Worcester, MA: Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts. PCB Technologies will be exhibiting at Booth 101, where attendees can learn firsthand why the company has become one of the most advanced and complete high-tech PCB solution providers in the world.
PCB East 2026 features a four-day technical conference from April 28 through May 1, with the one-day exhibition on April 29 bringing together leading innovators, manufacturers, and technology providers across the electronics industry.
“We are excited to be part of PCB East 2026 and to connect with engineers, designers, and decision-makers from across North America,” said Mr. Ende. “This event gives us the opportunity to demonstrate how our All-In-One approach—from design through fabrication, assembly, and advanced packaging—helps customers accelerate innovation, reduce risk, and bring better products to market faster.”
About PCB-Technologies:
PCB Technologies is known for delivering a complete high-tech PCB solution under one roof, combining advanced capabilities in HDI, RF, rigid-flex, IC substrates, and complex assembly. Their unique integrated model eliminates the traditional gaps between design, fabrication, and assembly—resulting in improved performance, faster turnaround, and greater reliability for mission-critical applications in aerospace, defense, medical, and high-performance electronics.
At Booth 101, visitors will discover how PCB Technologies is redefining what it means to be a true manufacturing partner—offering not just boards, but complete solutions that help customers achieve their end-product goals with confidence.
Attendees are encouraged to visit PCB Technologies during the exhibition to explore their capabilities, meet the team, and learn how they are helping shape the future of electronics manufacturing. For more information go to www.pcb-technologies.com
About PCB East 2026
PCB East 2026 is where serious electronics professionals go to get better, faster, and more competitive. Held April 28 through May 1, 2026, at the DCU Center in Worcester, this is the East Coast’s most important event for PCB design, fabrication, and assembly. Hosted by Printed Circuit Engineering Association, PCB East delivers hands-on training, real-world solutions, and direct access to the companies driving innovation in electronics manufacturing. Engineers, designers, and decision-makers attend for one reason—practical knowledge they can use immediately to build better products and win in a faster-moving market. If you want to stay relevant in electronics, this is where you show up.
Charlestown, NH — April 2026 — GreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA. Attendees can visit GreenSource Fabrication at Booth 611 to experience firsthand how next-generation manufacturing is redefining speed, sustainability, and performance in PCB fabrication.
At this year’s event, GreenSource Fabrication will showcase its heavily automated, Zero Liquid Discharge (ZLD) equipped, manufacturing facility—designed to deliver high-quality, production-ready PCBs with unmatched efficiency and environmental responsibility. Engineers, designers, and procurement leaders will gain insight into how GreenSource is eliminating traditional trade-offs between speed, cost, and sustainability.
“PCB East is where technical collaborations happen,” said Megan Teta, Strategic Account Manager at GreenSource PCB . “If you are designing next-generation electronics and want a manufacturing partner that matches your ambition, you need to stop by Booth 611. We’re not just building boards—we’re changing how they’re built.”
Visitors to the booth will learn how GreenSource Fabrication supports rapid prototyping, seamless transition to production, and advanced material capabilities—all while maintaining a ZLD wastewater treatment system. The company’s integrated, technology-first approach enables customers to move faster, reduce risk, and bring better products to market. PCB East 2026 is one of the premier East Coast events for the electronics industry, bringing together innovators, engineers, and decision-makers focused on PCB design, fabrication, and assembly.
If you are attending PCB East 2026, make Booth 611 your first stop. Meet the team. Ask the hard questions. See what the future of PCB manufacturing looks like.
About GreenSource Fabrication
GreenSource Fabrication is a U.S.-based advanced manufacturer of printed circuit boards (PCBs), specializing in high-complexity production for aerospace, defense, and next-generation electronic systems. Headquartered in Charlestown, New Hampshire, the company combines cutting-edge automation, precision engineering, and environmentally responsible manufacturing to deliver high-performance solutions from concept through production.
Known for its leadership in sustainable fabrication, GreenSource operates one of North America’s most advanced “green” PCB facilities, utilizing zero liquid discharge technology and closed-loop processes to minimize environmental impact. Through its commitment to innovation, quality, and collaboration, GreenSource Fabrication supports critical programs that advance national security and modern technology.
Atlanta – ECIA is pleased to announce that Leigh Shelnutt is joining the Association. Leigh is an association management professional with experience in member services, recruitment, certification program management, and operations. Her work focuses on driving membership growth and strengthening member engagement.
“Leigh brings valuable membership experience in her previous role with a national healthcare organization, where she oversaw the full member lifecycle, supported professional certification initiatives, and coordinated member programs,” explained Stephanie Tierney, Director of Marketing Communications and Member Engagement. “I look forward to working with Leigh to advance ECIA’s mission and creating a strong momentum growing membership and engagement at ECIA.”
Leigh is currently completing a Bachelor of Science in Business Administration, Management, from Western Governors University, with an expected graduation in December 2026. She lives in Comer, Georgia, with her wife and a farm full of animals.
MULINO, OREGON – APRIL 6, 2026 – ASC Sunstone Circuits, a division of American Standard Circuits, has implemented Smart Parts Classics technology at its Mulino, Oregon manufacturing facility, advancing its commitment to efficient, high-quality PCB fabrication.
This implementation brings a more streamlined and standardized approach to drilling and routing within the production flow, allowing the Mulino plant to improve throughput, reduce material waste, and increase overall consistency and quality across builds.
Smart Parts optimizes how boards are arranged and processed during fabrication, minimizing setup time and simplifying production steps behind the scenes without operator involvement, resulting in faster, more reliable delivery for customers.
“This is about making our processes more efficient without adding complexity for the customer,” said Matt Stevenson, VP/General Manager. “Smart Parts helps us move faster, stay consistent, and continue delivering the level of service our customers expect.”
Key benefits of smart parts at the Mulino facility:
Improved Production Flow – More efficient panel layouts reduce bottlenecks
Greater Consistency – Standardized processes lead to more predictable outcomes
Faster Turn Times – Less setup time means quicker delivery
Better Material Utilization – Reduced waste supports cost efficiency
Support for Complex Builds – Scalable across a wide range of PCB technologies
The addition of Smart Parts is part of ASC Sunstone’s ongoing focus on continuous improvement within its Mulino operations, ensuring customers benefit from both advanced manufacturing practices and responsive, service-driven support.
PETACH TIKVA, ISRAEL -- Eltek Ltd., a leading global manufacturer of high-quality printed circuit boards, today announced that it has received purchase orders totaling approximately $5.3 million from an international customer. The orders are scheduled for delivery beginning in the second quarter of 2026, with the final shipment expected in September 2027.
"We are pleased with this award, which supports our strategic objective of expanding our presence in international markets with high value-added products. It also reflects a growing focus in the market on securing medium-term supply," said Eli Yaffe, Chief Executive Officer of Eltek.
Separately, the Company expects that its operating results for the first quarter of 2026 will be adversely affected due to a combination of a less favorable fulfillment of its order backlog and unexpected logistic issues, while the Company's backlog has approximately doubled compared to year-end 2025. The Company is actively addressing these factors and expects a gradual normalization of deliveries over time.
About Eltek
Eltek – "Innovation Across the Board", is a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs) and is an Israeli leading company in this industry. PCBs are the core circuitry of most electronic devices. Eltek specializes in the manufacture and supply of complex and high-quality PCBs, HDI, multilayered and flex-rigid boards for the high-end market. Eltek is ITAR compliant and has AS-9100 and NADCAP Electronics certifications. Its customers include leading companies in the defense, aerospace and medical industries in Israel, the United States, Europe and Asia.
Eltek was founded in 1970. The Company's headquarters, R&D, production and marketing center are located in Israel. Eltek also operates through its subsidiary in North America and by agents and distributors in Europe, India, South Africa and South America.
MILPITAS, Calif. – April 1, 2026 – Worldwide 300mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300mm Fab Outlook. This strong growth reflects surging AI chip demand for data centers and edge devices, as well as the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.
Looking further out, the report projects investment will continue to increase 3% to $155 billion in 2028 and another 11% to $172 billion in 2029, respectively.
“AI is resetting the scale of semiconductor manufacturing investment,” said Ajit Manocha, President and CEO of SEMI. “With global 300mm fab equipment spending projected to exceed $150 billion in 2027 for the first time, the industry is making historic, sustained commitments to the advanced capacity and resilient supply chains needed to power the AI era.”
Segment Growth
The Logic & Micro segment is expected to spearhead equipment expansion with $228 billion in total investments from 2027 to 2029 mainly due to strong foundry sector demand, driven by sub-2nm cutting-edge capacity investments. Advanced node technology is essential to enhance chip performance and power efficiency to meet rigorous chip design requirements for various AI applications. More advanced node technology is expected to enter volume production from 2027 to 2029. Additionally, AI performance improvements are anticipated to drive massive growth in various edge AI devices. Beyond advanced nodes, demand across all nodes and various electronics devices is anticipated to grow moderately, supporting investment in mature nodes as well.
The memory segment is projected to rank second in equipment spending, totaling $175 billion from 2027 to 2029. This period marks the start of a new growth cycle for the segment. Within the memory category, DRAM equipment spending is expected to reach $111 billion cumulatively from 2027 to 2029, while 3D NAND equipment spending is estimated to be $62 billion during the same time frame.
The demand for memory has significantly increased due to AI training and inference. AI training has notably driven up the demand for High Bandwidth Memory (HBM), while model inference has created substantial demand for storage capacity, thus boosting the growth of NAND Flash applications in data centers. This strong demand has led to sustained high levels of investment in the memory supply chain over the near and long term, helping to cushion potential downturns from traditional memory cycle fluctuations.
Regional Investment Trends
Global 300mm fab equipment investment is expected to remain broadly distributed across the major semiconductor manufacturing regions from 2027 to 2029, reflecting a mix of advanced-node expansion, memory capacity additions, and policy-supported supply chain localization. China, Taiwan, Korea, and the Americas are each expected to see substantial levels of spending during the period, while Japan, Europe & Middle East, and Southeast Asia also continue to expand investment from a smaller base.
In China, investment is expected to remain supported by ongoing domestic capacity expansion and national initiatives aimed at strengthening semiconductor manufacturing capabilities. In the Taiwan region, spending is projected to be driven primarily by continued expansion of leading-edge foundry capacity, including 2nm and sub-2nm technologies. Korea’s investment outlook remains closely tied to the memory sector, where AI-related demand is supporting another cycle of capacity and technology upgrades. In the Americas, spending is expected to be underpinned by advanced process expansion and broader efforts to strengthen domestic manufacturing ecosystems.
Japan, Europe & Middle East, and Southeast Asia are also expected to post meaningful growth through 2029. In these regions, equipment investment is supported by a combination of government incentives, supply chain resilience strategies, and targeted efforts to expand semiconductor manufacturing capacity.
Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook lists 404 facilities and lines globally. The report reflects 198 updates and 9 new fabs/lines projects since its last publication in December 2025.
