FREUDENSTADT, GERMANY – The Schmid Group, a leading global provider of equipment and solutions for the electronics industry, today announced the successful delivery and installation of its first InfinityLine C+ system for a leading Japanese customer in the Advanced Packaging and high-end substrate market.
The InfinityLine C+ represents SCHMID’s next-generation vertical spin process technology, designed to deliver best-in-class uniformities, touch-free operation, single-panel processing, and fully automated panel handling.
This achievement marks an important milestone in strengthening SCHMID’s innovation leadership in Panel Level Packaging (PLP) and high-density glass substrate manufacturing, further expanding the company’s footprint in one of the world’s most dynamic electronics markets.
A New Standard in Wet Chemical Processing
The InfinityLine C+ platform is designed as a modular, vertical, touch-free cluster tool supporting a wide range of critical wet processes for high-density interconnect (HDI) and advanced substrate applications.
The InfinityLine C+ cluster provides a flexible, tightly integrated wet process environment that minimizes handling, maximizes yield, and supports rapid recipe transitions for dynamic manufacturing conditions.
Technical Highlights & Customer Benefits
Single-panel, touch-free vertical processing for maximum yield and minimum particle contamination
Full automation including FOUP/OHT integration and SCHMID’s MCF logistic system
Highly uniform etching and developing for advanced line-space requirements (down to 2 µm L/S)
Optimized wet chemical architecture ensuring tight process windows for Cu and Ti flash etch
Efficient Wetfilm Stripping based on environmentally friendly DMSO chemistry
Scalable and modular cluster concept, compatible with SCHMID’s InfinityLine H+, V+, and P+ systems
Reduced footprint and minimized manual intervention due to full automation and vertical layout
Together, these features enable higher uptime, stable output, and lower total cost of ownership for customers manufacturing the next generation of advanced substrates and PLP architectures.
Executive Statement
“The successful installation of our InfinityLine C+ is a significant milestone and a strong validation of our wet-process strategy,” said Roland Rettenmeier, CSO of SCHMID Group. “The C+ integrates high-precision developing, selective flash etching, and efficient wet-film stripping into a fully automated, touch-free platform purpose-built for next-generation glass and substrate applications. This system will enable our customer in Japan to advance the development of next-generation Panel-Level Packaging technologies.”
What truly sets the InfinityLine C+ apart is its seamless logistics integration, vertical single panel handling, and its capability to consistently achieve 2 µm line-space performance. These advantages make the C+ a highly competitive solution for manufacturers that demand uncompromising uniformity, flexibility, and yield.
We are proud to support our customer with a system that not only meets today’s advanced packaging requirements but also provides a scalable foundation for future technology generations.”
Outlook & Availability
With the shipment and successful implementation of the first InfinityLine C+ system, SCHMID is entering the commercialization phase. Further customer demonstrations, integrations, and volume-production configurations are now available.
The InfinityLine C+ strengthens SCHMID’s portfolio of advanced wet-process equipment and complements the InfinityLine P+, H+, and V+ platforms, providing substrate and PLP manufacturers with a complete, modular process ecosystem.
Krailling, Germany – November 5th, 2025 – Photonics Systems Group (PSG), a leading expert in laser micromachining specifically for the electronics industry, today announced its inaugural after-hours technical event, the Photonics Tech Evening, to be held on November 19, 2025, during Productronica 2025.
Complementing PSG’s exhibit at the trade show (Hall B2 – Booth 419), the exclusive evening event will take place at the company’s state-of-the-art laser application center at its Munich headquarters, conveniently located just minutes from the Messe München venue. Attendees will gain in-depth insights and hands-on access to PSG’s advanced laser systems engineered specifically for electronics manufacturing, featuring live demonstrations of key electronics manufacturing processes such as microvia drilling, PCB depaneling, precision ceramic cutting, as well as laser trimming for thin-film and thick-film chip resistors and sensors.
The Photonics Tech Evening offers a unique opportunity to explore these cutting-edge capabilities in a focused, interactive environment, with direct access to PSG’s engineering experts for technical discussions and real-world application guidance. “We’re excited to open our advanced applications center and provide industry professionals with hands-on interaction with our latest production-ready laser systems and one-on-one access to our technical specialists,” said Marcus Rennekamp, Photonics Systems Group’s CEO. “This event extends the Productronica experience with unparalleled depth and practical insight into high-precision manufacturing solutions for electronics.”
The event begins at 5:00 p.m. CET, with complimentary shuttle transportation provided round-trip from Productronica to the Munich facility. Registration is required and space is limited. Interested attendees can secure their spot at: https://photonics-systems-group.com/tech-evening/
About Photonics Systems Group
Photonics Systems Group (PSG) specializes in high-precision laser micromachining solutions for electronics manufacturing and semiconductor packaging. Headquartered near Munich, Germany, PSG delivers innovative and scalable system platforms that enable next-generation production capabilities. https://photonics-systems-group.com
Austin, Texas, November 4th 2025 – High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
“I’m excited for the opportunity to participate to the HDP User Group and its comprehensive research activities,” said Stan Heltzel, Materials Engineer and PCB expert at ESA. “International collaboration across market segments is instrumental to address the technical challenges, combining complexity and functionality with reliability. I’m convinced that ESA can contribute with technological expertise and a wide stakeholder network to the HDP projects, and vice versa.”
“I am pleased to welcome the European Space Agency to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of the complex PCBs required for outer space, the harshest use environment. They will contribute significantly to guiding our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
Austin, Texas, November 3, 2025 – High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
“ASKPCB and Sundell are thrilled to join the HDP User Group,” said Fred Hickman, VP of North America Sales. “As part of our continuous drive toward innovation and collaboration, HDP provides an ideal platform to work alongside global leaders in the Technology field. With our new smart-factory operations in Sundell (Thailand facility), we look forward to contributing to HDP initiatives that advance next-generation PCB design, materials and manufacturing processes – while strengthening partnerships across the electronics supply chain.”
I am pleased to welcome ASKPCB to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of complex PCB fabrication for high-performance applications will support many HDP projects. They will contribute significantly to our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
HILLSBORO, OR – OCTOBER 30, 2025 – The NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Hosted at the Wingspan Event and Conference Center on October 22, the expo welcomed hundreds of attendees from across Oregon and Washington, including engineers, purchasing teams, and business leaders representing a wide variety of local manufacturers—not only in electronics, but also in materials, equipment, and related industries. The show floor featured over 50 exhibitors, with manufacturers demonstrating capabilities that spanned the full ecosystem of design, production, advanced materials, assembly, testing, and integrated solutions.
Adding to the energy of the event were special participants from education and research: the Portland State University Rocket Team, the Beaverton School District Robotics Program, and Oregon Museum of Science and Industry (OMSI). Their presence highlighted NEDME’s commitment to connecting industry with education and inspiring the next generation of innovators.
“For more than two decades, NEDME has served as a cornerstone event for our region,” said Mike Foresee, NEDME Steering Committee member. “It’s not just about technology—it’s about creating a space where manufacturers, innovators, educators, and students can come together to share knowledge, build partnerships, and strengthen the Northwest ecosystem.”
The technical program featured sessions on topics ranging from advanced PCB design practices to supply chain resilience and AI-driven engineering tools. Speakers emphasized practical takeaways for companies of all sizes, while exhibitors highlighted innovations tailored to the unique needs of Northwest manufacturers. Exhibitors and attendees alike praised the show for its approachable format and community focus:
“The seminars were not only helpful, but what stood out was the balance of topics—they didn’t just focus on manufacturing, but also included valuable management insights. That broader perspective made them especially worthwhile, and I look forward to seeing more of this approach in the future.” Tom Hauge, President, Fusion EMS.
Special Thanks to Our Sponsors
The success of NEDME 2025 would not have been possible without the support of its sponsors: ASC Sunstone, Screaming Circuits, Citizens Bank, Polar Instruments, QTexAI, Westco Group, MCX, Inc., EPB&B Insurance, Stoel Rives LLP, and Opsahl Dawson. sponsors. Lunch was generously provided by the Electronics Representatives Association (ERA).
BROOKLYN, NY -- Cofactr, the electronics procurement execution platform, today announced the launch of its free to start, complete procure-to-ship service that eliminates procurement busywork for agile hardware manufacturers. Simplifying procurement for complex manufacturers with a free-to-use full-service procurement solution. Hardware teams can now upload a bill of materials (BOM) and let Cofactr's AI agents and warehouses handle sourcing, optimizing for best price and lead times, ordering, traceability, storage, kitting, and delivery to their manufacturer.
The new service addresses a critical bottleneck for hardware companies: engineering teams spending valuable time on procurement tasks instead of product development. With Cofactr's end-to-end execution model, manufacturers get authenticated components delivered production-ready while their teams remain focused on innovation.
“Looking over the last few months, we realized the most accurate representation of our mission is to make Cofactr's solution as accessible as possible," said Phillip Gulley, CSO & Co-Founder at Cofactr. “We believe that at this moment it is imperative that hardware manufacturers be able to move fast. There were two ways we could do that; offering our core electronics solution with no friction to adoption, and by making search access to the core Supplier Discovery database free. At this moment, more so than any in our lives, Cofactr believes that hardware deserves to thrive with as little obstacles as possible.”
Complete Procurement Execution
Cofactr's service combines AI-powered procurement agents with physical warehouse infrastructure to deliver:
Intelligent Sourcing: AI agents analyze BOMs, source components across verified supplier networks, and negotiate pricing automatically
Supplier Discovery: Search over 450,000+ verified suppliers to eliminate single-source supplier bottlenecks and find custom components
Smart Warehousing: Components arrive at Cofactr facilities for authentication, inspection, and storage with complete chain-of-custody traceability
Custom Kitting: Exact quantities split, spliced, and kitted for each build—eliminating excess inventory and partial reels
Direct Delivery: Production-ready components delivered to contract manufacturers on schedule
Real-Time Visibility: Complete tracking from quote to delivery in a unified dashboard
TAR Compliance: Compliant storage and handling for defense and aerospace contractors
The service requires no upfront investment or platform fees. Customers pay only for components and services used, removing traditional barriers to procurement modernization.
Cofactr’s value to manufacturers has always been at the point of connection - selecting, buying from, and tracking parts from different suppliers. As OEMs and suppliers react to tariff hikes and market volatility we’ve seen surges in demand for this connectivity. Enabling trusted, verifiable connections between OEMs and suppliers as part of the entry level Cofactr offering will not only help manufacturers deal with short term shocks, but will build more robust US and regional supply networks in the long run.
"Hardware teams shouldn't need procurement expertise to build great products," said Phillip Gulley, CSO & Co-Founder at Cofactr. “We've developed a platform that lets manufacturers focus on design and final assembly. Procurement and management of electronics should be a turnkey solution, and that's what we provided. Onboard easily and quickly, upload your BOM, and with a few pieces of information, Cofactr handles everything from sourcing through a kit of materials showing up for PCBA with no upfront costs."
Built for High-Mix, Low-Volume Manufacturing
Cofactr's approach is purpose-built for the complexity of modern electronics manufacturing, particularly high-mix, low-volume (HMLV) production environments in aerospace, defense, medical devices, and robotics. The platform handles multi-variant BOMs, obsolescence management, and compliance requirements that typically consume engineering resources.
About Cofactr
Cofactr is a procurement execution platform that handles the complete procure-to-ship process for hardware manufacturers. By combining AI agents with warehouse infrastructure, Cofactr executes sourcing, negotiations, storage, kitting, and delivery—allowing engineering teams to focus on building products instead of managing supply chains. The company’s platform is in use by organizations that build everything from rocket ships, satellites, and drones to robotics, autonomous vehicles, and wearables. These companies not only need to produce and source fast while navigating stringent corporate processes and policies, but those in regulated industries additionally need to comply with governmental requirements. Within Cofactr’s single unified platform, they can now automate and manage the complexities of everything from parts sourcing, supplier procurement, payments, and shipping to cross-vendor logistics, stock availability, and government regulations. Cofactr is ITAR and SOC 2 compliant and runs entirely on AWS’s Government Cloud to meet the requirements of high-compliance industries.
Cofactr is backed by Bain Capital, Y Combinator, Floating Point Ventures, Broom and DNX.
