Flex and rigid flex circuit board manufacturer, Printed Circuits has added two new pieces of equipment to their photo department including a new Orbotech Paragon 8-watt laser direct imager and a Fusion 22 automatic optical inspection machine with laser via inspection capabilities.

Read more: Printed Circuits Upgrades Photo Department

Chandler, Arizona – Rogers Corporation (NYSE:ROG) will be showing samples of its extensive portfolio of high-performance circuit materials at this year’s 2018 IEEE Microwave Theory & Techniques (MTT-S) International Microwave Symposium (IMS). The IMS event is the RF/microwave industry’s largest gathering of electrical engineering professionals and features technical conferences, workshops, and a vast exhibition area where visitors can see and learn more about the industry’s latest products and technologies. The full 2018 IEEE IMS (www.ims2018.org) event, including conference and exhibition, is set for June 10-15, 2018 at the Pennsylvania Convention Center in Philadelphia, PA, with the exhibition scheduled for June 12-14, 2018.

Read more: Rogers Corporation to Show RF/Microwave Circuit Materials as Foundations for Autonomous Vehicles &...

Microtek Laboratories China has completed verification requirements and approval for Aptiv Advanced Safety and User Experience. Aptiv audited the Changzhou facility and approved Microtek as an Aptiv Approved Test Laboratory.

Read more: Microtek Laboratories China Achieves APTIV Laboratory Approval

Advanced Circuitry International, specialists in RF/Microwave and Antenna PCBs is pleased to announce that it has successfully completed the AS9100D/ISO9001:2015 assessment audit at its facilities located in Atlanta Georgia.

Read more: Advanced Circuitry Intl. Completes AS9100D

BERLIN, May 17, 2018: Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018.

Read more: Atotech Presents Spherolyte CU UF3

Orbotech’s partnership with IME includes the integration of Orbotech’s Emerald™ UV Laser Drilling solution into IME’s Development Line to develop Fan-Out Wafer Level Packaging (FOWLP) capabilities for next-generation consumer electronics, healthcare and automotive technologies

Read more: Orbotech and the Institute of Microelectronics (IME) to Develop Advanced Packaging Solutions in...

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