SANTA CLARA, CA – APCT, a leading name in the PCB and electronics industry, is pleased to announce the appointment of Rich Halvas as its Chief Financial Officer. Halvas brings with him over 20 years of financial leadership experience.

“I’m thrilled to be joining the APCT team at such a pivotal time in the printed circuit board and electronics industry,” Halvas said. “I was immediately inspired by the forward-thinking leadership of the organization, and I look forward to helping advance APCT into a new phase of growth and innovation.”

“APCT could not have found a better fit for CFO than Rich Halvas,” said Peter Austin, APCT CEO. “With decades of financial experience and industry expertise, Rich is uniquely positioned to guide the company’s path toward becoming the leading manufacturer of printed circuit boards in the world.”

Halvas most recently served as the Chief Financial Officer and the VP of Integration at SEAKR Engineering, a prominent provider of advanced electronics for space applications. His tenure at SEAKR culminated in an acquisition by Raytheon Technologies, a process Halvas guided SEAKR through.

PORTLAND, OR – ASC Sunstone Circuits (a division of American Standard Circuits), provider of high-quality printed circuit boards (PCBs) and Screaming Circuits (a division of Milwaukee Electronics), specialists of quick-turn prototype and on demand PCB assembly, successfully concluded its inaugural Tech Summit held at the Holiday Inn Columbia Riverfront April 25, 2024. The event brought together industry experts, innovators, and thought leaders to discuss emerging trends, share insights, and foster collaboration within the PCB community.

The Tech Summit featured a dynamic lineup of keynote speeches, panel discussions, and networking opportunities designed to address new technology and key topics facing the PCB industry. Attendees had the opportunity to engage with industry pioneers, explore cutting-edge technologies, and gain valuable insights to drive innovation and growth.

Highlights of the summit included:

Industry Expert presentations: Renowned industry leaders delivered best practices and complex technology, offering valuable perspectives on the future of PCB design, manufacturing, and assembly.

Panel Discussions: Experts panel convened to further discuss critical topics and answer questions from the events’ attendees.

"We are thrilled with the overwhelming success of our inaugural Tech Summit," said Anaya Vardya, CEO of American Standard Circuits. "The event provided a unique platform for designers and engineers to come together, learn new techniques, and get questions answered from industry experts.

Jered Stoehr, CEO of Milwaukee Electronics added, “We are committed to fostering collaboration and driving innovation within the PCB community, and we look forward to building on the success of this year's summit in the years to come."

The Tech Summit highlights the strong partnership between ASC Sunstone and Screaming Circuits, emphasizing their commitment to the local PCB community and beyond. Through their collaboration, they are driving innovation and fostering growth within our community and contributing to the advancement of the PCB industry.

For more information about the Tech Summit, please visit the events RESOURCES.

CAMBRIDGE, UK – Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, antennas were positioned on PCBs; now, there's a shift towards integrating antennas directly onto the same package as the RF chip. Known as Antenna-in-Package (AiP), this advanced packaging technique capitalizes on the short wavelengths of mmWave applications, allowing for the creation of notably compact antennas seamlessly embedded within semiconductor packages. Unlike traditional discrete antennas assembled on PCBs, AiP integrates the antenna with the transceiver on a single chip, offering advantages such as improved antenna performance and substantially reduced package footprints.

While 6G research is progressing, the 5G mmWave market remains in its early stages, awaiting widespread adoption across various applications and user ecosystems. The advancement of Antenna-in-Package (AiP) technology is closely intertwined with the growth of both the 5G mmWave and future 6G markets. With AiP expected to be integral to all 5G mmWave-based stations and 5G-enabled devices such as smartphones, its ongoing development is pivotal.

In the development of Antenna-in-Package (AiP) technology for high-frequency communication devices, cost-effectiveness is paramount, aiming for a target price of $2 per 1x1 AiP module to enable widespread adoption. Achieving affordability involves overcoming a chicken-and-egg challenge where adoption must precede cost reduction through economies of scale. Utilizing cost-effective packaging materials and processes and ensuring miniaturization are crucial, especially for integration into consumer devices like smartphones. High performance is vital, necessitating the fabrication and integration of high-gain, broadband mmWave antenna arrays, alongside addressing electromagnetic compatibility (EMC) and optimizing signal integrity (SI) and power integrity (PI). Reliability is ensured through efficient heat dissipation, while scalability enables modules to meet diverse application needs. IDTechEx's report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into key considerations such as antenna element choice, substrate technology, integration of passive devices, and supply chain maturity. This article will focus on the choice of substrate technology, as it is the key influencer of all the abovementioned requirements.

Various factors must be considered when determining the appropriate substrate technology for AiP. These include core material choices, such as coefficient of thermal expansion (CTE), Young's modulus, moisture absorption, and thermal conductivity. The manufacturing capability of chosen substrates, including via size, metal layer counts, and line/space features, is also crucial. Moreover, Dk and Df for antenna layers, bumping technology, embedding technology, among others, play significant roles. For instance, lower insertion loss correlates with reducing the number of metal layers in routing, necessitating scaling dimensions of microvias (blind vias). Additionally, high current densities from power amplifier ICs demand numerous through-vias or plated-through-holes (PTHs) on the package substrate, underscoring the importance of precise dimensions for supporting I/O density and signal integrity. Effective power delivery requires specific aspect ratios at < 20 µm pitch, highlighting the complexity of substrate design. AiP substrate material requirements significantly influence antenna performance. A lower dielectric constant (Dk) widens bandwidth and enhances gain, while a high Dk enables smaller AiP sizes. Low dielectric loss (Df) contributes to increased efficiency. High Young's modulus ensures stiffness and reduces warpage, while low coefficient of thermal expansion (CTE) cores better match silicon. Zero moisture absorption is crucial for stability. Smooth surface roughness is needed for low-loss interconnects. Passive component integration requires thicker metallization, low dielectric losses, and flexibility in metal layers.

Presently, four substrate candidates are being considered for AiP technology: HDI (High Density Interconnect) based on low-loss materials, LTCC (Low-Temperature Co-fired Ceramics), High-Density Fan-Out, and glass substrate technology. Among these options, HDI is currently the incumbent technology for AiP. On the other hand, LTCC technology finds its primary application in high-frequency communication sectors, notably in the defense and aerospace industries, where cost considerations hold less weight.

Comparing organic-based substrates like HDI and Fan-out, HDI-based AiP demonstrates the highest supply chain and market maturity, translating into price advantages. However, its routing features, including metal roughness, line/space features, and via diameter, as well as overall package thickness, lag behind emerging fan-out technology. With the ongoing trend of wearables miniaturization, fan-out technology is expected to play a pivotal role in AiP development. Turning to inorganic packages like LTCC and Glass, inorganic AiP offers superior device reliability due to its non-reactivity with moisture compared to organic-based substrates. Glass exhibits notably better routing features than LTCC. However, the primary challenge for glass substrates lies in their immaturity within the supply chain and ecosystem. While LTCC boasts manufacturing and supply chain maturity, it faces hurdles in improving routing features. LTCC substrates, produced through screen-printing and co-firing, feature large RDL features (~100 μm), resulting in decreased signal routing density and increased module complexity.

Back to the initial question - which substrate tech rules for 5G and 6G AiP? IDTechEx anticipates that HDI will maintain its leading position across both infrastructure and consumer devices in the foreseeable future. This is attributed to the maturity of its supply chain and its cost-effectiveness as primary drivers. Nevertheless, this doesn't discount the potential role of inorganic substrates. IDTechEx foresees continued growth in the LTCC and glass market for AiP, particularly with the expanding 5G mmWave market. As for consumer devices, the emergence of mmWave-enabled gadgets is expected to propel the adoption of fan-out technology for AiP despite HDI's current dominance. Fan-out technology offers advantages in package miniaturization and performance, with the higher cost being justified by economies of scale.

The IDTechEx report "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies tailored for 5G mmWave and emerging 6G networks. It analyzes substrate technologies, including organic, LTCC, and glass, alongside packaging methods such as flip-chip and fan-out, from material properties to manufacturing feasibility. The report explores antenna integration beyond 100 GHz, offering case studies and addressing prevalent challenges, projecting a future driven by advanced semiconductor packaging solutions.

Key aspects of the report include

Overview of 5G mmWave Development and 6G Roadmap:

• Explore the status of 5G mmWave development, technology innovation roadmap, key applications, and market outlook.
• Understand the landscape of 6G, including potential spectrum, enabling THz communication technologies, key research and industry activities, roadmap, technical targets, and applications.

Deep Dive into Beamforming Technologies Enabled by Phased Array Antenna for 5G mmWave:

• Compare beamforming technologies of 5G sub-6 vs mmWave.
• Examine phased array technologies, including antenna, semiconductor, and packaging integration components, technical requirements, trends, and design considerations.

Antenna Integration Technologies for 5G mmWave:

• Discuss antenna substrate technology, benchmarking, material requirements, and packaging for phased arrays.
• Explore various antenna packaging technologies for 5G mmWave, including antenna on PCB and antenna in package (AiP), categorized by packaging technologies: Flip-chip vs fan-out. Also, discuss substrate material choices, such as LTCC, low-loss organic-based, and glass, covering production challenges, material choices and benchmark, solutions/case studies from key players, and substrate design considerations for each packaging technology.

Antenna Integration Technologies for Applications Beyond 100 GHz:

• Address challenges in 6G transceiver development, focusing on power requirements, antenna gain, and phased array demands.
• Discuss various potential packaging technologies for beyond 100 GHz applications, covering thermal management options and low-loss material choices for antenna substrates. Include case studies showcasing D-band (110-170 GHz) phased array technology.

10-year granular market forecast of:

• 5G infrastructure:
  • 5G mmWave base station forecast 2023-2034
  • Antenna Elements Forecast (Infrastructure)
  • AiP for 5G mmWave infrastructure shipment forecast 2023-2034
  • AiP for mmWave 5G infrastructure shipment forecast by packaging technology 2024-2034
  • mmWave antenna substrate forecast for 5G infrastructure (m2) 2023-2034
  • mmWave antenna substrate forecast by material type for 5G infrastructure 2023-2034

• 5G consumer devices: Smartphone and CPE
  • AiP module shipment in mmWave compatible smartphone forecast 2023-2034
  • AiP module shipment in mmWave-compatible smartphones by packaging technology 2023-2034
  • mmWave smartphone antenna area substrate by packaging technology 2023-2034
  • 5G mmWave CPE shipment forecast 2023-2034
  • 5G CPE mmWave AiP module shipment forecast by packaging technology 2023-2034
  • 5G CPE mmWave AiP substrate area forecast by packaging technology 2023-2034

To find out more about the IDTechEx report report "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", including downloadable sample pages, please visit www.IDTechEx.com/AiP 

West Chicago, IL – May 20, 2024 – American Standard Circuits (ASC) and ASC Sunstone Circuits are excited to announce their participation in PCB East 2024, a premier event for the printed circuit board and electronics design industry. The event will take place from June 4-6, 2024, at the Boxboro Regency Hotel and Conference Center in Boxborough, MA.

Visitors to the ASC Sunstone booth will have access to educational resources and physical samples showcasing the company's various PCB technologies. Experts from ASC Sunstone will be available to answer technical questions and provide guidance on selecting the best solutions for PCB quoting and ordering.

“We are thrilled to exhibit at PCB East 2024 and engage with the PCB community,” said Matt Stevenson, VP/General Manager of ASC Sunstone. “This event provides an excellent platform to share our latest advancements and connect with industry leaders and customers.”

Join Us at PCB East 2024

American Standard/Sunstone Circuits invites all attendees to visit booth 202 for an in-depth look at their products and to discuss how ASC Sunstone can meet the needs of their PCB projects. Whether you are a designer, engineer, or PCB enthusiast, ASC Sunstone promises to offer valuable insights and exciting advancements in technology. Register to attend HERE.

In addition to the exhibit, ASC Sunstone is proud to announce that Anaya Vardya, CEO of American Standard Circuits, will be a member of the UHDI Forum at PCB East 2024. This forum promises to provide valuable insights into the latest advancements and applications of UHDI in the PCB industry. For more details, register for the forum.

About ASC Sunstone

American Standard Circuits (ASC) and Sunstone Circuits have joined forces to become the ultimate PCB solution provider with over 50 years of combined industry experience. ASC excels in producing Ultra HDI, rigid, metal-backed/core, RF/microwave, flex, and rigid-flex PCBs for diverse industries, while Sunstone Circuits is known for quick-turn, high-quality PCBs and exceptional customer support. This strategic alliance combines ASC's certifications and expertise with Sunstone's commitment to excellence, setting a new standard in PCB manufacturing. Together, they provide full scale solutions for engineers, from design to prototype to large-scale production.

For more information about ASC Sunstone and their product lineup, please visit www.ascsunstone.com.