CAMBRIDGE, UK – Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.
Historically, printed electronics technologies have nurtured a close relationship with the automotive sector, with printed force sensors pioneering passenger safety through seat occupancy and seatbelt detection. As such, the automotive sector continues to represent the lion's share of the global printed and flexible sensor market, which IDTechEx’s report on the topic evaluates as worth US$421M in 2024. However, if the automotive sector is to continue to be a reliable revenue stream, printed electronics technology providers must adapt to address the emerging technical challenges facing future mobility.
Augmenting autonomous vehicles with printed electronics
As vehicle autonomy levels advance, the increasing number and distribution of spatial mapping sensors required will need continuous performance improvements to ensure passenger safety. Emerging printed electronics technologies can augment these sensors, extending detection bandwidth and maximizing reliability during operation.
Transparent conductive films (TCFs) are being developed to heat and defog LiDAR sensor panels, ensuring the function is unperturbed by external environmental conditions. Properties such as high transparency and low haze are important for defogging. These properties can be easily tuned using the wide variety of material options available for TCFs, including carbon nanotubes and silver nanowires.
IDTechEx identifies printed heating as a leading application of transparent conductive films. This is attributed to diminishing growth prospects in capacitive touch sensing applications. Innovations in thin film coating techniques have enabled indium tin oxide (ITO) to dominate touch sensing applications, all but displacing TCFs completely.
Looking towards the future, printed electronics technologies could play a more active role in advanced autonomous driving. Emerging semiconductive materials, such as quantum dots, printed directly onto conventional silicon image sensor arrays can extend detection range and sensitivity deeper into the infrared region. Augmenting existing image sensor technology with enhanced spectral range could facilitate the competition of hybrid silicon sensors with established InGaAs detectors.
Printed sensors promise granularized battery health monitoring
Vehicle electrification is driving the sustained development and evolution of electronic management systems, particularly in the battery and electric drivetrain. A strong market pull exists for technologies that increase vehicle efficiency, range, and lifetime while reducing recharge times.
Printed pressure and temperature sensors measure battery cell swelling and thermal profiles, providing granularized physical data that can be used to optimize battery deployment and recharging. Moreover, hybrid printed sensors that combine integrated printed heating elements promise a solution to actively address battery temperature. IDTechEx estimates that printed sensor-enabled battery deployment and charging optimizations could be worth up to US$3000 in savings per vehicle.
There remains uncertainty about whether electrification trends will correspond to increased demand for physical sensors in electric vehicle batteries, owing to the utility of existing electronic readouts for managing deployment. Virtual sensors also pose a threat, where AI-enabled software models interpret data to predict and emulate physical sensor functions without the need for discreet components. However, emerging regulations regarding safety and sensor redundancy will likely favor measurable metrics and see automotive makers continue to adopt physical sensors. IDTechEx predicts that virtual sensors are unlikely to displace their physical counterparts – so long as low-cost sensors remain widely available.
Embedding printed electronics in the car of the future
IDTechEx predicts that global car sales will saturate over the next decade, with automakers increasingly looking for premium features and technical innovations to differentiate themselves from the competition. In-cabin technologies will be highly desirable – as the location where passengers reside and interact with the vehicle the most.
Lighting elements are emerging as a prominent differentiator, described as “the new chrome” by Volkswagen’s chief designer. The use of in-mold structural electronics (IMSE) enables the integration of embedded lighting elements using existing manufacturing processes. 3D electronics technologies are intrinsically attractive for automotive integration, as functional layers are conformable and lightweight while easily embedded within existing aesthetic elements.
Despite strong tailwinds, the adoption of in-mold electronics within automotive interiors has been sluggish. This is attributed to the challenges of meeting automotive qualification requirements, as well as stiff competition with less sophisticated alternatives such as applying functional films to thermoformed parts. Nevertheless, momentum is building, with technology providers like Tactotek partnering with Mercedes-Benz and Stallantis to progress the automotive validation of IMSE to TRL5.
Outlook for printed electronics in automotive applications
Just as printed force sensors heralded early passenger safety systems, printed electronics technology is poised to underpin next-generation innovations for the car of the future. But this time, the competition will be stiff. Critical cost requirements must be met, while desirable new functionality must address existing challenges faced by manufacturers. Printed electronics can play a role in supporting emerging electrified and autonomous mobility, such as augmenting LiDAR sensors or optimizing electric battery deployment. Demand for technologies that enhance passenger experience and vehicle aesthetics will continue to grow, and printed electronics can supply low-power, lightweight lighting solutions for these.
Sustained engagement from tier suppliers and manufacturers continues to make the automotive sector key to printed sensor market growth opportunities – a total market IDTechEx predicts will reach US$960M by 2034. Strong partnerships between material providers and printed electronics technology providers are complementary to those of the highly vertically integrated automotive value chains between tier suppliers and OEMs. Leveraging printing techniques to provide solutions that slot into existing manufacturing processes and designs will be crucial. In the medium term, the printed electronics technologies most likely to realize revenue potential are those that can adapt to service emerging challenges already known to the automotive industry.
SOUTHINGTON, CT – Uyemura has published “MEC from Uyemura: The Roadmap for High Density and Ultra-High Density Circuits.”
This is a concise, online overview of advanced surface treatment products, including copper surface treatments that have produced highest product reliability; adhesion enhancement products for high- frequency PCBs; processes that enhance fine wire pattern accuracy; microetchants and residue removal agents for every application; environmentally-favored black oxide replacements, and more. Many of these processes are available for the first time in North America.
SUZHOU, CHINA – Ventec announces the appointment of Leigh Allinson as Commercial Director for its value-added PCB Equipment division 'Ventec Giga Solutions'. Whilst continuing in his role Technical Sales Director for Ventec’s core range of PCB laminates and prepregs, Leigh assumes his additional function to develop the business unit on a commercial level with new and existing customers as well opening opportunities in new industries and geographies.
Leigh joined Ventec in February 2020 as Technical Sales Manager, with responsibility for technical support and business development activities in the UK. In January 2023 he was promoted to Technical Sales Director. With over 30 years’ technical and sales experience within the printed circuit board industry and supply chain, Leigh has played a key role in driving forward Ventec’s unique laminate & prepreg capability including signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense.
'Ventec Giga Solutions' provides comprehensive one-stop shop solutions to PCB and related industry customers globally, including factory design, equipment selection, sales, installation, and commissioning. The extensive equipment and consumables offering from Ventec Giga Solutions partners includes inkjet solutions (Hi-Print), laminator & laser application equipment (Leetech), vacuum filling & screen printing (Sunus), optical layup systems (Surge Robotic), cleaning machines & adhesive products (Yeitek), specialist lamination plates and pads (Cardel) and abrasives & non-woven products (Falkenrich).
Leigh joins Business Unit Director Ramesh Dhokia who will continue to lead the business unit, strategically managing the supplier side and bringing his deep technical knowledge to the development and growth of the equipment division.
"Leigh's experience and intricate knowledge of the PCB manufacturing process and Ventec's range of high-reliability materials brings a great strength to the equipment division. I am delighted to welcome him to the Ventec Giga Solutions Team to help drive the division forward. His input from a commercial perspective will be hugely significant as we plan the next phase of the business unit’s growth and expansion", said Ramesh Dhokia.
The expansion of the Ventec Giga Solutions team is another indication of the commitment Ventec has to strengthening the value-added equipment business significantly over the coming years.
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com
Taiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
The DP3500 coater is a semi-automatic double-sided screen printer. The DP3500 comes with the new Smart Print System which delivers superb quality with panel thickness tolerance of 0.1 – 4 mm combined with a toolless magnetic gripper system that tensions the panel as it prints. Additionally, the new HMI Touch Screen, Differential Print Pressure Control System and Servo Controlled Peel Off features and Shur-Loc screen system now come as standard.
Fuba’s DP3500 is combined with Taiyo’s new PSR-4000 solder mask system, the global leading solder mask product, combined will complete the newly designed “Taiyo Zone” print room at Fuba.
“Fuba has been a long-standing partner of Taiyo Circuit Automation, having had a DP1500 for many years. This new DP3500 coater will support Fuba’s continued growth into new technology sectors as they transition away from curtain coating. The DP3500, with its new multi programmable settings for panel type, size, and thickness, combined with extraordinary print quality with Taiyo’s PSR-4000 solder mask is a winning combination as demonstrated by thousands of customers worldwide. Taiyo’s PSR-4000 solder mask brand is the highest volume selling solder mask in the world. This is the perfect turnkey solution for Fuba and many other PCB manufacturers," said Stuart Down, Global Sales Manager for Taiyo Circuit Automation.
Takuji Maekawa, CEO of Taiyo Circuit Automation, Inc. added, "The collaboration with Fuba aligns perfectly with our vision of Taiyo Circuit Automation, Inc. Their reputation as a leader in PCB industry complements our commitment to providing excellence in print quality through the industry leading superb coating and automation technologies of Taiyo Circuit Automation, Inc., and we look forward to a fruitful partnership."
“The entire installation process went well with very little down time. Taiyo Circuit Automation’s and Taiyo America process engineers were on site with support from Fuba’s team provided outstanding support during the transition,” said Mohamed Hamouda Production& Maintenance Director.
“The solder mask tolerances across the panel have greatly improved due to the smart print system, and we are now looking ahead to working with Taiyo on their new PSR-4000 HH01XR DI melamine free system and leading automotive solder mask solution PSR-4000 AM81," commented Hedi Abbes, Deputy General Manager.
Taiyo Circuit Automation, Inc. was established as a subsidiary of Taiyo America, Inc in 2020, in Carson City, NV. Taiyo Circuit Automation design and manufacture the world’s finest dual-sided solder mask coating, vertical drying equipment and more recently robotics to aid in automating the coating process. Taiyo Circuit Automation have served the Global printed circuit industry with highly reliable innovative machinery, engineered to exceed expectations.
AUSTIN, TX -- Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the official opening of the company’s APAC facility in Kaohsiung City, Taiwan. The facility includes offices, a full technical/field support lab, as well as full ink production for customers using Electroninks’ metal-complex inks in-region. The new operation enables increased and redundant ink production capabilities, with additional engineering staff to work with customers directly in APAC. In addition, the company has also hired Takashi Mochizuki as APAC Business Manager, KY Liu as Taiwan Application Development Manager and Kazutaka Ozawa as Technical Director. Combined, these new members have more than 40 years of experience in conductive inks and semiconductor industries. They will work closely with the rest of the global operations and customers.
In addition to the new reactors and ink production tools, there is a full QA/QC lab and analytical equipment for ink qualification. The APAC facility also has a full engineering support lab complete with printing tools including new screen printers, spray coaters and inkjet printers – that match equipment going into production lines at customer sites. With the new staff and additional equipment, global customers will receive significantly improved logistics with shorter product lead times and faster technical support.
“This new facility marks an important milestone of growth and achievement for our company, and significantly improves our ability to serve the global market,” stated Melbs LeMieux, president and cofounder of Electroninks. “We appreciate the support of the local officials and our partners in Kaohsiung to bring this project to completion.”
For more information on Electroninks products and solutions, please visit www.electroninks.com
CAMBRIDGE, UK – 3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry. There are three main approaches to 3D electronics: applying electronics to a 3D surface, in-mold electronics, and fully printed 3D electronics. Each approach is discussed in detail in the newly launched IDTechEx report "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets".
The report weighs the pros and cons of each approach with numerous case studies showing how different manufacturing techniques and materials meet the requirements for application opportunities across the automotive, consumer goods, IC packaging, and medical device sectors.
Applying electronics to 3D surfaces
The most established approach to adding electrical functionality onto the surface of 3D objects is laser direct structuring (LDS). LDS saw tremendous growth around a decade ago and is used to manufacture hundreds of millions of devices each year, including antennas and simple conductive interconnects to the surface of 3D injection-molded plastic objects. However, despite its high patterning speed and widespread adoption, LDS has some weaknesses that leave space for alternative approaches to surface metallization. For example, valve jet printing, also known as dispensing, is already being used for a small proportion of antennas. This technique enables the rapid deposition of a wide range of materials.
Aerosol jetting and laser-induced forward transfer (LIFT) are other digital deposition technologies covered in the report. These technologies offer higher resolutions and rapid deposition of a wide range of materials, respectively. The IDTechEx report also benchmarks other emerging techniques, such as ultra-precision dispensing, electrohydrodynamic printing, impulse printing, pad printing, and spray metallization. IDTechEx forecasts a gradual growth in the market for partially additive electronics, particularly in the telecommunications and microelectronics sectors.
In-mold electronics
In-mold electronics (IME), in which electronics are printed/mounted prior to thermoforming into a 3D component, facilitate the transition towards greater integration of electronics, especially where capacitive touch sensing and lighting are required. IME offers multiple advantages relative to conventional mechanical switches, including a reduction in weight and material consumption of up to 70% and much simpler assembly.
The IME manufacturing process can be regarded as an extension of the well-established in-mold decorating (IMD) process. Thus, much of the existing process knowledge and capital equipment can be reused. IME differs from IMD through the initial screen printing of conductive thermoformable inks, followed by the deposition of electrically conductive adhesives and the mounting of SMDs (surface mount devices, primarily LEDs at present). More complex multilayer circuits can also be produced by printing dielectric inks to enable crossovers.
Despite the advantageous features, commercial deployment of IME-integrated SMD components has thus far been fairly limited. This relatively slow adoption, especially within the primary target market of automotive interiors, is attributed to both the challenges of meeting automotive qualification requirements and the range of less sophisticated alternatives, such as applying functional films to thermoformed parts. Along with greater acceptance of the technology, the adoption of IME will require clear design rules, materials that conform to established standards, and, crucially, the development of electronic design tools. IDTechEx predicts that the most significant growth in 3D electronics will occur in in-mold electronics (IME) once it passes its validation stage.
Fully printed 3D electronics
Arguably, the most innovative approach to additive electronics is fully printed 3D electronics, in which dielectric and conductive materials are sequentially deposited. Combined with placed SMD components, this results in a circuit, potentially with a complex multilayer structure embedded in a 3D plastic object. The core value proposition is that each object and embedded circuit can be manufactured using a different design without the expense of manufacturing masks and molds each time.
Fully 3D printed electronics are thus well suited to applications where a wide range of components need to be manufactured at short notice. The technology is also promising for applications where a customized shape and even functionality are important. The ability of 3D printed electronics to manufacture different components using the same equipment and the associated decoupling of unit cost and volume could also enable a transition to on-demand manufacturing.
The challenge for fully 3D printed electronics is that manufacturing is fundamentally a much slower process than making parts via injection molding since each layer needs to be deposited sequentially. While the printing process can be accelerated using multiple nozzles, it is best targeted at applications where customizability offers a tangible advantage. Ensuring reliability is also a challenge, considering different material properties; additionally, with embedded electronics, post hoc repairs are impossible - one strategy is using image analysis to check each layer and perform any repairs before the next layer is deposited.
Comprehensive analysis and market forecasts
The new IDTechEx report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets", analyzes the technologies and market trends that promise to bring electronics manufacturing into the 3D realm. Drawing from over 30 company profiles, the report assesses three distinct segments of the 3D electronics landscape. The IDTechEx report evaluates each segment's different technologies, potential adoption barriers, and application opportunities.
IDTechEx's new report also includes detailed 10-year market forecasts for each 3D electronics manufacturing technology, segmented by application sector and delineated by both revenue and area/volume.
To find out more about this report, including downloadable sample pages, please visit www.IDTechEx.com/3DElec
For the full portfolio of printed & flexible electronics market research from IDTechEx, please see www.IDTechEx.com/research/pe
