Press Releases

BANNOCKBURN, IL — IPC's Validation Services Program has awarded an IPC-4103 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper-clad laminates, and prepregs to the global electronics industry. To earn this QPL, TUC successfully qualified their laminate product, TU-1300N, to IPC-4103B, Specification for Base Materials for High Speed/High Frequency Applications.

TUC was not only the first in achieving a QPL to IPC-4103, but also earned the first QPL to IPC-4101, Specification for Base. Materials for Rigid and. Multilayer Printed Boards, more than five years ago.

TUC met or exceeded the IPCs Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.

“Being a trusted supplier to IPC-4103 means that TUC has met the highest standards for production and quality in this leading-edge market,” said George Hsin, chief strategy officer of Taiwan Union Technology Corporation. “PWB suppliers made this QPL their first screen when selecting base materials for IPC-4101 and now we are a trusted supplier for IPC-4103 as well.”

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

“TUC has differentiated itself from the competition by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize TUC as the first world member of trusted QPL suppliers to meet IPC-4103.”

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at This email address is being protected from spambots. You need JavaScript enabled to view it. or +1 847-597-2806.

AUSTIN, TX — TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the role of hybrid bonding.

Chiplet architectures are increasingly being adopted to achieve the economic advantages lost with the high cost of silicon scaling on advanced nodes. With chiplet designs, more silicon is needed to support the disaggregation of the monolithic die into smaller intellectual property (IP) building blocks. Many devices have made the conversion from solder bumps to Cu pillar. FO-WLP processes in production using the Deca M-SeriesTM and TSMC’s InFO use a Cu pillar on the native wafer. Reduced demand for smartphones and PCs this year is changing demand for flip chip packages, but growth will continue. The compound annual growth rate (CAGR) for all types of flip chip devices in units from 2021 to 2026 is 4.5 percent. This includes both solder bump and Cu pillar. Industry-wide capacity utilization was extremely high last year, but has decreased more than 10 percent this year. With continued capacity expansion, utilization will not reach levels seen in 2021 over the next several years.

Despite lower demand for consumer products such as smartphones, Fan-in WLP shipments will increase this year because of continued growth in image sensor demand, particularly for surveillance cameras in China. The WLP count continues to climb for most products. In a few cases, WLP counts have declined in products due to higher levels of integration. The projected CAGR from 2021 to 2026 in units is 7.83 percent. Devices using FO-WLP include application processors, RF, PMICs, audio CODEC, envelope trackers, automotive radar, and some image sensors. Single die are common and multi-die configurations are increasing. A 6.3 percent CAGR in units is projected for 2021 to 2026. Several companies are researching, developing, or installing panel-based production lines. A variety of approaches for large-area production have been developed. No consistent method or panel size has emerged, but several companies have adopted panel sizes of 600 mm x 600 mm. While applications for panels include some portion of the reconstituted wafer market, new applications such as power devices are emerging.

The latest analysis is a 106-page report with full references and an accompanying set of ~140 PowerPoint slides. TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 22,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.

PLANO, TX ― Super PCB , a single source for high quality printed circuit boards (PCBs), announced the appointment of Mike Young, Aligned Solutions, Inc. as its distributor for the following states in the Midwest: Missouri, Minnesota, North Dakota, South Dakota, Kansas, Nebraska, Western Iowa and West Virginia. Mr. Young provides sales and support for Super PCB’s quality PCBs.

Aligned Solutions has been providing information, equipment, materials and services in the Midwest since 1976. In almost five decades in the Midwest, Aligned Solutions has seen the industry change along with the landscape of manufacturing. This has created a different climate for how manufacturing works and how to best support the industry, not to mention how to be a successful rep firm.

Young has more than 30 years of experience in the electronics industry and another six years as a weapons technician in the U.S. Navy with an affiliation to electronics. From the Navy, Young went to Electrovert. For more than 25 consecutive years, he's worked as a manufacturing representative for KDF Company and Aligned Solutions.

Since 2003, Super PCB has been providing the best value in the PCB industry by offering competitive pricing at the highest quality and best-in-class customer support.The team at Super PCB’s mission has been and remains to be the only PCB source that its customers ever need. The company serves the telecom and Wireless, Transportation, Industrial, Medical, Lighting, Consumer Electronics, Energy and IOT industries.

Super PCB offers USA manufacturing to support fast-turn and ITAR requirements, as well as overseas manufacturing facilities to support you prototype and mass production to lower costs. The company’s manufacturing facilities are ISO 9001 certified and UL listed. Super PCB’s state- of-art equipment and technology ensures the highest quality and efficiency.

For more information about Aligned Solutions, visit www.alignedsolutionsinc.com.

For more information about Super PCB, email This email address is being protected from spambots. You need JavaScript enabled to view it., call (214) 550-9837 or visit www.superpcb.com.

WALTHAM, MA — Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, has signed an agreement with Tethon Corporation Inc. (“Tethon 3D”) to develop new materials for its Fabrica 2.0 micro-additive manufacturing system (“micro-AM”).

The agreement is focused on materials with high-performance and specialty specifications, including high temperature, transparent, and carbon nano tubes.

Development of materials, along with breakthroughs in deep learning-based AI and releasing next-generation systems across Nano Dimension’s manufacturing solutions portfolio, are critical in the Company’s ambitious R&D roadmap. The Company welcomes another breakthrough going according to plan.

“Our customers have been asking for a micro-AM platform to manufacture production parts,” said Trent Allen, Chief Executive Officer of Tethon 3D. “The Fabrica 2.0 is a modern marvel of engineering and our material scientists have loved innovating with the platform to create novel materials.”

“We value our relationship with Tethon 3D and are very impressed with the progress they are making thus far,” said Dr. Jon Donner, Product Champion for the Fabrica 2.0. “The development of these materials should further open markets and applications such as electrical connectors, medical devices and microfluidic chips amongst others.”

Nano Dimension (12.1, C119) and Tethon 3D (12.1, A131) will both be highlighting parts at the upcoming Formnext Exhibition in Frankfurt, Germany, November 15-18. Learn more about the Formnext exhibit at https://formnext.mesago.com/events/en.html.

HELSINKI — Greg Grace will leave his position as Incap’s Director of Operations Estonia and Managing Director of Incap Estonia. The recruitment process for a new Director of Operations Estonia and Managing Director of Incap Estonia will begin immediately. Margus Jakobson, Member of the Incap Estonia Management Team responsible for QHSE, is appointed as interim Managing Director of Incap Estonia with immediate effect.

“I thank Greg Grace for his time in Incap and his contribution to the Estonian team’s work,” says Otto Pukk, President and CEO of Incap Corporation.

The members of Incap Group’s Management Team are currently Otto Pukk, President and CEO; Murthy Munipalli, Director of Operations India and Sales APAC; Jamie Maughan, Director of Operations UK; Miroslav Michalik, Director of Operations Slovakia and Antti Pynnönen, CFO.

Irvine, California, USA - TopLine® Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 15 – 18, 2022, in Booth B4-332. The exhibit will include leading TopLine products including CCGA Solder Columns, IC Bonding Wire, Zero Ohm Jumpers, IC JEDEC Trays, and more. TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling, and practice. For more information, visit Booth B4-332 at Electronica.

TopLine recently announced the availability of new low-void CCGA solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.

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