Atlanta – ECIA is pleased to announce that Stephannie Bronson has accepted the position of ECIA Vice President of Industry Practices.
Stephannie began her career in automotive distribution, where she actively supported industry associations for five years, before transitioning into a 15-year journey in logistics and supply chain leadership. Since joining the electronics industry in 2018, she has continued to expand her influence across the electronic components ecosystem.
At KEMET Electronics, she led inside sales and service operations and held global responsibility for certification and compliance, including Sarbanes-Oxley, Automotive, and Aerospace/Military standards. She partnered with Distribution, Direct, and EMS customers to support growth, regulatory compliance, operational integrity, and customer service. Her work with the WE United Mentorship Committee over the past eight years demonstrates her commitment to developing people, cultivating future leaders, and strengthening the electronics industry.
“Through the various leadership roles that she has held in her 20+year career, Stephannie’s experience brings the perfect balance between a strong understanding of the electronic components industry and expertise in logistics, supply chain and compliance in other industries, which will help her propel the GIPC’s impact to the next level.” explained ECIA’s Sr Vice President Victor Meijers. “We are thrilled to welcome her to our expanding staff and look forward to introducing her to the GIPC and our subject matter expert teams and the rest of our members later this month.”
“The work the Global Industry Practices Committee (GIPC) has already accomplished is truly astounding,” Stephannie added. “I look forward to working with the talented ECIA members who donate their time serving on the GIPC. Their collaboration on white papers, research, process efficiencies, and industry best practices, contribute to the goal of a more transparent, resilient electronics supply chain.”
Stephannie holds a Bachelor of Science in Business Administration with a concentration in Marketing and a minor in Communications from Eureka College. She currently resides in Boynton Beach, Florida, with her husband Brian and enjoys traveling in their spare time.
Freudenstadt, Germany -- SCHMID Group has received a repeat order exceeding EUR 37 million from a leading Chinese customer for advanced HDI-ML and mSAP production equipment. The equipment supports the customer’s next capacity expansion for next-generation AI server boards and optical module applications and follows the successful completion of the first phase supplied by SCHMID in 2025.
The project further confirms SCHMID’s strong position as a leading equipment partner for advanced wet process solutions in mSAP, HDI and high-end interconnect manufacturing. AI infrastructure, high-speed networking and optical communication are driving the need for finer structures, higher signal integrity, better yield and reliable high-volume production.
The ordered equipment will be used for the customer’s next capacity expansion in mSAP production. These processes enable finer line/space structures, higher routing density and improved electrical performance — key requirements for advanced AI server boards and optical module platforms used in modern data centers.
SCHMID already supplied key equipment for the first phase of the customer’s capacity expansion last year. Given strong performance, high uptime, stable processes and excellent production reliability with our InfinityLine H+ and InfinityLine V+ platforms, this major Chinese customer has now selected SCHMID again for the next expansion step.
SCHMID continues to benefit from the accelerating investment cycle in AI-related electronics manufacturing. We see strong momentum in advanced substrate, HDI and mSAP applications.
Order intake in the six months ended June 30, 2026 reached EUR 44.3 million, excluding this order (with this order, order intake since January 1, 2026 amounted to EUR 81.7 million).
Following the recent acceleration in order intake, the Company is currently reviewing an upward revision of its guidance on order intake. The Company is finalizing its updated full year 2026 order guidance and outlook and expects to communicate a revised quantitative guidance with its business update for the second quarter of 2026 on or about July 14, 2026.
Executive Statement
“We are pleased that this customer has chosen SCHMID for the next phase of its HDI-ML and mSAP capacity expansion following completion of the first project. This repeat order reflects the performance and reliability of our InfinityLine H+ and InfinityLine V+ lines in demanding, high-volume industrial production environments.
In critical applications such as AI server boards and optical modules, manufacturers cannot compromise on yield, stability, or uptime. Feedback from our customers confirms that our equipment consistently delivers an outstanding production yield of 99% — a crucial advantage when precision is paramount.
The momentum in AI-related electronics manufacturing is rapidly converting into real capacity investments. As customers transition from technology development into industrial-scale production, SCHMID is uniquely positioned to support this growth with proven wet-process solutions for mSAP, HDI, and high-end interconnect applications,” said Roland Rettenmeier, Chief Sales Officer of the SCHMID Group.
MILPITAS, CA -- July 7, 2026 - SEMI and TechSearch International today announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies worldwide.
The 2026 edition covers more than 820 facilities, up from 750 in the 2025 edition, and adds new fields that help users analyze not only where facilities are located and what assembly and test services they provide, but also the materials, platforms, technologies and end markets they support.
Based on the new classifications, more than 360 facilities report compound semiconductor capabilities, including sites supporting silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP). More than 170 facilities identify AI and high-performance computing (HPC) among their end-market focus, while more than 70 facilities support photonics and optical applications. The new fields also capture substrate and interposer platforms along with broader technology and module capabilities, providing clearer visibility into how global back-end infrastructure is aligning with emerging demand.
“AI infrastructure, photonics and compound semiconductors are expanding the range of capabilities required across semiconductor assembly and test,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “The 2026 database gives users a more detailed view of which facilities support these technologies and end markets, helping them assess supply-chain exposure, identify manufacturing partners and track the evolution of global back-end capabilities.”
The 2026 edition includes the following updates and enhancements:
Expanded Global Coverage: More than 820 facilities worldwide, an increase of more than 70 facilities from the 2025 edition. The largest additions to database coverage were in China and Taiwan.
Compound Semiconductor Visibility: New fields identify whether facilities support compound semiconductors and specify material types including SiC, GaN, GaAs and InP.
End-Market Focus: New classifications provide insight into facilities supporting AI/HPC, automotive, mobile and consumer, industrial, networking and telecom, photonics and optical, and other end markets.
Substrate and Interposer Platforms: New data identifies capabilities across laminate substrates, redistribution layers (RDL), ceramic substrates, silicon interposers and leadframes.
Technology and Module Capabilities: Expanded facility-level descriptions provide additional detail on advanced packaging, modules, test services and specialized technology capabilities.
Updated Facility Profiles: The database continues to provide current information on facility status, ownership, location, plant type, assembly and test capabilities, device focus, automotive certification and operating history.
Updated OSAT Market Benchmarks: The 2026 edition includes updated top 10 OSAT capital expenditure and top 20 OSAT revenue rankings.
The database supports semiconductor manufacturers, equipment and materials suppliers, packaging and test providers, investors, government agencies and analysts seeking to map global manufacturing footprints, compare facility-level capabilities, identify potential partners, evaluate regional concentration and monitor facility openings, closures, expansions and ownership changes.
TOKYO -- Asahi Kasei, a diversified global company, constructed a new slitting facility for SUNFORT™ dry film photoresist (DFR) at its manufacturing site in Tainan, Taiwan, on July 3. Commercial operations are scheduled to commence this month.
Asahi Kasei has been slitting SUNFORT™ DFR at its Tainan site since 1997. In recent years, demand for advanced semiconductor packaging has grown significantly, driven by AI and the resulting increase in data processing requirements. Accordingly, DFR used in semiconductor packaging must also meet increasingly stringent standards for both quality and supply reliability. In this context, Taiwan is a strategically important location with a strong concentration of semiconductor packaging-related companies, making it essential to have a supply system capable of supplying products rapidly and reliably in close proximity to customers.
Slitting is the process by which master rolls of film are cut into narrower widths in accordance with individual customer requirements. It is a critical process that directly impacts both product quality and supply reliability.
To respond to growing market demand for DFR, Asahi Kasei’s new slitting facility is equipped with state-of-the-art machines and some of the most rigorous cleanroom standards for improved productivity and dependable supply. The facility represents an investment of approximately ¥2 billion (approximately $12 million or €11 million) and will expand capacity by 40% with the potential to double current output.
SUNFORT™ DFR delivers ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates for packaging. This approach improves performance and precision in semiconductor manufacturing back-end processes.
Asahi Kasei’s investment in SUNFORT™ DFR aligns with the company’s positioning of its Electronics Business as a strategic growth driver. In May 2025, Asahi Kasei also launched SUNFORT™ TA, its newest DFR series tailored for advanced semiconductor packaging used in AI servers.
Harrisburg, PA. (June 25, 2026) – Millennium Circuits Limited (MCL) today announced a planned leadership transition within its Quality organization as Director of Quality John Waite retires after a distinguished career spanning more than four decades in manufacturing, engineering, operations, and quality leadership. Colin Warren has been promoted to Director of Quality, ensuring a seamless transition and reinforcing MCL's long-term commitment to quality, continuous improvement, and customer success.
Since joining MCL in 2023, John has strengthened the company's Quality Management System, enhanced internal processes, elevated audit readiness, and helped build a culture centered on continuous improvement. Beyond his technical expertise, John's greatest contribution has been investing in people—sharing decades of knowledge, mentoring teammates, and preparing the next generation of quality leaders.
"As I look back on my career, I’m most proud of the people I’ve had the opportunity to work with and mentor," said Waite. "Quality has always been about more than processes—it’s about building teams, developing people, and leaving things better than you found them. I’m grateful for my time at MCL and excited to see what’s ahead for the company."
Warren has worked closely alongside John and has been instrumental in advancing MCL's quality initiatives. His experience supporting the company's quality systems, commitment to operational excellence, and customer-first mindset have prepared him to lead MCL's quality organization as the company continues to invest in advanced PCB technologies and exceptional customer service.
"One of John’s greatest accomplishments wasn’t just strengthening our quality systems—it was preparing the next generation of leaders," said Dan Thau, CEO of Millennium Circuits Limited. "Colin has worked alongside John, learned from his experience, and earned this opportunity. This transition reflects the strength of our team and our long-term commitment to quality for every customer we serve. We thank John for the legacy he leaves behind and are excited to see Colin continue building on that foundation."
This transition reflects MCL's philosophy that lasting quality is built through strong systems, continuous improvement, and developing great people. Customers can expect the same responsiveness, technical expertise, and dependable quality that have become hallmarks of MCL’s offerings while benefiting from a leadership transition that has been built on mentorship and continuity rather than disruption.
The entire MCL team extends its sincere appreciation to John for his leadership, friendship, and unwavering commitment to excellence. We wish him happiness, good health, and fulfillment as he begins his well-earned retirement.
Atlanta – The June market sentiment index average measured by ECIA’s Industry Pulse survey hit a five-year high at 154.1. The all-time high in the average index was achieved more than five years ago, in March 2021, at 157.7.
“The June survey results are surprising,” commented ECIA Chief Analyst Dale Ford. “Especially given that the June forecast in the May survey called for the average index to drop by over 15 points, to 131.1. The actual change between May and June in the average index was a 7.5-point improvement.”
In spite of the actual results in June compared to the forecast, survey participants continue to lack confidence in the future market direction. The forecast for July predicts a drop of nearly 17 points, down to 137.2. “To balance this analysis, it is important to note that the forecast component index averages still range between 129 and 147 – very strong scores well above the 100-point threshold for growth expectation,” Dale concluded.
ECIA’s Industry Pulse: Electronic Component Trends and Sentiment provides highly valuable and detailed visibility on industry expectations in the near-term through the monthly and quarterly surveys. This “immediate” perspective is helpful to participants up and down the electronics components supply chain.
The complete ECIA Industry Pulse: Electronic Component Trends and Sentiment Report is delivered to all ECIA members as well as others who participate in the survey. All participants in the electronics component supply chain are invited and encouraged to participate in the report so they can see the highly valuable insights provided by the Industry Pulse: Electronic Component Trends and Sentiment report. The return on a small investment of time is enormous!
