Leoben/Graz, February 11, 2026 – AT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies. The new research area combines expertise from three institutes of the Faculty of Electrical Engineering and Information Technology at TU Graz. The aim is the sustainable development of an interdisciplinary field of research and education that focuses on those technologies that make modern microchips powerful, efficient and applicable.
The research group, financed by AT&S for a period of five years, will be anchored at the Institute of Electronics, the Institute of Electrical Drives and Power Electronic Systems and the Institute of High Frequency Technology at Graz University of Technology. Outstanding scientific personalities are being sought for two PhD and one PostDoc position as well as a career professorship to build up the research area. Together they should form an internationally visible research group that develops innovative approaches for IC substrates and advanced packaging technologies. In addition to research, involvement in teaching and the promotion of young talent are key elements of the initiative.
With this step, AT&S is consistently pursuing a long-term research and development strategy: following the opening of the first European competence center for research, development and IC substrate production in Leoben (“Hinterberg 3”) last year, the company is now also strengthening university research. The close integration of industrial practice, cutting-edge research and training is thus being further intensified.
Research for the next generation of microelectronics
The new research area focuses on advanced packaging technologies and IC substrates, a field of knowledge that is rapidly gaining in importance worldwide and is indispensable for high-performance computers, artificial intelligence, networked industrial systems and applications in mobility and medical technology. IC substrates form the technological platform on which modern chips can develop their full potential, even if the requirements for computing power, miniaturization and energy efficiency continue to increase.
“This research initiative is a targeted investment in our technological future,” says Peter Griehsnig, Chief Technology Officer (CTO) of AT&S. “Since semiconductor chips alone can no longer enable rapid progress, microelectronics must now be considered as a complete system. Only in combination with highly developed substrates and packaging technologies the full innovation potential of microelectronics can be exploited. It is precisely this complementary knowledge that we want to systematically expand together with TU Graz.”
Graz University of Technology also emphasizes the importance of the initiative: “The close interlinking of scientific excellence and industrial innovative strength brings new technologies into application much faster,” says Horst Bischof, Rector of Graz University of Technology. “The common goal of AT&S and TU Graz is to make systems with integrated circuits more powerful, more compact, more reliable and more energy-efficient. With this initiative, we are jointly taking an important step towards strengthening Europe’s technological sovereignty and the competitiveness of the location in the long term.”
mSAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive process” – a technology in which the conducting paths used to conduct signals on a printed circuit board or substrate are not etched out of a copper layer in the usual way. Instead, the conductive material is only applied to the PCB in places where it is actually needed. Unlike the conventional method, this enables significantly tighter signal lines and smaller distances between the conducting paths.
By adopting this technology, AT&S, as a leading PCB manufacturer, is increasing the number of increasingly small structures that can be placed on a PCB. With mSAP, copper is only applied to the places where electricity will later flow. What’s more, it is done so precisely that the conducting paths can be placed closer together. mSAP (Modified Semi Additive Process) takes miniaturization in microelectronics to the next level.
Benefits of mSAP
mSAP saves space as it allows denser conducting path layouts. This opens the way for the miniaturization of PCBs and devices.
Short signal paths enhance signal transmission on the PCB.
mSAP offers better performance at a smaller size.
Radically thin PCBs for radically thin devices.
mSAP shrinks PCBs, freeing up space for sensors, cameras and larger batteries.
Radical miniaturization
mSAP provides another boost to miniaturization for the electronics industry, as circuits can be planned and realized in exceedingly compact spaces, thanks to their smaller form factor. It also reduces the risk of short circuits on densely packed circuit boards, because (unlike their chemically created counterparts) mSAP conducting paths do not require triangular cross sections. This means that although the distances between the lines grows smaller, there is no risk of signal interference.
With mSAP, powerful electronic circuits can be installed in the smallest of spaces, which is essential for very thin, compact device like smartphones. mSAP (Modified Semi Additive Process) is also ideal for processing the high-frequency signals that will be used by future generations of mobile networks. The compactness of mSAP PCBs and their short signal paths allow them to process high-frequency signals with virtually no loss. mSAP systems have recently proven their worth in the development of cameras for modern smartphones. Only the highly compact mSAP PCBs made it possible to combine multiple cameras in one microelectronic system. Radical miniaturization of this kind also lowers the power requirements – an incredibly important consideration for devices that rely on batteries.
Waterbury, Conn. – February 3, 2026 - Element Solutions Inc (ESI) today announced the completion of its acquisition of the Micromax conductive pastes and inks business, effective February 2, 2026. Micromax will operate within MacDermid Alpha Electronics Solutions, part of ESI’s Electronics segment.
The acquisition strengthens ESI’s position as a leading global supplier of specialized electronic materials serving the electronics design and manufacturing industry. By combining Micromax’s expertise in conductive pastes, inks, and ceramic materials with MacDermid Alpha’s broad electronics materials portfolio, ESI expands its ability to support innovation across advanced and high-reliability electronics applications.
“The acquisition of Micromax is a strong strategic fit for ESI and reinforces our focus on high-value, technology-driven businesses,” said Richard Fricke, President, Electronics, adding “Micromax’s differentiated materials and long-standing customer relationships further strengthen our Electronics segment and expand our ability to support innovation across the electronics manufacturing ecosystem.”
Building Breakthroughs by Leveraging Our Combined Expertise
With Micromax now part of MacDermid Alpha Electronics Solutions, customers gain access to a broader, highly complementary portfolio of advanced electronic materials designed to enable performance, reliability, and design flexibility. The combined portfolio includes thick-film conductive inks compatible with polymer films, glass tapes, metals, and ceramics, as well as Low Temperature Co-Fired Ceramic (LTCC) materials that support high multilayer circuit density and withstand extreme operating environments.
These materials are used in critical electronic functions, such as circuitry, interconnection, and packaging and serve a wide range of end-use markets, including automotive and advanced mobility, telecommunications/5G infrastructure, consumer electronics, aerospace and defense, and medical devices.
“Micromax brings highly complementary technologies and deep materials expertise that align naturally with MacDermid Alpha’s mission,” said Bruce Moloznik, Sr. VP Business Integration, MacDermid Alpha Electronics Solutions. “Together, we are building breakthroughs that help customers accelerate innovation, deliver high reliability, and compete with confidence in demanding electronics markets.”
COSTA MESA, CA – TTM Technologies has reached a multi-year agreement with Raytheon, an RTX business, to provide radio frequency assemblies, electronic hardware, and printed circuit boards for Raytheon’s Lower Tier Air and Missile Defense Sensor (LTAMDS) program.
Read more: TTM Technologies Inks $200M Agreement with Raytheon for LTAMDS Program
WASHINGTON—Jan. 28, 2026—The Semiconductor Industry Association (SIA) today announced John Neuffer will retire during the middle of 2026 following a highly successful 11-year tenure as SIA president and CEO. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“John has been an outstanding leader for the semiconductor industry at a time when U.S. technology leadership truly matters,” said Dr. Lisa Su, AMD chair and CEO and 2026 SIA board chair. “He helped strengthen the policy foundation that enables innovation, global competitiveness, and growth across our ecosystem. Because of his leadership, SIA is better positioned to support America’s economy, national security, and long-term technology leadership. On behalf of the Board and SIA team, we thank John for his many contributions and wish him all the best.”
Under Neuffer’s leadership, SIA has secured many impactful policy victories, headlined by enactment and expansion of landmark U.S. semiconductor manufacturing incentives that have sparked more than $600 billion in private investments and put America on course to more than triple domestic chip manufacturing capacity by 2032. The association also secured billions of dollars in federal R&D investments to advance American chip innovation and reinforce U.S. economic and national security.
In addition, SIA successfully advocated for critical trade agreements, including the expansion of the Information Technology Agreement (ITA) and a global deal to prevent governments from charging tariffs on cross-border data transfers, which boosted the competitiveness of the industry. And Neuffer guided SIA through a range of challenges, including global chip shortages and production shutdowns associated with the COVID-19 pandemic.
“It has been a genuine pleasure and an indelible point of pride for me to work alongside so many great leaders in this incredible industry and to play a part in advancing U.S. semiconductor leadership,” said Neuffer. “The challenges we face as an industry are dwarfed by the many opportunities that lie ahead, and I can’t wait to see what’s next. I will miss very much the high-performing team of dedicated professionals at SIA.”
To ensure a smooth transition, Neuffer will retire following the expected midyear appointment of a successor. SIA has retained Korn Ferry, a leading management consulting firm, to lead a comprehensive search.
MILPITAS, Calif. — January 28, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced its 2026 U.S. Policy Strategy: Securing the Semiconductor Supply Chain to Enable American AI Leadership designed to strengthen U.S. competitiveness, sustain long-term market investment, and support innovation across the full semiconductor ecosystem. These focal points reflect SEMI’s role as a trusted partner to policymakers and its commitment to advancing practical, coordinated, and industry-informed solutions that reinforce U.S. competitiveness in a highly integrated global industry.
“The semiconductor industry is vital to every facet of the modern economy, from artificial intelligence and advanced manufacturing to national security and workforce development,” said Ajit Manocha, president and CEO of SEMI. “As global competition intensifies and policy frameworks continue to evolve, the ability of the U.S. to maintain leadership in semiconductor design, manufacturing, and innovation will depend on clear, predictable, and forward-looking policy execution.”
SEMI policy priorities this year focus on providing certainty, enabling long-term investment, and ensuring the U.S. remains connected to the global network that makes semiconductor manufacturing resilient and sustainable. The SEMI 2026 U.S. Policy Strategy emphasizes five interconnected areas critical to strengthening U.S. leadership:
Balanced trade policy that preserves access to critical inputs, avoids overlapping tariffs on the same product, and supports market access for U.S. companies while advancing national security objectives.
A national semiconductor workforce pipeline aligned with federal, state, and industry programs to address critical talent needs across the semiconductor ecosystem.
Long-term tax and R&D incentives that provide predictability for multi-year investments and support innovation across the full semiconductor supply chain, including upstream suppliers.
Continued implementation of the CHIPS and Science Act and pursuit of a forward-looking roadmap to sustain momentum and ensure authorized funding translates into capacity and innovation.
Pragmatic policies that balance environmental goals with the technological requirements of semiconductor manufacturing necessary for continued innovation.
These priorities underscore the importance of early and meaningful engagement with industry for policymakers. Given the complexity of semiconductor supply chains and the scale of investments involved, policies developed with technical input from industry are more likely to achieve their intended outcomes while avoiding unintended consequences.
SEMI’s 2026 U.S. Policy Strategy also highlights the importance of coordination with U.S. allies and partners, as well as continued support for public-private research partnerships. Semiconductor manufacturing relies on a global network of specialized materials, equipment, and expertise, and policies that are aligned internationally help strengthen supply chain resilience, protect shared security interests, and preserve U.S. competitiveness.
“SEMI’s approach is grounded in partnership,” said Joe Stockunas, president of SEMI Americas. “Our members are investing in the United States at historic levels, bringing thousands of good-paying, skilled jobs to communities across the country. Clear rules, predictable incentives, and coordinated policy execution give those investments the best chance to succeed. We look forward to continued collaboration with policymakers to ensure the U.S. semiconductor ecosystem remains strong, resilient, and globally competitive.”
The SEMI 2026 U.S. Policy Strategy positions the industry as a constructive partner in advancing policies that support economic growth, innovation, and national security. Through collaboration, credibility, and consistentengagement, SEMI is working to ensure that the next phase of U.S. semiconductor expansion delivers lasting benefits for the broader economy.
Visit SEMI Global Advocacy to learn more about public policy efforts and developments.
