HUIZHOU, CHINA – Tom Yang, CEO of CEE-PCB, is pleased to announce the appointment of Fred E. Hickman III as Vice President of Sales for North America. A seasoned industry leader with over 40 years of experience, Hickman has built a reputation for delivering exceptional customer experiences. His expertise spans technical sales, customer engagement, and strategic business development, making him a trusted partner for OEMs seeking cutting-edge PCB solutions.

"Fred brings the talent, experience, and reputation we need as we continue to expand our North American technology sales operations," said Tom Yang, CEO of CEE-PCB. "His deep industry relationships and commitment to customer success align perfectly with our mission to be the most caring, helpful, and attentive PCB provider in the world. We are confident that Fred will play a key role in driving growth and strengthening our presence in North America."

Hickman expressed his enthusiasm for joining the company: "CEE-PCB is exactly the kind of company I have been searching for at this stage of my career. I am highly selective about the PCB solutions I bring to my customers, and I am confident that CEE- PCB can provide the comprehensive, high-quality solutions they need to succeed."

About CEE-PCB

Huizhou CEE Technology Inc. (Stock Code:002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Our offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, we are recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.

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