WALDENBURG, GERMANY – Würth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024. The manufacturer of electronic and electromechanical components for the electronics industry will showcase a host of innovations, primarily as a solutions provider in Hall A6 at Booth 502.

“Those who know us are aware that we’re so much more than just a component manufacturer,” stresses Alexander Gerfer, CTO at Würth Elektronik eiSos. “What drives our company's success is our high-quality, durable products, of course. But, of equal importance to us are services, such as knowledge transfer and targeted development support, for example through pre-compliance measurement. Creating Together, that’s our mission, especially at this important industry event.”

The global player’s strong service orientation is clearly apparent in many aspects of its trade show presence. Trade visitors can experience live demonstrations of the REDEXPERT digital design platform and the new MyWE customer platform at the 400 m2 booth. Developers looking to use components for their own projects can order free lab samples at the trade show booth and test them the next day in their development lab. Collaboration with IC manufacturers, which is crucial for developing reference designs, is also featured at the trade show. Partners live at the booth will be Analog Devices, Infineon, Microchip, Onsemi, STMicroelectronics and Texas Instruments.

Würth Elektronik also contributes valuable knowledge sharing with its practice-oriented reference guides. Alongside the brand-new “ABC of Shielding”, an expanded and revised version of the “Trilogy of Connectors” will also be presented at electronica. Those interested in power supply design will find valuable insights and tips for practical implementation in the newly published “DC/DC Converter Handbook”.

More components from a single source, straight from stock

“’More than you expect’ is also there to be found in our comprehensive product range, of course, whether from stock as standard, or as custom components,” Gerfer affirms. “Würth Elektronik offers everything from a single source: products from the fields of passive components, electromechanics, optoelectronics, power modules, digital isolators, thermal management, as well as wireless connectivity & sensors and components for the automotive sector. We offer more of everything: more partnership, more solutions, more service and more possibilities.”

A wealth of product highlights will be exhibited at the Würth Elektronik booth:

• Single Pair Ethernet Power over Data Line: reference design and demo board
• WE-MXGI SMT power inductors: Further designs for this new series of inductors will be unveiled at the trade show. They are made of an innovative metal alloy with extremely low RDC and AC losses. The compact, magnetically shielded design is optimized for high switching frequencies in excess of 1 MHz and is ideally suited as a DC/DC converter for high-current supplies and field programmable gate arrays.
• Transformers for battery management systems as well as AC and DC charging stations: ideally suited for applications such as wallboxes and energy storage systems
• High-current and high-temperature inductors: with an operating temperature of up to 150°C and without thermal aging effects, for example for DC converters in power supplies
• MagI³C-VDMM type power modules: with a wide input voltage range of 3.5-60 V for 48-V industrial bus applications
• WE-TORPFC PFC chokes: for charging stations or solar power system inverters
• WL-OSEN: a new optical sensor with a typical detection distance of 1 mm for optical switches or touch applications
• Radio modules & sensors: FeatherWing development boards
• Another focus is on crystals and oscillators, such as the ICPT-1 rubidium oscillator, as IQD Frequency Products is once again a co-exhibitor this year.
• High-current contacts for automotive applications and REDCUBE for direct current motors
• New COAX connectors
• Custom solutions: for connectors, inductors, transformers, crystals and oscillators, ferrites and inductors, thermal management, capacitors, or automotive-qualified components.

Good to know: components from Würth Elektronik are usually available straight from stock, even in larger quantities.

Networking and Young Talents Day

New at electronica 2024: The Würth Elektronik show truck will be located in the atrium between Halls A6 and B6. It acts as an additional meeting point for interaction. There will also be opportunities for expert discussions and networking at the ‘Get Together’ at the booth each evening from Tuesday to Thursday from 6:00 pm to 8:00 pm. The trade show program is complemented by a competition and a free luggage service. Young Talents Day on Friday is particularly interesting for students and and people just starting their careers.

MORRISVILLE, NC – iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.

Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.

Registration
This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Mark Schaffer (This email address is being protected from spambots. You need JavaScript enabled to view it.).

Monday, September 30, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
5:00-6:00 p.m. CEST (Europe)
Register for this webinar

CAMBRIDGE, UK – Additive manufacturing offers geometric flexibility and relatively fast go-to-market times without coming at a large expense for low to medium-volume applications. Some very established printing technologies already widely utilized include selective laser sintering, thermoplastic filament extrusion, and direct metal laser sintering. IDTechEx's report, "3D Printing and Additive Manufacturing 2024-2034: Technology and Market Outlook", looks at these methods in detail and explores trends impacting new additive manufacturing approaches.

New, complex, and optimized structures could possibly be manufactured as the industry finds new ways to use materials and hardware to address customers' needs. Materials innovation is opening opportunities for newer applications, so the additive manufacturing market is by no means done growing yet.

Why is additive manufacturing consistently gaining traction?

Improving on established technologies and innovating new printing hardware allows startups to take a shot at entering the market. New methods include the extrusion of thermosets using gel beds as a support for the print, developed by Rapid Liquid Print, while another company, 3Deus Dynamics, has created a new method for the extrusion of soft materials into a powder bed. This can act as both a means of support and a strengthening mechanism for the print. Companies like Vitro3D focus on volumetric additive manufacturing, providing speed and other advantages when compared to layer-by-layer approaches.

Binder jetting as a technology is also gaining traction, which is very beneficial for metal powder providers. Due to the high throughput of binder jetting, higher material utilization can be realized, leading to higher sales and lots of opportunities for these companies.

The benefits of AI and automation

The role of automation is becoming more prevalent all the time, with the usage of AI and robotics potentially making the utilization and adoption of additive manufacturing more successful. IDTechEx reports that AI could detect early errors in the printing process and defects after printing, and be able to correct them, changing the 3D model if necessary to prevent reoccurring errors. Additionally, AI can assist with the creation and development of more complex structures, and with the accompaniment of robots, the amount of labor required for additive manufacturing processes can be reduced. This use of AI and robotics could lower the barriers to entry across the different stages of the market, as there is less need for specialized knowledge and large numbers of employees to work around the clock on these 3D printers.

Markets for additive manufacturing

Automotive OEMs have begun to realize the potential of additive manufacturing with Tesla's introduction of Giga Casting - a technology invented to create different parts of cars that are ordinarily made of lots of welded parts. Sand binder jetting can be used to create molds, which can then be used in the Giga Casting process, streamlining the manufacturing process to make producing large numbers of electric vehicles more straightforward. IDTechEx names this a major application for 3D printing within the EV market, with other automotive manufacturers are now considering this approach.

Uses of additive manufacturing within the consumer electronics sector include Apple's use of binder jetting to produce the steel chassis for Apple Watches and their consideration of the process for other parts, demonstrating the trust in this technology from large global companies.

Additive manufacturing is clearly a diverse field, with room for players to optimize and innovate. IDTechEx's report on the topic, "3D Printing and Additive Manufacturing 2024-2034: Technology and Market Outlook", explores different applications further and predicts the industry to surpass US$44 billion in revenue by 2034, reflecting the expectations of growth and success in the near future. The report goes into further detail about how current and emerging methodologies could lead to more sustainable successes within the 3D printing industry.

To find out more about this report, including downloadable sample pages, please visit www.IDTechEx.com/3D 

For the full portfolio of 3D printing market research available from IDTechEx, please see www.IDTechEx.com/Research/3D 

SAN DIEGO – Altium, a global leader in electronics design systems, announced today that it has launched the Requirements & Systems Portal Application into the Altium 365 cloud platform for electronics design collaboration. The Requirements & Systems Portal helps to ensure visibility and awareness of functional requirements from concept to manufacturing, improving upon cost, quality, and risk in the product development process.

The launch follows Altium’s acquisition of Valispace earlier this year. Valispace is a game-changing Systems and Requirements Engineering tool that joins system design and requirements engineering with an AI-assisted and data-driven approach.

The electronics design process is disconnected and plagued by rework because the work of PCB design engineers is often disconnected from system requirements. The Requirements & Systems Portal ensures that electrical teams can write, manage, and verify their requirements directly in the Altium 365 ecosystem, allowing team members from different disciplines to view requirements in the context of their designs. When electrical engineers, electrical managers, systems architects and external stakeholders all have access to the same information, everyone on the team knows they are working with the latest values and up-to-date specifications.

The integration of the Requirements & Systems Portal into Altium 365 extends the platform’s capability as an end-to-end development platform and supports Altium’s goal of connecting everyone involved in the electronics development process.

"The Requirements & System Portal on Altium 365 supercharges innovation and accelerates time to market,” said Ananth Avva, VP and GM of Cloud Platform, Digital Industries, at Altium. “By bringing product-level context to the entire electronics design process, engineers can effortlessly ensure requirements are met across applications like supply chain and simulation. This puts systems thinking at the forefront, empowering engineers to thrive in today’s competitive landscape and deliver world-class electronic products.”

Register today for the upcoming webinar on September 18, 2024, to learn more about the Requirements & Systems Portal Application in Altium 365: https://go.altium.com/new-a365-requirements-and-systems-portal.html 

For more information on the Altium 365 cloud platform applications, please visit: altium365.com.