Technica USA, a leading provider of materials, equipment, and services for the printed circuit board (PCB) fabrication, assembly, MEMS, and semiconductor industries, is pleased to announce the appointment of Jason Perry as its new President.
With 26 years of experience at Technica, most recently serving as Director of Sales, Perry brings deep industry knowledge and a proven track record of leadership. His appointment marks the beginning of an exciting new chapter as the company accelerates its growth and expansion strategy.
Frank Medina, who previously held the role of President and CEO, will transition to Vice Chairman. In this role, he will work closely with Perry, the Board of Directors, and key supply partners to advance the company’s strategic initiatives.
“As one of the original founders of Technica, which was established 40 years ago, I take great pride in passing the leadership to Jason,” said Frank Medina. “His expertise, dedication, and vision make him the ideal person to guide Technica into the future.”
Perry expressed enthusiasm about the company’s direction, stating, “I am highly optimistic about the future of Technica and the industries we serve. We are privileged to represent and distribute products from some of the most respected companies in the markets we serve. With Elite Materials Co. Ltd. (EMC) having controlling interest in Technica, we are uniquely positioned to leverage their world-class management practices, resources and proven strategies that helped EMC surpass $2 billion in sales in 2024.”
As part of its growth strategy, Technica plans to expand its team by hiring 10–15 new employees over the next 12–15 months in key areas such as sales, equipment service, and product specialization.
Medina concluded, “I have full confidence in Jason’s ability to lead Technica into this next phase of success.”
WILMINGTON, DL - DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo, March 18-20, in Anaheim, Calif.
DuPont will share recent developments across its innovative portfolio of advanced interconnects and thermal management solutions designed to meet the complex performance demands of high-tech sectors, including aerospace & defense, automotive, and artificial intelligence (AI).
In Aerospace, DuPont™ Pyralux® laminates and Kapton® polyimide films are vital for high-profile projects, like the James Webb Space Telescope and the Mars Rover, providing the reliability needed for extreme space conditions.
In Defense, laminate materials that form the backbone of PCBs and flexible circuits, used in a multitude of applications, from avionics to missile guidance systems.
For AI, DuPont's solutions are tailored to meet the performance and reliability requirements of AI technologies, enhancing capabilities across chip packages, IC substrate, printed circuit boards (PCBs) and thermal management to support effective functioning in demanding environments.
In EV packaging, DuPont Advanced Flex Technologies address key challengesrelated to electromagnetic interference (EMI) and thermal management withinelectric vehicle (EV) battery architectures, playing a crucial role in optimizingperformance and safety as EV demand rises.
“From powering deep-space exploration to driving the next generation of intelligent systems, our solutions help shape the future of electronics,” said Thean Ming Tan, global business director, Advanced Flex Technologies, DuPont Interconnect Solutions. “We’re excited to engage with industry leaders at IPC APEX Expo, demonstrating how DuPont’s expertise continues to push the boundaries of what’s possible in these demanding environments and applications.”
DuPont ICS will exhibit in the Insulectro booth 4138 where company experts will participate in the Insulectro PowerChats, presenting on a range of topics and capabilities, and will also share booth 3916 with Tritek Circuit Products. Key ICS products and capabilities to be featured at the show:
DuPont™ Pyralux® laminated circuit materials, including Pyralux® ML double-sided metal-clad laminates – the newest addition to the Pyralux® family – designed for thermal management.
DuPont™ Kapton® - the gold standard in polyimide films, offering exceptional versatility and superior thermal performance, designed to excel under extreme conditions.in automotive, aerospace, electronics and medical applications.
Silveron™ GT-210 Durable Silver electroplate designed for electrical contact applications requiring high conductivity, tolerating high temperatures with durability exceeding that of hard gold.
DuPont™ Riston® advanced dry film photoresists, offering high yield, productivity, and ease of use in imaging applications
Interra® thin copper-clad laminates, designed for use as embedded-capacitance materials in multilayer rigid PCBs to offer industry-best mechanical strength, reliability and capacitance stability.
CopperGleam™ PPR-III pulse acid plating copper designed for through-hole plating with high mechanical and thermal reliability.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials, ingredients and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, health and wellness, food, and worker safety. More information can be found at www.dupont.com.
ATLANTA - ECIA is pleased to announce a new resource for component buyers and engineers at [www.ecianow.org/buyers-engineers]www.ecianow.org/buyers-engineers. Customers can find new information about how lead times are calculated, the difference between component cycle times and lead times, new tools for tracking tariffs on specific components, new videos about the industry, and important changes in thinking about date codes and much more.
“After the supply chain disruptions following the pandemic, our members became painfully aware of how much confusion exists in the marketplace about components,” explained David Loftus, ECIA CEO and President. “ECIA is seizing this opportunity to communicate with customers in order to solve industry challenges that for too long have held back overall supply chain efficiencies that would be mutually beneficial.”
“One example is date codes,” added Don Elario, VP of Industry Practices. “With the current excess inventory situation, now is the perfect time to finally institute rational policies and processes to prevent perfectly good components from being destroyed because they are out of date. The science is clear, and we are reaching out engineer to engineer to help customers understand the evidence about the impact of shelf life on component performance.”
The Electronic Components Industry Association (ECIA) is made up of the leading electronic component manufacturers, their independent manufacturer representatives and authorized distributors. ECIA members share a common goal of promoting and improving the business environment for the authorized sale of electronic components. Comprised of a broad array of leaders and professionals representing all phases of the electronics components supply chain, ECIA is where business optimization, product authentication and industry advocacy come together. ECIA members develop industry guidelines and technical standards, as well as generate critical business intelligence. For more information, visit www.ecianow.org or call 678-393-9990.
LEOBEN – Yesterday evening, the International Finance Corporation (IFC), a member of the World Bank Group and the largest global development institution focused on the private sector in emerging markets, and AT&S have signed a sustainability-linked loan agreement for 250 million US dollars at the AT&S headquarters in Leoben-Hinterberg. The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US dollars could be provided by local banks under the same agreement.
The sustainability-linked loan features financial incentives tied to AT&S lowering its annual greenhouse-gas emissions by 31 percent by the year ending March 31, 2028, compared to the baseline for fiscal year 2022.
“We are delighted to have the support of IFC as partner in our growth,” says CFO Petra Preining. “Despite a challenging market environment, we are continuing to expand our plant in Kulim; for AMD’s data center processors AT&S Malaysia will start delivering high-end integrated circuit substrates soon.”
“We’re excited to partner with AT&S on this financing, which ranks as one of the first sustainability-linked loans in Malaysia’s electrical and electronics products industry,” said Carsten Mueller, Regional Industry Director, Manufacturing, Agribusiness and Services, Asia and the Pacific at IFC. “Our investment will help to advance Malaysia’s semiconductor manufacturing ecosystem, while supporting the country in achieving its sustainability goals.”
The loan will support AT&S to further develop the new AT&S plants in Kulim, Malaysia to produce advanced IC substrates that are an integral part of processors for high-performance computing, data centers and AI infrastructure. The facilities in Kulim were built to the highest quality and sustainability standards, with state-of-the-art machinery, recycling systems and a sustainable energy concept.
IFC
IFC — a member of the World Bank Group — is the largest global development institution focused on the private sector in emerging markets. We work in more than 100 countries, using our capital, expertise, and influence to create markets and opportunities in developing countries. In fiscal year 2024, IFC committed a record $56 billion to private companies and financial institutions in developing countries, leveraging private sector solutions and mobilizing private capital to create a world free of poverty on a livable planet. For more information, visit www.ifc.org.
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced Technologies & Solutions
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for VR and AI applications. AT&S has a global presence with production sites in Austria (Leoben, Fehring) as well as plants in India (Nanjangud) and China (Shanghai, Chongqing). A new high-end production site for IC substrates is currently being established in Malaysia (Kulim). In Leoben, a European competence center including series production for IC substrate technologies is being built. Both sites will start production in the financial year 2024/25. The company currently employs 13,000 people. For further information please visit www.ats.net.
Oshkosh, WI: Mike Thiel President of Multicircuits, a leading provider of high-reliability printed circuit boards (PCBs), has announced the addition of a state-of-the-art automated copper via fill process to its advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
Copper via fill technology plays a crucial role in improving signal integrity, increasing thermal conductivity, and enhancing circuit density. This advanced process ensures superior performance for high-density interconnect (HDI) and multilayer PCBs, reinforcing Multicircuits' reputation as an industry leader in precision manufacturing.
“We continuously invest in cutting-edge technologies to provide our customers with the most advanced PCB solutions,” said Mr. Thiel when making the announcement, “The addition of copper via fill strengthens our commitment to innovation and positions us as a premier partner for high-performance electronics manufacturing.”
Dave Kemper, Process Engineering Manager at Multicircuits, highlighted the technical advantages of this new capability: “This new process allows us to manufacture more robust PCBs with improved electrical and thermal properties. Our team has worked diligently to ensure a seamless integration of this process, and we are excited to offer this enhanced service to our customers.”
With the introduction of automated copper via fill, Multicircuits continues to push the boundaries of PCB technology, delivering superior reliability and performance to customers across a wide range of industries.
For more information, visit www.multicircuits.com or contact: Jerry Smith Director of Sales at 920-279-5643 email This email address is being protected from spambots. You need JavaScript enabled to view it.
About Multicircuits:
Multicircuits is a premier manufacturer of high-reliability printed circuit boards, specializing in advanced solutions for aerospace, defense, medical, and telecommunications applications. With a strong commitment to innovation and quality, Multicircuits delivers cutting-edge PCB technology to meet the evolving needs of the electronics industry.
