WESTFORD, MASS – Today, Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.

Zuken has also signed an agreement with IBM for the joint research and development of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3-D integrated circuit (3DIC) packaging design for advanced semiconductors and optimizing Electronic Design Automation (EDA) workflows. Zuken will support the evaluation of a prototype deep learning accelerator core from IBM’s digital and analog projects. Additionally, Zuken will contribute to material development and processes modeling, and integration assembly methods for interconnecting multiple IC dies within a semiconductor packaging module. The agreement will further focus on reliability testing, performance simulation, and hardware validation.

"Zuken is pleased to collaborate with IBM Research as a member of the AI Hardware Center and joint development partner," said Kazuhiro Kariya, Zuken's Senior Managing Executive Officer and CTO. "Our unique system-level design platform supports innovation in 3DIC heterogeneous integration design process by enabling a practical SOC/package/PCB co-design environment. Zuken aims to play an important role in the next-generation high-end device development ecosystem."

“We are thrilled to be working with Zuken to accelerate chip packaging and AI hardware innovation,” said Jeff Burns, Director of the IBM Research AI Hardware Center. “These advances will play a critical role in unlocking the performance and efficiency needed for the future of AI.”

Zuken views 3DIC packaging design as a key enabler for future technological innovation and continues to invest in R&D. Open collaboration with industry consortiums is critical, and our collaboration with IBM Research reflects our commitment to expanding technological capabilities and providing innovative solutions to our customers.

About Zuken

Zuken is a global software company providing industry leading electrical and electronic design solutions. Founded in 1976, Zuken has a long track record of technology innovation and financial stability in the electronic design automation (EDA) industry. With a product portfolio of world-class design solutions spanning MBSE-based product definition and services to electrical and electronic design solutions to address the needs of a broad range of industries across the globe. These design solutions provide our customers with improved productivity and efficiencies in this highly competitive landscape. For more information about the company and its products, visit www.zuken.com.

TROY, MI - Altair, a global leader in computational intelligence, has named Var Group – through its competence brand Var Industries – as a channel partner for the EMEA region. Var Group will offer Altair's full portfolio of cutting-edge simulation, data analytics, and artificial intelligence (AI) technologies to its customers to optimize their operations, drive innovation, and unlock new opportunities.

"Var Group's digital transformation expertise and commitment to delivering innovative solutions aligns perfectly with Altair's vision of empowering businesses with advanced, intuitive technology," said Kimon Afsaridis, managing director of Eastern Europe and vice president of indirect EMEA sales, Altair. "We look forward to working with Var Group to expand our reach and help more organizations drive more intelligent decision-making and enhanced efficiency through simulation, data, and AI."

"We are thrilled to partner with Altair: a globally recognized leader with whom we share fundamental values, an innovative market vision, and a proven customer-centric approach," said Filippo d'Agata, head of Var Industries. "This collaboration enables us to expand our portfolio with advanced AI, data analytics, and simulation solutions, adding new expertise and tools to meet all industries' increasingly complex needs. Together, we can provide businesses with integrated, high-value solutions that accelerate innovation, enhance efficiency, and drive transformation in an ever-evolving market."

Altair collaborates with a global network of channel and technology partners. To learn more or to become a partner, visit https://altair.com/altair-partners.

About Altair

Altair is a global leader in computational intelligence that provides software and cloud solutions in simulation, high-performance computing (HPC), data analytics, and AI. Altair enables organizations across all industries to compete more effectively and drive smarter decisions in an increasingly connected world – all while creating a greener, more sustainable future. To learn more, please visit www.altair.com.

Technica USA, a leading provider of materials, equipment, and services for the printed circuit board (PCB) fabrication, assembly, MEMS, and semiconductor industries, is pleased to announce the appointment of Jason Perry as its new President.

With 26 years of experience at Technica, most recently serving as Director of Sales, Perry brings deep industry knowledge and a proven track record of leadership. His appointment marks the beginning of an exciting new chapter as the company accelerates its growth and expansion strategy.

Frank Medina, who previously held the role of President and CEO, will transition to Vice Chairman. In this role, he will work closely with Perry, the Board of Directors, and key supply partners to advance the company’s strategic initiatives.

“As one of the original founders of Technica, which was established 40 years ago, I take great pride in passing the leadership to Jason,” said Frank Medina. “His expertise, dedication, and vision make him the ideal person to guide Technica into the future.”

Perry expressed enthusiasm about the company’s direction, stating, “I am highly optimistic about the future of Technica and the industries we serve. We are privileged to represent and distribute products from some of the most respected companies in the markets we serve. With Elite Materials Co. Ltd. (EMC) having controlling interest in Technica, we are uniquely positioned to leverage their world-class management practices, resources and proven strategies that helped EMC surpass $2 billion in sales in 2024.”

As part of its growth strategy, Technica plans to expand its team by hiring 10–15 new employees over the next 12–15 months in key areas such as sales, equipment service, and product specialization.

Medina concluded, “I have full confidence in Jason’s ability to lead Technica into this next phase of success.”

WILMINGTON, DL - DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo, March 18-20, in Anaheim, Calif.

DuPont will share recent developments across its innovative portfolio of advanced interconnects and thermal management solutions designed to meet the complex performance demands of high-tech sectors, including aerospace & defense, automotive, and artificial intelligence (AI).

• In Aerospace, DuPont™ Pyralux® laminates and Kapton® polyimide films are vital for high-profile projects, like the James Webb Space Telescope and the Mars Rover, providing the reliability needed for extreme space conditions.
• In Defense, laminate materials that form the backbone of PCBs and flexible circuits, used in a multitude of applications, from avionics to missile guidance systems.
• For AI, DuPont's solutions are tailored to meet the performance and reliability requirements of AI technologies, enhancing capabilities across chip packages, IC substrate, printed circuit boards (PCBs) and thermal management to support effective functioning in demanding environments.
• In EV packaging, DuPont Advanced Flex Technologies address key challengesrelated to electromagnetic interference (EMI) and thermal management withinelectric vehicle (EV) battery architectures, playing a crucial role in optimizingperformance and safety as EV demand rises.

“From powering deep-space exploration to driving the next generation of intelligent systems, our solutions help shape the future of electronics,” said Thean Ming Tan, global business director, Advanced Flex Technologies, DuPont Interconnect Solutions. “We’re excited to engage with industry leaders at IPC APEX Expo, demonstrating how DuPont’s expertise continues to push the boundaries of what’s possible in these demanding environments and applications.”

DuPont ICS will exhibit in the Insulectro booth 4138 where company experts will participate in the Insulectro PowerChats, presenting on a range of topics and capabilities, and will also share booth 3916 with Tritek Circuit Products. Key ICS products and capabilities to be featured at the show:

• DuPont™ Pyralux® laminated circuit materials, including Pyralux® ML double-sided metal-clad laminates – the newest addition to the Pyralux® family – designed for thermal management.
• DuPont™ Kapton® - the gold standard in polyimide films, offering exceptional versatility and superior thermal performance, designed to excel under extreme conditions.in automotive, aerospace, electronics and medical applications.
• Silveron™ GT-210 Durable Silver electroplate designed for electrical contact applications requiring high conductivity, tolerating high temperatures with durability exceeding that of hard gold.
• DuPont™ Riston® advanced dry film photoresists, offering high yield,
  productivity, and ease of use in imaging applications
• Interra® thin copper-clad laminates, designed for use as embedded-capacitance materials in multilayer rigid PCBs to offer industry-best mechanical strength, reliability and capacitance stability.
• CopperGleam™ PPR-III pulse acid plating copper designed for through-hole plating with high mechanical and thermal reliability.

About DuPont

DuPont (NYSE: DD) is a global innovation leader with technology-based materials, ingredients and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, health and wellness, food, and worker safety. More information can be found at www.dupont.com.