Global tablet shipments declined by around 3% QoQ and 4% YoY in Q4 2025, marking a clear step into a more mature phase for the market, according to Counterpoint Research’s latest Global Tablet Market Tracker. This growth followed a stronger Q3 and a high comparison base in the prior year, when Q4 2024 shipments had grown nearly 8% YoY as the market rebounded on the back of leading OEMs like Apple and Samsung returning to more regular launch cycles, and the rapid expansion of Chinese OEMs.
For full-year 2025, the market remained in the mid-100-million-unit range, signaling a shift toward a steadier replacement-driven trajectory. As the category matures, premium products and deeper ecosystem integration are becoming increasingly important, with leading vendors placing greater emphasis on value creation and long-term user engagement rather than chasing short-term shipment spikes.
Within this digestion phase, most OEMs prioritized cleaner channels and healthier economics over aggressive unit growth. Inventory was managed more tightly, promotions were more measured, and brands leaned into higher-value products where they had clearer strengths, from Apple’s premium productivity-oriented iPads to Android vendors’ higher-end tablets with stylus and ecosystem integration. Apple stood out in this environment – iPad’s global ASP rose from $527 in Q3 2025 to $583 in Q4 2025, underscoring the continued strength of the premium segment and Apple’s ecosystem. Meanwhile, Android vendors focused on stabilizing demand by reinforcing mid-range price bands and expanding productivity features such as keyboard and stylus support while maintaining strong coverage in value segments. Supply-side signals, including a pullback in tablet display panel shipments, also pointed to normalization rather than a large build ahead of 2026.
Looking ahead, the global tablet market is expected to face renewed pressure in 2026 as rising memory prices weigh on the economics of mid-range and entry-level devices, particularly for Android vendors. While shipments may soften in the near term, demand is expected to gradually stabilize as component costs normalize and replacement cycles resume. The continued shift toward premium and productivity-oriented tablets should also help support a more replacement-driven market structure over time. The latest iPad Air, launched in the first quarter of 2026, further strengthens the premium‑leaning segment of the market by offering a refreshed option between flagship Pro models and base iPads that maintains robust performance and memory configurations at broadly consistent price points, giving cost‑conscious upgraders an accessible premium choice and helping Apple defend a richer premium mix and relatively stable iPad shipments even as rising memory costs pressure the broader tablet category.
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Freudenstadt, Germany – Schmid Group, a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a major Asian high-end PCB manufacturer for a new HDI multilayer production line. The systems will support the manufacturing of next-generation AI server boards and high performance computing (HPC) platforms, one of the fastest-growing segments of the electronics industry.
The customer is a leading high-technology PCB manufacturer in China with strong exposure to global hyperscale and data center infrastructure markets. The order covers multiple wet process systems dsigned for high-layer-count HDI multilayer boards, addressing the increasing complexity and reliability requirements of AI and HPC hardware.
Driven by the rapid expansion of artificial intelligence infrastructure, next-generation server boards require higher layer counts, tighter structures, and significantly improved yield stability. This trend is creating strong demand for highly controlled wet processing technologies capable of delivering consistent quality, high throughput, and superior process stability at industrial scale.
Schmid’s advanced wet processing InfinityLine H+ and InfinityLine V+ platforms are working horses, specifically engineered to meet these requirements, enabling manufacturers to reliably produce high-density multilayer server-boards used in AI accelerators, data center networking hardware, and HPC systems.
Executive Statement – Roland Rettenmeier, chief sales officer, Schmid Group: “The explosive growth of artificial intelligence infrastructure is fundamentally transforming the global PCB and advanced electronics manufacturing landscape. AI server boards and HPC platforms are pushing HDI multilayer technology to new limits in terms of layer count, precision, and reliability.
With this significant order, SCHMID once again demonstrates its strong positioning as a key equipment partner for leading PCB manufacturers addressing these demanding markets. Our highly stable, high-quality wet process equipment solutions InfinityLine H+ and InfinityLine V+ enable our customers to scale production while maintaining the process control and yield performance required for next-generation computing infrastructure.”
Schmid has built a strong reputation in the global high-end PCB and substrate industry for delivering robust, high-precision wet processing equipment that combines process stability, high throughput, and superior production quality. These capabilities are increasingly critical as the industry scales manufacturing capacity for AI data centers, advanced networking hardware, and high-performance computing systems.
The newly ordered equipment will be installed in the customer’s next-generation production facility, supporting volume manufacturing for global technology leaders operating in the AI and HPC ecosystem.
With demand for AI infrastructure accelerating worldwide, SCHMID continues to strengthen its role as a technology partner enabling the manufacturing backbone of the digital and AI driven economy.
SCHMID Group secured a multimillion-dollar order for InfinityLine wet-process systems to support HDI multilayer PCB production for AI and HPC infrastructure.
AURORA, CO ― March 2026 ― AdvancedPCB today announced the promotion of John Stine to Chief Technology Officer (CTO). A widely respected figure in the PCB industry, Stine has nearly four decades of experience spanning design, materials, manufacturing, engineering, quality, sales, and assembly.
Stine most recently served as Executive Vice President of Aerospace & Defense Strategic Business Development. Since joining AdvancedPCB, he has played a key role in advancing the company’s technical capabilities and supporting customers in some of the industry’s most demanding sectors. Prior to that role, Stine served as Vice President of Operations at APCT, where he helped guide operational strategy and performance.
In his new role as CTO, Stine will lead AdvancedPCB’s technology strategy and guide the company’s continued investment in advanced manufacturing capabilities. He will work closely with engineering and operations teams to strengthen technical infrastructure, expand capabilities, and support the company’s rapid growth across aerospace, defense, AI/data centers, medical, and other high-reliability markets.
“John’s journey with us has been nothing short of remarkable,” said Greg Halvorson, CEO of AdvancedPCB. “Over the years, he has demonstrated exceptional leadership, technical expertise, and a relentless commitment to driving innovation. His contributions have been instrumental in advancing our products and shaping the direction of our technology.”
“I’m honored to take on the role of Chief Technology Officer at a time when our customers are facing increasing technical complexity and faster development cycles," said John Stine, Chief Technology Officer for AdvancedPCB. "My focus is on strengthening the technical partnership with our customers so we can solve harder problems, accelerate development cycles, and deliver reliable PCB solutions for their most demanding applications.”
Stine is Lean Six Sigma certified and is recognized throughout the electronics manufacturing community for his extensive hands-on experience and practical approach to solving complex technical challenges.
For more information about AdvancedPCB and its full range of PCB manufacturing and assembly services, visit www.AdvancedPCB.com.
Montreal, Canada – Future Electronics, a leading global distributor of electronic components, and SnapMagic, a provider of CAD models and design enablement tools for electronic components, have announced the launch of integrated SnapMagic CAD models across the Future Electronics global online catalog. Engineers can now download verified symbols, footprints and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
The new integration brings over ten million CAD assets into the Future Electronics digital experience, allowing engineers to download models in formats compatible with leading ECAD tools without leaving the website. Each model is aligned with manufacturer specifications to support accuracy and consistency throughout early design stages.
“Providing engineers with immediate access to reliable CAD resources reinforces our commitment to supporting customers throughout the entire design journey,” said Georgia Genovezos, Corporate Vice President of Digital Marketing at Future Electronics. “By working closely with SnapMagic, we are delivering a seamless experience that connects component selection with practical design execution.”
SnapMagic brings its extensive CAD library and model generation expertise to the collaboration, expanding access to high quality design assets for engineers worldwide.
“Our goal is to remove friction from the design process by making CAD models easy to find and easy to use,” said Natasha Baker, CEO at SnapMagic. “Partnering with Future Electronics allows SnapMagic to support engineers as they are selecting components - without needing to change their existing workflows.”
This joint launch represents a shared focus on design enablement and reflects both companies’ continued investment in tools that help engineering teams move faster and design with confidence.
To learn more about SnapMagic CAD models now available on FutureElectronics.com, visit the dedicated landing page.
For more information on SnapMagic, visit their dedicated landing page.
About SnapMagic
SnapMagic provides engineers with instant access to millions of verified CAD models, including symbols, footprints and 3D models compatible with major ECAD tools. Its AI-driven platform simplifies complex design tasks, helping engineers focus on creativity and move from concept to layout faster.
By partnering with distributors and manufacturers, SnapMagic “Digitizes the Design Win,” connecting engineers, CAD tools, and component suppliers. Today, it serves 2.7 million electrical engineers worldwide.
About Future Electronics
Founded in 1968, Future Electronics is a global leader in the electronic components industry. Future Electronics’ award-winning customer service, global supply chain programs and industry-leading engineering design services have made the company a strategic partner of choice.
Headquartered in Montreal, Canada, Future Electronics operates in 159 offices across 44 countries with over 5,000 employees. Its worldwide presence powers the company’s outstanding service and efficient, comprehensive global supply chain solutions. Future Electronics is globally integrated and supported by one IT infrastructure which provides real-time inventory availability and enables fully integrated operations, sales and marketing services worldwide. In 2024, Future became a WT Microelectronics company, now dual-headquartered in both Montreal, Canada and Taipei City, Taiwan.
Future Electronics’ mission is always to Delight the Customer®. For more information visit www.FutureElectronics.com.
ATLANTA, GA – The average index score reported by the ECIA’s February Industry Pulse survey shows sales optimism continuing to soar at lofty heights. Average sales sentiment inched up to 139.7 from 138.0 in January.
“This marks the ninth straight month of strong positive sentiment overall and in each of the major component categories,” observed ECIA Chief Analyst Dale Ford. “This is also the fifth consecutive month where every subcategory has registered robust positive results. The outlook for March points to expectations for continued robust strength with a projected overall score of 141.1. Results from the Q1 quarterly survey extend this expectation for a healthy sales climate all the way through the first half of 2026,” he continued. “The overall average share of survey respondents reporting positive sales growth was 71% in Q1 and 72% in Q2.
For the complete summary report, click here.
ECIA’s Industry Pulse: Electronic Component Trends and Sentiment provides highly valuable and detailed visibility on industry expectations in the near-term through the monthly and quarterly surveys. This “immediate” perspective is helpful to participants up and down the electronics components supply chain.
The complete ECIA Industry Pulse: Electronic Component Trends and Sentiment Report is delivered to all ECIA members as well as others who participate in the survey. All participants in the electronics component supply chain are invited and encouraged to participate in the report so they can see the highly valuable insights provided by the Industry Pulse: Electronic Component Trends and Sentiment report. The return on a small investment of time is enormous! Members can log in here to see the full report.
The monthly and quarterly Industry Pulse: Electronic Component Trends and Sentiment reports present data in detailed tables and figures with multiple perspectives and cover current sales expectations, sales outlook, product cancellations, product decommits and product lead times. The data is presented at a detailed level for six major electronic component categories, six semiconductor subcategories and eight end markets. Also, survey results are segmented by aggregated responses from manufacturers, distributors, and manufacturer representatives.
Non-members can now purchase the report at https://www.ecianow.org/purchase-stats-reports.
Tokyo, Japan – Panasonic Industry Co., Ltd. will invest approximately 7.5 billion yen into Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd. (Guangzhou Factory), to add an additional production line specifically to manufacture MEGTRON multi-layer circuit board materials, which are widely used in high-speed network systems like AI servers.
Guangzhou Factory produces a wide range of products, from the MEGTRON6, an industry-pioneering Multi-layer Circuit Board Materials for Information and Communications Technology (ICT) infrastructure equipment, to the MEGTRON8, which supports high-speed transmission for AI servers. Going forward, it is positioned as an important production location for cutting-edge materials such as the MEGTRON series for next-generation AI servers that will enable even higher speed transmission.
This announcement follows the recently publicized Panasonic Industry plan to construct a new building and MEGTRON production line at an existing factory located in Ayutthaya, Thailand, which is intended to support printed circuit board (PCB) fabrication customers in Southeast Asia (announced on September 12, 2025). As a part of efforts to bolster global circuit board material production, this new production line in Guangzhou targets PCB fabrication customers in China, a significant market with strong long-term growth prospects. The new line is planned to commence initial manufacturing operations in April 2027, with mass production scheduled for later in the fiscal year.
Along with the evolution and growing adoption of generative AI, the market for ICT infrastructure, including AI servers, continues to expand and data processing volumes are forecasted to grow exponentially. This accelerated growth trend is driving demand for ICT infrastructure devices, such as servers, switches, and routers, which enable faster, higher-capacity communication and high-speed computing. The circuit boards used in these ICT infrastructure devices require low-transmission-loss* materials to enable signals to be transmitted more stably and efficiently.
Leveraging proprietary materials and processing technology, Panasonic Industry is bolstering global production for the MEGTRON series of circuit board materials which deliver industry leading low-transmission-loss performance. Panasonic Industry plans to double the total production capacity of MEGTRON products over the next five years contributing to the growth of the ICT infrastructure market, including AI servers, and the continued innovation of AI technology.
Overview of Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd.