leading-edge oscilloscopes and vector network analyzers, designed to ensure fast and reliable standards-compliant testing, including solutions specifically tailored for the Japanese market. This will accelerate testing processes and facilitate the building and delivery of OpenGMSL-based solutions. The availability of local expertise and instruments is considered critical in supporting the global automotive ecosystem. IPG Automotive and Rohde & Schwarz enhance autonomous driving radar testing capabilities
IPG Automotive, a leader in virtual test driving, partners with Rohde & Schwarz to integrate Automotive Radar Hardware-in-the-Loop (HIL) testing from the proving ground into the development lab. The collaboration combines IPG Automotive’s CarMaker simulation software with Rohde & Schwarz’s scalable AREG800A radar target simulator, the R&S QAT100 advanced antenna array, and the compact R&S RadEsT target simulator.
This combination provides vehicle manufacturers and Tier 1 suppliers with the ability to simulate ADAS/AD scenarios, including those defined in Euro NCAP, in a controlled, safe, time-efficient, and cost-reducing environment. In the expanded office facilities in Osaki both companies jointly set up and demonstrate HIL systems alongside the development of local traffic scenario simulations specific to Japan.
MediaTek and Rohde & Schwarz expand automotive NTN testing to Japan The automotive industry is actively exploring non-terrestrial networks (NTNs) to provide ubiquitous wireless connectivity for always-connected vehicles. The capabilities of pioneering chipset developer MediaTek’s latest NR-NTN device have been demonstrated using the Rohde & Schwarz CMX500 radiocommunication tester, a versatile solution for testing various NTN technologies including NR-NTN, NB-NTN, and Direct-To-Cell (D2C, DTC). The CMX500 offers multiband and multi-orbit support, along with a dedicated NTN workspace for visualizing deployed networks and their parameters.
Rohde & Schwarz leverages its wireless and automotive expertise to help navigate the challenges associated with NTN, identify key vehicle components, and explain the role of testing in creating NTN-enabled vehicles. A global collaboration between MediaTek and Rohde & Schwarz, spanning Europe, North America, and China, is now expanding to Japan.
The office in Osaki will facilitate a greater number of projects for Japanese automotive partners, including faster support for local NTN projects with MediaTek. The R&S CMX500 empowers customers in Japan to test and optimize the entire NTN integration chain — from chipsets and modules to antennas, TCUs, and vehicles and validates NTN vehicle connectivity tailored to the Japanese market.
MULINO, OR – ASC Sunstone Circuits, a leading provider of high-quality, quick-turn printed circuit boards (PCBs), is pleased to announce a significant enhancement to its Oregon manufacturing facility. As part of a strategic initiative to align capabilities across the organization, a high-precision via fill machine has been transitioned from parent company American Standard Circuits (ASC) to the ASC Sunstone facility in Mulino. This equipment transfer represents a deepening of the synergy between both facilities, providing customers with faster access to advanced fabrication techniques previously unavailable on site.
Streamlining Complex PCB Fabrication
The addition of dedicated via fill equipment allows ASC Sunstone to manage complex design requirements - such as conductive and non-conductive via fill - entirely in-house. This move is designed to:
Reduced Lead Times: By integrating in-house via fill capabilities at the Oregon facility, ASC eliminates the need to transfer boards between plants or outsource specific processes. This localized control ensures that complex commercial designs stay on the fast track, maintaining industry-leading quick-turn delivery schedules.
Enhanced Reliability: Bringing the via fill process in-house at the Oregon plant ensures total quality control over boards requiring flat surfaces for component mounting (via-in-pad). This provides customers with superior structural integrity and optimized assembly surfaces without the logistics of multi-site handling.
Support for Advanced Commercial Designs: This equipment enables the Oregon plant to support tighter pitch designs and improved thermal management locally. By streamlining the production of sophisticated boards, ASC provides a faster, more efficient path for domestic prototyping and production.
A Unified Manufacturing Strategy
"Since joining forces with American Standard Circuits, our goal has been to provide the best of both worlds: ASC’s vast technical resources and Sunstone’s legendary speed and ease of use," said Mathew Stevenson, VP & General Manager at ASC Sunstone Circuits. "Moving this via fill capability to Oregon is a perfect example of that synergy. We are literally putting the tools for complex engineering directly into the hands of our quick-turn customers."
About ASC
ASC is a premier PCB solutions provider formed by the integration of American Standard Circuits and Sunstone Circuits, bringing together over 50 years of collective industry expertise. By unifying high-tech fabrication capabilities with industry-leading quick-turn agility, the company provides a comprehensive "design-to-production" workflow across its domestic manufacturing facilities. ASC delivers a robust technology portfolio—including Ultra HDI, RF/microwave, metal-clad, flex, and rigid-flex solutions—supported by world-class certifications and a legendary commitment to customer service. From rapid prototyping to large-scale production, ASC leverages its combined multi-site capacity to meet the technical precision and scalability demands of the global electronics industry.
West Chicago, IL — Building on the success of their 2023 merger, two of the nation’s leading printed circuit board manufacturers — American Standard Circuits and Sunstone Circuits — have united under a shared brand family: ASC. Now known as American Standard Circuits (ASC) and ASC Sunstone respectively, the change reflects a shared legacy of innovation, engineering excellence, and the expanded capabilities now available to customers across industries.
New logo reflects legacy of innovation in PCBs
The updated brand identity combines aspects of both company’s original logos, to honor each company’s legacy: the people and partnerships that shaped their growth and solidified their standing as leaders in PCB manufacturing.
At the center of the new logo is a stylized lightning bolt, representing the spark of brilliance that drives innovation, and the current of energy that flows when a circuit is complete. The design also evokes PCB tracelines — a nod to the engineering precision and advanced capabilities that unite both companies.
Looking ahead for 2026 and beyond
While branding evolves, what remains constant is an unwavering commitment to the customer experience. Customers can expect the same responsiveness, reliability, and technical mastery they’ve always trusted — now backed by the combined strength and capabilities of two established PCB leaders united under a shared brand.
“This unification is about more than a name — it’s about a shared vision for the future of PCB manufacturing,” said Anaya Vardya, CEO at ASC. “By coming together as a brand family, we’re harnessing the strengths of two pioneering companies to accelerate innovation, expand our capabilities, and continue to offer new solutions for our customers.”
With a refreshed visual identity, an expanded suite of manufacturing capabilities, and ongoing investments in employees, technology, and R&D, ASC enters the new year poised to lead the next era of PCB manufacturing. Together, American Standard Circuits (ASC) and ASC Sunstone are committed to delivering innovative, high-quality, U.S.-made circuit board solutions — from quick-turn prototypes to complex, high-reliability designs — serving industries from aerospace and medical to telecommunications and consumer electronics.
About ASC
ASC is a premier PCB solutions provider formed by the integration of American Standard Circuits and Sunstone Circuits, bringing together over 50 years of collective industry expertise. By unifying high-tech fabrication capabilities with industry-leading quick-turn agility, the company provides a comprehensive "design-to-production" workflow across its domestic manufacturing facilities. ASC delivers a robust technology portfolio—including Ultra HDI, RF/microwave, metal-clad, flex, and rigid-flex solutions—supported by world-class certifications and a legendary commitment to customer service. From rapid prototyping to large-scale production, ASC leverages its combined multi-site capacity to meet the technical precision and scalability demands of the global electronics industry.
Victory PCB, a professional printed circuit board manufacturer based in Shenzhen, today announced its continued focus on the production and supply of Heavy Copper Printed Circuit Boards (PCBs), engineered to meet the growing demands of high-power, high-current, and thermally challenging electronic applications.
Heavy copper PCBs, also commonly referred to as thick copper PCBs, are gaining widespread adoption across multiple electronic industries due to their strength, reliability, and performance advantages. These boards contain more than 3 ounces (oz) of copper on the inner or outer layers of the printed circuit board. In industry terms, copper thickness ranging from 4 oz/ft² to 20 oz/ft² is considered heavy copper, while copper weights exceeding 20 oz/ft² and reaching up to 200 oz/ft² are categorized as extreme copper.
Victory PCB manufactures heavy copper PCBs using appropriate substrates combined with thicker copper plating in through-hole circuits. This approach creates a highly reliable wiring platform capable of handling elevated current levels while maintaining mechanical durability. The manufacturing process involves a combination of advanced etching and plating techniques, with a consistent objective of increasing copper thickness along plated holes and sidewalls to ensure long-term performance and stability.
As demand for robust power electronics continues to rise, heavy copper PCBs have become one of the fastest-growing segments within the PCB industry, offering strong development potential and broad application coverage.
Key Benefits of Heavy Copper PCBs
Compared to conventional printed circuit boards, heavy copper PCBs provide several distinct advantages:
Simple and Strong Structure. By integrating high-current circuits directly into the PCB, designers can achieve higher circuit density while reducing the overall layer count. This results in a structure that is both mechanically strong and relatively uncomplicated.
Reduced Failure States. High-current and high-power circuits typically generate significant heat. Copper’s excellent thermal conductivity enables heavy copper PCBs to efficiently transfer heat away from temperature-sensitive components, reducing the likelihood of thermal failure.
Lower Overall Production Costs. While copper itself is a premium material, replacing traditional copper cables with heavy copper PCBs can lower overall production costs by simplifying system design, reducing assembly complexity, and improving reliability.
Applications of Heavy Copper Circuit Boards
Heavy copper PCBs are commonly used in applications that require high power distribution, effective heat dissipation, and mechanical robustness. Typical applications include:
Power supplies for radar systems
Power converters
Safety and signal systems
Welding equipment
Protection relays
Power line monitors
Torque controls
Overload relays
Automotive industry electronics
Solar panel manufacturing systems
Nuclear power applications
These applications rely on heavy copper PCBs for their ability to handle high currents, withstand harsh operating conditions, and deliver consistent performance over extended service lifetimes.
Manufacturing Capabilities and Custom Solutions
Victory PCB offers comprehensive heavy copper PCB manufacturing capabilities, including support for customized specifications based on customer requirements. The company works closely with each client to ensure that every heavy copper PCB meets precise design, performance, and turnaround expectations.
In response to common customer inquiries, Victory PCB supports a wide range of requirements related to heavy copper PCBs, including multilayer configurations, material selection, manufacturing processes, and turnaround considerations. The rising use of heavy copper PCBs reflects the electronics industry’s increasing need for reliable solutions capable of supporting high-power and high-current designs.
Victory PCB emphasizes collaboration throughout the development process, helping customers move from design to production efficiently and accurately.
“Victory PCB works with each customer to ensure they get the boards they need, the way they need them,” the company stated. “Our heavy copper printed circuit boards are designed to support demanding applications while enabling fast, reliable production from the first build.”
Customers seeking custom heavy copper printed circuit boards are encouraged to contact Victory PCB directly for a detailed quote and technical consultation.
SAN DIEGO, CA — December 30, 2025 — Altium, a global leader in electronics design systems, today announced the appointment of Don Cantow as General Manager of Altium, effective January 1, 2026. In his role as General Manager, Mr. Cantow will be central to accelerating Altium’s adoption as an industry platform, while safeguarding its openness and accessibility across the global electronics ecosystem, spanning semiconductor companies and the broader EDA and ECAD community.
Following the acquisition of Altium by Renesas Electronics Corporation (“Renesas”, TSE: 6723) in 2024, the company has been advancing a bold strategy to accelerate the digitalization of the electronics industry. Altium has evolved into a platform-first business, extending its electronic design software, Altium Designer, and its cloud-based collaboration platform, Altium 365, with electronics system design and lifecycle management capabilities to support the development of software-defined products.
Altium remains a wholly owned subsidiary of Renesas and will continue to operate under its existing legal entity. Mr. Cantow will report to Aram Mirkazemi, Senior Vice President and General Manager of Renesas Software & Digitalization Product Group.
“Altium has a long-held vision of becoming an industry platform that connects the entire electronics ecosystem—large and small—around a common digital backbone,” said Aram Mirkazemi, Senior Vice President, Software & Digitalization at Renesas. “Don is uniquely prepared to advance that vision. His breadth of industry experience and his strength in strategic partnership are exactly what is required to drive broad industry adoption and take Altium into its next phase.”
Mr. Cantow brings more than 30 years of leadership experience in the electronics industry. He spent over two decades at Mentor Graphics, where he held senior roles during the company’s growth into a global, enterprise-scale leader, leading worldwide enterprise engagements and strategic customer relationships. He also held key strategic sales and marketing roles at Texas Instruments, gaining direct experience within the semiconductor industry. Over the past eight years at Altium, he has played a central role in building the company’s enterprise business and strategic partnerships.
“I am honored to take on this role as General Manager of Altium at such a pivotal moment for Altium and the Electronic Industry,” said Mr. Cantow. “The convergence of electronic design, cloud platforms, and semiconductor innovation creates a unique opportunity to redefine how the industry designs and delivers products. It also provides a unique opportunity to modernize how the industry engages – and to accelerate engagement to match the pace of innovation. I look forward to working with our customers and partners to realize that vision.”
Mr. Cantow holds a Bachelor of Science in Computer Engineering from the University of Connecticut and has completed executive education programs at MIT Sloan School of Management and Columbia Business School.
