SUZHOU, CHINA – Ventec is pleased to announce the appointment of Marc Ladle to the position of Project Manager for Ventec Giga Solutions, its value-added PCB equipment division. Marc takes on his responsibility to assist customers with PCB manufacturing investment decisions by providing process design advice and technical input for equipment specifications. He will also manage and coordinate installation and commissioning at customer's premises. This latest addition to the Ventec Giga Solutions team demonstrates the company’s commitment to continue to considerably grow its value-added equipment business.
Marc started his professional career in precision engineering, moving into PCB manufacturing quality and production management roles at Eurotech in 1994. After joining APW in 1998 at their Southampton backplane facility, he helped rebuild the facility and replace equipment across the multilayer panel manufacturing line. His next step up the career ladder was his production manager appointment at Lyncolec where he oversaw the production of multilayer flex products amongst others. Since 2004, Marc has been responsible for project managing the installation of a variety of equipment, including AOI, Drilling and Routing, Electric Test, Drop on Demand Printing, Screen Printing, Photo Plotting, Plating lines (including VCP), and a significant number of Horizontal Process lines.
With over 37 years of focused PCB industry experience and an in-depth understanding of manufacturing processes and requirements, Marc brings considerable knowledge of working with suppliers and customers in over 30 countries across 5 continents. His excellent reputation and industry network has been built from consistent high-quality project management and delivery of client projects from specification through to equipment installation and commissioning of single equipment and entire industrial installations.
Ventec Giga Solutions provides comprehensive one-stop shop solutions to PCB and related industry customers globally, including factory design, equipment selection, sales, installation, and commissioning. The extensive equipment and consumables offering from Ventec Giga Solutions partners includes inkjet solutions (Hi-Print), laminator & laser application equipment (Leetech), vacuum filling & screen printing (Sunus), optical layup systems (Surge Robotic), cleaning machines & adhesive products (Yeitek), specialist lamination plates and pads (Cardel) and abrasives & non-woven products (Falkenrich).
"I am pleased to welcome Marc to our expanding equipment division team. His extensive industry knowledge and his specialist expertise for PCB manufacturing processes will further enhance our commitment to providing unrivalled process advice and technical support at the highest level to our growing global customer base”, said Ramesh Dhokia, Business Unit Director.
AVON, MA – SelecTech, Inc., a leader in the manufacture of innovative flooring products with long-term value and immediate benefits, recently announced Benjamin Smith as director of sales. In that capacity, Smith will be responsible for all sales activities related to SelecTech’s StaticStop flooring products.
“We’re delighted to have Ben leading our sales efforts for StaticStop,” said Thomas Ricciardelli, president of SelecTech, Inc. “The need for ESD flooring solutions, particularly in healthcare and the lab and life sciences space, has grown tremendously. Ben will be a key piece in educating these markets on the great need for ESD flooring in those spaces.”
Smith has more than a decade’s experience in enterprise sales. He comes to SelecTech after a stint at Khoros. He’s a graduate of the University of Denver with a degree in business and finance.
To learn more about SelecTech products, including the StaticStop and FreeStyle ESD flooring products, visit http://www.selectech.com
SCHRAMBERG, GERMANY – To achieve a CO2-neutral world and an All-Electric Society, where electricity is the primary energy source, innovations like high power densities, reduced losses and system cost advantages are essential. However, the All-Electric Society also requires innovation and collaboration among companies working in these very technology areas to achieve a sustainable transition to energy efficiency. Two traditional companies in the microelectronics ecosystem are now forming a strategic partnership in the field of power embedding. The common goal – a proven increase in efficiency – will be achieved with the p² Pack® embedding technology and its possible applications. This will create added value for the industrial and automotive markets and thus for climate protection and our society.
The power embedding partnership for Schweizer Electronic AG’s p² Pack® technology is a design-in collaboration that operates at multiple levels, from design support to system provider. The cooperation will enable a wider range of customers to gain access to power embedding technology. Zollner will provide customers with the support they need to move from traditional designs to embedding design in their products to maximize the technology’s benefits. The partnership will also enable Zollner to integrate the technology directly into its own applications. This partnership is a significant growth opportunity for both companies, fostering the development of new applications and expanding their customer base.
Schweizer Electronic AG’s p² Pack® is a power embedding technology that integrates SiC chips directly into printed circuit boards. All applications requiring high power switching can benefit from the advantages of this technology. The most important applications are in the conversion between DC and AC systems. These systems are increasingly confronted with higher power requirements and with expectations for high energy efficiency, maximum reliability and long service life. Schweizer Electronic AG has already been able to demonstrate the superior performance, advantages, and savings that this technology brings to the market in recent years: the patented cutting-edge technology contains both extensive development experience and technological depth, which is already being used in series production by major Tier-1 companies in Europe.
Nicolas-Fabian Schweizer, CEO of Schweizer Electronic AG, is looking forward to the future partnership and collaboration: “Zollner will benefit from our expertise in complex PCB and chip embedding while we will gain from their extensive application knowledge as a leading European EMS service provider. This synergy is a powerful multiplier for both companies and creates the best conditions for innovation! Both family owned, based in Southern Germany and highly specialized, this partnership is a natural fit!” Nicolas Schweizer is the 6th generation to lead the family business of the same name, which is headquartered in Schramberg and has five locations worldwide. SCHWEIZER is one of Europe’s largest suppliers of printed circuit boards and embedding technologies, with a portfolio that includes RF & sensor technology, logic circuits and various technologies for power electronics technologies, including p² Pack.
Ludwig Zollner, CEO of Zollner Elektronik AG, is optimistic about the future collaboration: “We see SCHWEIZER as a partner with whom we can offer our European customers a first-class service. Power embedding is an important topic for the future and we are convinced that we will be able to use the synergy effects resulting from the cooperation to offer our customers added value. We look forward to working together and using the innovative power embedding technology to implement challenging projects!”
SANTA CLARA, CA – LQDX, developer of high-performance materials and process IP for advanced semiconductor manufacturing, today announced that it has signed a multi-year sales and licensing agreement with Kansai Denshi Industries (KDI), enabling manufacturing support for next generation IC-substrates in semiconductor packaging and advanced printed circuit boards.
Under the terms of the transaction, LQDX will supply its Liquid Metal Ink (LMIx®) chemistries and Aluminum Clad Laminate (ACL®) products via its partnership with Toyal-Alconix, as well as a process license for Ultra High-Density Interconnect technology to support the rapidly growing demand in the Japan-Asia market. LQDX's technology enables Kansai Denshi, who has been producing 30-micron trace/space circuits, to leapfrog, via development, to 5-micron trace/space products today with a path to 2-micron trace/space by 2025.
"We are delighted to complete this deal with Kansai Denshi, and to support it through our partnerships with Toyal and Alconix," said Simon McElrea, LQDX CEO. "Japan is a critical global hub for the Heterogeneous Integration market infection, and we have been building our supply chain eco-system partnerships in-region with key material, equipment and manufacturing leaders. We look forward to supporting the Asian market with advanced interconnect prototyping and manufacturing in the second half of this year."
Zazunori Miyabe, Board Director of KDI inc. stated, "For a long time, Kansai Denshi Industries has specialized in developing and acquiring the latest technologies to provide our customers with the most advanced circuit designs and manufacturing solutions. By adding LQDX's Liquid Metal Ink (LMIx®) technology to our portfolio, we are now able to provide the most advanced IC-substrates and printed circuit boards for the highest performing applications."
ANAHEIM, CA – Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all aspects of operations within Summit’s Denver-based facility, Advanced Assembly.
Lane is an industry veteran with over 25 years of hands-on experience in operations and management. He joins Summit Interconnect after serving as the Director of Global Key Accounts at Universal Instruments Corporation, where he played a pivotal role in driving business growth and enhancing customer relationships. Before that, he held key executive positions at Creation Technologies, NEO Technology Solutions (OnCore Manufacturing, LLC.), DDi (Dynamic Details, Inc), McData Corporation, and Compaq Computers.
“We are thrilled to welcome David Lane to Summit Interconnect as the new General Manager of our assembly division,” said Sean Patterson, COO of Summit Interconnect. “David’s extensive experience and proven leadership will be invaluable assets as we expand our capabilities and continue delivering superior products and services to our customers.”
Throughout his career, David has demonstrated exceptional skills in operations management, business strategy, customer relationship management (CRM), and team leadership. He has a long history of building and leading technical organizations, manufacturing operations teams, and cross-functional teams focused on delivering innovative solutions and driving continuous improvement initiatives.
“I am excited to join Summit Interconnect and lead the assembly team,” said David Lane. “I look forward to collaborating with the talented individuals at Summit Interconnect and leveraging our collective expertise to drive innovation, exceed customer expectations, and achieve operational excellence.”
Lane holds a B.S. in Mechanical Engineering from Colorado State University.
Advanced Assembly, a Summit Interconnect company, will change its name to Summit Interconnect Assembly later this year.
GENT, BELGIUM – Ucamco, a pioneering force in CAM and Pre-CAM software solutions, proudly announces that a global leader has implemented Ucamco’s groundbreaking Jayda software in its new web shop. This strategic collaboration represents a significant leap forward in redefining the landscape of online PCB procurement, leveraging Jayda's capabilities to streamline and revolutionize the industry.
What is Jayda?
Ucamco’s Jayda is a highly responsive and ultra-fast data input and analysis sales tool designed to empower online web portals and quotation engines. Leveraging state-of-the-art technology, Jayda communicates seamlessly with web servers, extracting key PCB characteristics from visitor archives and safely storing them for accurate price calculation. Its progressive result gathering feature ensures a smooth user experience, eliminating endless back-and-forth communications with customers. Jayda's best-in-class stack-up engine offers unsurpassed first-pass hit rates at record speed, empowering businesses to deliver timely and precise quotations, thus achieving a significantly higher quote-to-order conversion.
Huge benefits
Integrated into the web shop of this global leader, Jayda enhances the user experience by providing instant quotes. With over 25 years of experience in the electronic industry, our customer understands the importance of efficiency and quality in PCB procurement. Jayda’s automatic Gerber data extractor represents a significant improvement over previous systems, meeting customer demands and simplifying the ordering process, getting users their quotes in less than 5 minutes.
