SANTA ANA, Calif., June 03, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards (“PCB”s) and substrates, announced today that it has completed the closing of a new $1.0 billion cash flow senior secured revolver and a repriced and upsized senior secured Term Loan B (“TLB”) in the aggregate principal amount of $400 million.
“Consistent with plans communicated during our May 27th Investor Day presentation, we are excited to announce that we have brought on new credit facilities to strengthen our financial position while providing flexibility to pursue strategic initiatives,” said Dan Boehle, Executive Vice President and Chief Financial Officer. “Together with our solid balance sheet and healthy operational performance, we have enhanced our long-term capital structure to support further sustainable growth and maximize shareholder value in 2026 and beyond.”
TLB Highlights
Repriced and upsized TLB due May 2030 in the aggregate principal amount of $400 million.
The new TLB has been priced at Term SOFR+ 1.75%, a reduction of 50 basis points from our prior term loan B commitments.
Reduced pricing is anticipated to provide meaningful cash interest savings for the remaining term.
Cash Flow Revolver Highlights
The maximum availability under the multi-currency cash flow senior secured revolving credit facility is $1.0 billion, maturing in May 2031.
The new revolver replaced our prior $150 million U.S. and $150 million Asia asset-based-lending (ABL) facilities.
Milledgeville, Georgia, USA – Topline Corporation has released a 50-page product guide of jumpers and spacers, publication 2026-A, fully illustrated and featuring schematics, charts, specifications, land patterns, package outlines, and descriptions of the wide range of zero ohm jumpers and solderable PCB spacers that TopLine offers, including custom configurations.
WESTFORD, Mass.; PARIS, France; and YOKOHAMA, Japan, May 28, 2026 — Valeo, a global leader in mobility technologies, and Zuken, a pioneer in Electronic Design Automation (EDA) software, announce a major strategic partnership. In their joint "Zuken Valeo InnoLab" program, the two companies will create the most advanced and open AI-assisted electronic design platform on the market.
This partnership combines Zuken's cutting-edge AI roadmap with Valeo's "AI Agents" and industrial expertise, creating an ecosystem where the tool and the engineer collaborate in real time.
"For Valeo, Zuken is much more than a software provider; it is a true innovation partner," says Christophe Le Ligné, Vice President Research and Development at Valeo. "The power of Zuken's AI roadmap, combined with the exceptional openness of its architecture, allows us to hybridize our own artificial intelligence tools with their engine. This win-win partnership is the best way to tackle the challenge of automotive complexity by slashing our design times while guaranteeing 100% robustness."
"Our vision at Zuken has always been to provide intelligent tools that adapt to our customers' most complex challenges," states Ryosuke Takagi, Executive Officer, General Manager of R&D Division at Zuken. "Collaborating with a technological leader like Valeo pushes our 'Autonomous Brain' roadmap to its highest level of performance. By opening our System Planner, Design Gateway, and Design Force solutions to Valeo's AI agents, we demonstrate that the true power of AI in engineering lies in the alliance between a high-performance software engine and expert industrial know-how."
The co-innovation is structured around the design flow and combines the unique strengths of each partner:
Functional Generative Design: Using Zuken's System Planner, Valeo deploys its generative AI to instantly create and evaluate optimal multi-criteria architectures based on Valeo's standards.
Digital Continuity: Zuken's open platform ensures integration with Valeo's ecosystem and digital continuity for full traceability for the Automotive SPICE 4.0 (ASPICE4.0) HWE (Hardware Engineering process group) standard. Valeo's AI processes data and reinjects it as automated actions in the platform.
Assisted Detailed Design: Valeo integrates "AI Agents" (virtual copilots) to assist engineers in real time with solution searches, hardware rule verification, and constraint implementation while Zuken develops native AI functions to accelerate schematic entry using Valeo's standardized database.
Auto-Placement and Routing: Physical integration relies on Zuken’s Design Force engine which offers some of the most powerful AI Place and Route (AI-PR) algorithms on the market. To guarantee a "First Time Right" execution, Valeo uses Zuken's SDK to act directly within the tool and "train" this AI on the extreme constraints of the automotive industry.
MILPITAS, Calif. — May 27, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). The Glass Core Substrate Market and Development Trends Report examines the emerging market for glass core substrates, a potential next-generation packaging technology attracting increased attention as AI and high-performance computing (HPC) drive demand for larger and more advanced semiconductor packages.
“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, Senior Director of Market Intelligence, SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption.”
The report highlights increasing industry activity and investment around glass core substrates as companies prepare for the next phase of advanced packaging—providing an independent view of the technology’s market potential, development status, key players, and remaining barriers to commercialization. Under the report’s market-development scenarios, initial production could begin around 2028 in selected high-performance applications, with adoption expanding over time across larger and more complex package architectures. Based on the average of its Positive, Base, and Negative scenarios, the report projects a compound annual growth rate (CAGR) of 67.2% from 2028 to 2040. It also maps an increasingly active global development ecosystem, with companies and research organizations across Asia, North America and Europe advancing glass core substrate technologies.
Key topics covered in the report include:
Market outlook and adoption scenarios for glass core substrates
Technology drivers and barriers to commercialization
Expected applications in AI, HPC, advanced processors, co-packaged optics, and image sensors
Company activities across substrates, glass materials, equipment, processing, inspection, and related supply-chain segments
Development hubs, consortia, and supply-chain structure
Forecast scenarios through 2040
The Glass Core Substrate Market and Development Trends report is available in English and Japanese editions through SEMI Market Intelligence. Download the report.
Mamer (Luxembourg), 19.05.2026 — The Plansee Group has announced that Plansee US Holding Corp. and Manhattan Five Partners LLC have entered into a definitive collaboration framework agreement outlining the formation of a joint venture to establish a strategic tungsten oxide stockpile in the United States.
For the CERATIZIT Group, this is a highly positive strategic milestone: it reinforces our long term positioning on supply chain security — resilient by design, recycling-driven, and anchored in an integrated value chain. It also strengthens the Western processing base that underpins our promise to customers: stability and reliability in an environment shaped by volatility and increasing traceability requirements.
The initiative is designed to ensure a secure supply of tungsten in the United States and reduce reliance on foreign sources for critical minerals. It combines Plansee’s industrial and technological leadership in tungsten oxide processing with Manhattan Five’s expertise in structuring, financing, and managing large-scale infrastructure and strategic asset platforms.
As part of the initiative, Plansee intends to expand production capacity for tungsten oxide at its U.S. facility in Towanda, Pennsylvania — Global Tungsten & Powders (GTP), a division of the CERATIZIT Group — to approximately 12,000 tons per year within a short timeframe. Initial deliveries are expected to start in 2026.
A significant portion of production will support a strategic tungsten oxide reserve intended to serve government, defense, and critical industry demand. Under the joint venture structure, Manhattan Five will oversee warehousing, logistics infrastructure, and long-term asset management, while Plansee will lead production expansion and supply.
Integration and control across the value chain
CERATIZIT’s supply security is built on a fully integrated tungsten value chain as part of the Plansee Group — from tungsten powder to finished tools — creating control over crucial steps and reducing exposure to short-term market fluctuations.
Within CERATIZIT, the GTP division plays a central role in this model. As our raw materials and powder division, GTP strengthens processing, recycling and traceability capabilities that support long-term stability for customers across key industrial sectors.
Recycling-driven supply as a strategic stability factor
CERATIZIT operates a recycling-driven supply chain with a ~90% tungsten recycling rate (FY 2024/25). This circular approach reduces dependence on primary raw materials and lowers the carbon footprint while strengthening long-term supply resilience.
Responsible sourcing and transparent standards
CERATIZIT ensures raw materials are sourced responsibly and transparently through RMI conformant smelters and a strict Supplier Code of Conduct. This supports compliance and traceability expectations in customer supply chains.
What this means for CERATIZIT customers
For customers, the value is clear:
Stronger Western processing base supporting long-term stability and planning reliability
Resilience enabled by an integrated value chain and control of crucial steps
Recycling-driven supply security supported by a ~90% tungsten recycling rate (FY 2024/25)
Responsible sourcing and transparent standards through RMI-conformant smelters and a strict Supplier Code of Conduct
AUSTIN, TX, UNITED STATES -- Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the company’s new gold and silver nanoparticle inks from its UTDots portfolio, which will be commercially available through Sigma-Aldrich. The new product family includes six conductive ink formulations with a focus on green solvents and optimized for inkjet and aerosol jet deposition platforms, enabling high-performance additive manufacturing across applications ranging from wearable devices and biosensors to RF systems, EMI shielding, and advanced defense electronics.
The launch includes the following commercially available formulations:
UTD-Ag-25IJ
UTD-Ag-40IJ
UTD-Ag-60PA
UTD-Au-25IJ
UTD-Au-40IJ
UTD-Au-60IJ
As manufacturers increasingly shift toward digital fabrication methods, UT Dots’ nanoparticle inks are designed to provide the conductivity, process stability, and scalability required to move printed electronics beyond prototyping and into broader commercial deployment.
“The printed electronics market is moving rapidly toward higher-performance, digitally manufactured systems that demand both precision and scalability,” said Alex Didenko, engineer at Electroninks, managing the product development of the UTDots portfolio.. “Our new nanoparticle ink portfolio was developed to help engineers and manufacturers bridge that gap with materials capable of supporting everything from flexible consumer devices to highly demanding aerospace and defense applications.”
Engineered for Precision Across Modern Printing Platforms
The new ink portfolio is designed to support a broad range of additive manufacturing workflows and geometries. UT Dots’ inkjet-compatible formulations are optimized for stable and repeatable droplet formation, enabling fine-feature patterning with minimal variability across flexible and rigid substrates alike. The aerosol jet-compatible series extends those capabilities further, supporting conformal deposition on complex three-dimensional surfaces with feature widths below 200 microns.
This flexibility enables manufacturers to print conductive structures on everything from planar flexible circuits to curved integrated systems without sacrificing precision or consistency.
Near-Bulk Conductivity for High-Performance Applications
Following sintering, UT Dots’ silver nanoparticle inks achieve resistivity values between 3–10 microhm-centimeter, approaching the performance characteristics of bulk silver while maintaining compatibility with additive manufacturing processes.
The company’s gold nanoparticle formulations achieve conductivity levels within 2–7x of bulk gold and support photonic curing in the 500–550 nm wavelength range. This capability allows conductive structures to be processed on temperature-sensitive substrates that are incompatible with conventional high-temperature thermal curing methods.
These performance characteristics position the materials for demanding applications requiring high conductivity, low-profile form factors, and advanced integration flexibility.
Accelerating Innovation in Printed Biosensing
UT Dots’ gold nanoparticle formulations are also designed to support emerging biosensing and diagnostic applications. Gold’s inherent biocompatibility, oxidation resistance, and compatibility with thiol-based surface chemistry make the UTD-Au series particularly well suited for applications including:
Enzymatic glucose sensors
Immunoassay platforms
DNA detection arrays
Lab-on-chip microelectrode systems
By enabling mask-free additive fabrication through inkjet printing, the platform significantly shortens the design-to-prototype cycle compared to traditional lithography-based manufacturing methods. The result is faster iteration, reduced material waste, and improved development flexibility for researchers and medical device developers.
Designed for Commercial Scalability
Beyond laboratory development, UT Dots engineered the new ink platform to support long-term manufacturing scalability. The formulations are produced using standardized synthesis processes and strict quality-control methodologies designed to ensure strong batch-to-batch consistency. This allows manufacturers to maintain predictable electrical and processing performance as products transition from early-stage development into commercial production environments.
“As electronic microdevices continue maturing into broader application spaces, including medical devices and advanced sensors, material consistency and reliability become just as important as conductivity,” stated Melbs LeMieux, cofounder and president of Electroninks, UT Dots’ parent company. “We built this portfolio to support our continuous expansion of advanced materials to address new markets and customers.”
The new conductive ink portfolio is available immediately for customer evaluation and commercial integration. For more information on UT Dots products and solutions, please visit www.utdots.com.
