Press Releases

Altus Group, a leading distributor of capital equipment in the UK and Ireland, has seen an increasing interest in laser depaneling systems from LPKF in 2024. Laser depaneling is an advanced method for separating PCBs from their panels using precise laser cutting technology. This innovative process offers significant benefits in efficiency and versatility, making it increasingly relevant across various manufacturing sectors.

Laser depaneling has emerged as a superior alternative to conventional separation methods. It allows for stress-free, non-contact separation, enabling cuts to be made close to mounted components without damaging them. The precision cutting with narrow channels, combined with the flexibility to process various materials—both rigid and flexible—makes it a highly efficient solution for electronics manufacturers. Especially those that are looking for cost saving on their bill of materials, as using a laser can significantly reduce the amount of PCB needed for break out areas providing material and immediate ROI. This digital, software-based and laser beam guided method accommodates complex geometries while eliminating tool wear, significantly reducing maintenance and changeover costs.

Joe Booth, Altus Group CEO, said: "We've seen growing interest in LPKF laser depaneling solutions, particularly the CuttingMaster 3000 series with Tensor technology. Manufacturers are increasingly recognising the benefits of this advanced approach to PCB separation. The precision, flexibility, and efficiency offered by these systems allows our customers to stay competitive in demanding industries such as automotive, medical technology, and consumer electronics where accuracy is key."

The LPKF CuttingMaster 3000 series is recognised as one of the most flexible and precise laser depaneling systems on the market. Equipped with linear drives, these systems ensure exceptional positioning accuracy and high-quality results with a large working range.

These systems can integrate a wide variety of laser sources with different wavelengths and pulse widths in the nano or picosecond range. Many of the models also feature LPKF's advanced Tensor technology, making them suitable for a diverse range of applications and materials. This ultrafast beam deflection technology offers up to a 70% reduction in cycle times when combined with LPKF CleanCut. It significantly increases performance potential while maintaining maximum transmission and high robustness for excellent reliability, improving cost efficiency.

As the complexity of electronic devices continues to increase, Altus sees laser depaneling as an important technology for manufacturers looking to enhance their production capabilities.

www.altusgroup.co.uk.

FONTENAY-AUX-ROSES, FRANCE – The ICAPE Group (ISIN code: FR001400A3Q3 – Ticker: ALICA), a global technology distributor of printed circuit boards (“PCB”) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.

Every two years, the main players in the electronics industry gather in Munich, Germany, to take part in the Electronica trade show, the largest event dedicated to this industry. Attending since 2002, the Group will once again be taking part alongside its industrial partners, not only to discuss their joint projects, but also to seize new business opportunities. At the last event in 2022, almost 1,000 meetings took place during the exhibition week, with nearly 700 companies. For this new edition, which will take place from November 12 to 15, 2024, the aim is to go even further, and to acquire new market share, thanks in particular to the launch of the Group's new digital tool: the ICAPE Shop.

Developed over two years, the ICAPE Shop enables customers to receive a quotation in 5 minutes, with prototypes and small series deliverable in 2 days. The Group's online service guarantees fast, secure production, with data encryption and anti-fraud monitoring. This high-quality product is based on particularly strict standards and the Group's proven expertise in this sales channel. In 2023, the ICAPE Group delivered 3.5 million PCB to 70 countries through its online platform, with production possible in 2 days.

Yann Duigou, the ICAPE Group’s CEO, stated: “We are proud to present the new generation of the ICAPE Shop to our partners at Electronica. We designed an even more effective solution to meet the needs of our customers, who generate over 40,000 quotations on our platform every year. With the launch of this innovation accessible 7 days a week, 24 hours a day, applying the strictest standards and supported by our teams available in all time zones, the ICAPE Group confirms its key position as a global technology expert in printed circuit boards supporting the digital transformation of the electronics industry."

FREUDENSTADT, GERMANY – The SCHMID Group is pleased to announce the official opening of its newest division, SCHMID Asia Pacific Sdn Bhd. As of November 1, 2024, the new division will begin operations, providing comprehensive services and solutions to customers across the Asia-Pacific region.

This expansion marks another important step in the SCHMID Group’s growth strategy and strengthens its presence in a key region. With SCHMID Asia Pacific Sdn Bhd, the company offers a fully equipped service center that ensures the quick availability of spare and wear parts, as well as expert technical support on-site. This enables customers to run their machines and systems efficiently, without interruptions.

“With the opening of our new division in the Asia-Pacific region, we are continuing to pursue our goal of being even closer to our customers and providing them with the best possible support,” says Julian Saier, Director of Customer Service. “SCHMID Asia Pacific Sdn Bhd is not just an office, but a full-service hub that allows us to meet the specific needs of our customers.”

SCHMID Asia Pacific Sdn Bhd offers the following services:

Spare and Wear Parts Service: A well-stocked local inventory ensures that spare parts can be delivered quickly, minimizing downtime and maximizing productivity.

On-Site Technical Support: A team of experienced SCHMID technicians and engineers is available to assist with the installation, maintenance, and optimization of machines and processes.

Modernizations and Upgrades: Tailored solutions for modernizing existing systems ensure that equipment stays up-to-date with the latest technology and meets current operational demands.

NIEDERNHALL, GERMANY – Würth Elektronik ICS will be exhibiting at electronica from 12 to 15 November 2024. Lead-free high-current contacts for PCB contacting will take centre stage at exhibition stand 334 in hall A2 at the Munich trade fair: LF PowerPlus 2.0 and LF PowerBasket. Also new: the PowerBusbars – customised and easy-to-install copper busbars. As the inventor of Powerelements for PCB contacting, Würth Elektronik ICS will be presenting the contacting of high-voltage components on PCBs for various applications.

With their contact springs, the lead-free LF PowerBaskets form a basket that is optimally designed to hold round contact pins. These high-current contacts therefore allow several mating cycles with low mating forces and, thanks to their positioning tolerance of 0.6 mm, are suitable for PCB connections with several connections. The PowerBaskets provide a pluggable connection that is reversible at any time, for example, for assemblies that need to be disconnected for maintenance purposes. The contacting of a 3-phase motor, such as that installed in an e-bike, is a classic application example. LF PowerBaskets are available in versions for press-fit technology, SMT and THT.

The lead-free LF PowerPlus 2.0 Powerelements consist of a brass base body and a stainless-steel screw element. As a result, they offer maximum torque at a comparatively low weight. The new screw tip makes it easy to insert and position the nut. This creates ideal conditions for automated screw connections. The special design of the base body allows the Powerelements to be fitted on both sides at the same position. Currents of up to 360 amps are possible depending on the version.

PowerBusbar PCB instead of additional copper inlays on the circuit boards

To increase the current carrying capacity on standard PCBs either selectively or over a large area, Würth Elektronik ICS offers PowerBusbar PCB, customised copper busbars that are pressed onto the PCBs. Thanks to the high thermal conductivity of copper, the PowerBusbar PCBs can efficiently dissipate heat from the overall system as well, helping to improve reliability and current carrying capacity while preventing hotspots. Installing the PowerBusbar PCB is quick and easy. The busbars are moulded together with the Powerelements from Würth Elektronik ICS and the PCBs in a single operation. Additional fastening of the conductor rails is not required.

Sample service for electronica

Würth Elektronik ICS will be offering a sample kit with a carefully selected collection of Powerelements at the trade fair so that visitors can explore the various applications of lead-free high-current contacts for themselves. It provides a perfect overview of the product range for developers. The sample kits will be handed out at the exhibition stand or can also be ordered online.

AUSTIN, TX – High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

“Dynamic’s mission is to provide leading-edge printed circuit board solutions for our customers. We achieve this with a combination of state-of-the-art equipment and processes; using advanced materials including laminate and prepreg, copper foil, chemistries and soldermask; and best-in-class automation and traceability,” said Mike McMaster, North America Engineering Director at Dynamic. “Dynamic is very excited to join HDP, especially as we open our new, advanced manufacturing facility in Thailand. HDP gives Dynamic the ability to collaborate with leaders across the PCB industry and deliver products that exceed our customer’s expectations.”

“I am pleased to welcome Dynamic to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs for high-speed computing and data systems, including high layer count HDI buildup, and high-reliability automotive PCBs, will contribute significantly to our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.

SUZHOU, CHINA – Ventec International Group, a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.

Having served as Ventec’s Technical Director since 2013, Bill now adds responsibility for the group’s overseas business units to his remit, leveraging the company’s wide-ranging expertise to create solutions in sectors such as high-performance computing, cloud servers, communications and networking, cellular infrastructure, consumer products, and solid-state lighting. He will continue to lead the Technical Department at the company’s global headquarters, while also directing the Global OEM Technology and IMS Technology sections in the EMEA and Americas regions.

Welcoming him in his new role, Jason Chung, Ventec International Group CEO, said, “Bill’s energy has driven our technical department to ever-greater achievements and our current pre-eminent position in substrate materials that deliver cutting-edge performance. He richly deserves the extra faith we are placing in him, and I have every confidence he will continue to expand our capabilities and strengthen our leading position.”

Bill commented, “Ventec’s technical prowess, alongside our supply-chain capabilities and global customer support services, are key differentiators for our business. I am excited to be working with our global teams to build our strength and continue extending our advantage.”

Ventec’s product portfolio encompasses signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. The comprehensive product line includes pro-bond and thermal-bond resin-coated films for signal-integrity applications, flex/flex-rigid and thin-flex products, and materials for special applications. The group also provides value added technical services, lab capabilities, and capital equipment for PCB fabrication.

Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com 

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