PUNE -- AT & S announced an Information Technology Shared Service Center (IT SSC) here for its transcontinental operations. With this new venture, AT & S opens opportunities for scores of qualified information technology professionals from India in IT Security, SAP, and Program Developers at its Pune center catering to different areas of responsibilities across the IT spectrum.
The new global IT Shared Service Center (IT SSC) of AT & S AG in Pune will now cater to group's operations in Austria, China, Malaysia, and India. The Group plans to hire over 100 technical resources at their Pune IT SSC by 2025-26 to support its 6 manufacturing plants and 9 sales offices globally.
Peter Griehsnig, Chief Technology Officer, AT & S AG, speaking on the occasion said, "AT & S stands for progress, innovation and the willingness to invest in the brightest minds and state-of-the-art technology all over the world. The launch of our IT Shared Service Center in Pune marks a significant milestone in our global digital transformation journey. India's rich talent pool and innovative spirit make it the ideal location to drive efficiency, agility, and technological excellence across our operations. This center will not only enhance our IT capabilities but also foster collaboration and innovation at scale."
The Global IT Shared Service Center at Pune is an integral part of the new Target Operating Model of AT & S Group, and has been established to provide high quality IT services by leveraging the skills and talent available in India. With this initiative, AT & S joins the league of other big transnational corporations who have set up their global competence and shared service centers in India, to leverage high quality skills and talent for delivering reliable IT services and driving innovation.
The new venture comes up after the visit of India's Prime Minister Narendra Modi to Austria in m
onth of July just last year where AT & S's top management met PM Modi at the Federal Chancellery in Vienna.
The global IT Shared Service Center further expands the 25-year old footprint of AT & S group in India, where it already runs a high end PCB manufacturing facility at Nanjangud near Mysuru and is currently the largest exporter of hi-tech PCBs from India. Through this new venture, AT & S AG has redefined the approach to business efficiency in microelectronics and PCB manufacturing towards achieving significant competitive advantage in the industry.
The new team at Pune IT SSC provides information technology services to support AT & S' global operations in manufacturing of high end microelectronics and printed circuit boards. The SSC operates across four Centers Of Excellence (CoE) namely, Security & Infrastructure, IT Applications, Operations Technology and Digital & Data. The center is headed by Mr. A.S. Raghavendra who passionately leads a team of information technology experts and aims to further augment the operations.
AGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.
Paul Cooke of AGC is presenting a professional development course “PD10: PCB design for High Reliability” on Sunday Mar. 16, 2025 at 1:30pm. Additionally, Kevin Bivona of AGC is presenting :Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features” on Wednesday, Mar. 19, 2025 at 3:30pm.
Visit us at Booth 3814 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series. Learn more at our website agc-mutlimaterial.com.
IPC APEX EXPO is the industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference and professional development courses.
THIEF RIVER FALLS, MN – DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announces a collaboration with Ultra Librarian. The collaboration connects the supply chain and design, giving engineers a fully integrated and contextual component discovery and procurement path directly inside the computer-aided design (CAD) environment.
The collaboration integrates DigiKey's myLists with UItra Librarian's UltraBOM bill of materials management tool, which gives designers access to quotes, prices, product availability and lead times during the design process. Simplifying the design and purchasing workflow, this integration offers DigiKey's parts to users of OrCAD Capture printed circuit board (PCB) software, who can send a bill of materials to DigiKey with the push of a button.
myLists is DigiKey's parts list management tool that consolidates bills of materials (BOMs), price and availability lists, and quotes. It allows users to easily share their BOMs with external team members or publicly. With customizable permissions, list owners can grant edit access or "view only" rights, ensuring everyone gets the information they need, without risking list integrity.
"DigiKey and Ultra Librarian's collaboration is helping engineers maximize their productivity and efficiency by connecting critical design data, enabling a contiguous digital thread from concept through production," said Cody Walseth, digital product owner for DigiKey.
"Connecting engineering with procurement and supply chain has traditionally been a manual post-design process," said Manny Marcano, president of Ultra Librarian and Accelerated Designs Brand. "With the rate of change in design and the constant variability in the supply chain, a better process is needed to ensure engineering and procurement are in sync throughout the product development process. We are proud to work with the amazing team at DigiKey to enhance UltraBOM with myLists, giving the PCB design community a fully integrated path to production."
For more information about the collaboration, please visit the DigiKey website.
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer. Semiconductors are the sixth-largest U.S. export sector.
“Our companies are investing nearly half-a-trillion dollars to manufacture and develop more semiconductors in the U.S., create high-paying American jobs, secure our supply chains, and win global markets.
“We’re encouraged by President Trump’s goals of restoring U.S. trade leadership, promoting American strength in semiconductors, and reindustrializing our country. We understand tariffs are a tool in the trade policy toolbox. If not approached carefully, tariffs could make it significantly more expensive to develop and produce Made-in-America semiconductors and the many critical technologies they enable, including artificial intelligence.
“We look forward to working with the Trump administration to aggressively advance smart trade and tax policies that enhance U.S. semiconductor leadership, including by pursuing mutually advantageous bilateral and sectoral trade negotiations and tax incentives that create domestic manufacturing jobs, enhance competitiveness, open markets, and achieve our shared goals of making America safer, stronger, and more prosperous.”
TONBRIDGE, UK – Electra Polymers Ltd, a global leader in inkjet materials for the PCB industry, is proud to announce a new partnership with high-tech design and manufacturing company TLT PCB, an affiliated company of Teltonika, becoming the primary supplier of inkjet soldermask for TLT PCB’s new manufacturing facility in Vilnius, Lithuania.
This strategic partnership supports TLT PCB’s significant investment in local PCB manufacturing, which will produce high-performance PCBs for both in-house use and commercial EMS customers, serving industries such as:
Electra Delivering Advanced Materials for Digital PCB Manufacturing
Electra will supply the latest generation of its industry-leading ElectraJet® EMJ110G inkjet soldermask, designed for superior performance with:
This collaboration marks a major step forward for digital PCB manufacturing, combining Electra’s cutting-edge inkjet technology with TLT PCB’s state-of-the-art production capabilities.
A Partnership Built on Technology, Innovation, and Sustainability
Tomas Auruškevičius, CEO of TLT PCB, emphasized the value of Electra’s experience: “With Electra’s extensive knowledge, robust supply chain, and experienced technical support, they were the clear choice to support our new PCB manufacturing division. We are confident this partnership will be long and successful, founded on our shared commitment to technological innovation and customer support.”
Electra’s Commitment to Inkjet Technology and the European Market
Ashley Steers, Global Manager for Printed Circuit Products at Electra Polymers, highlights Electra’s dedication to inkjet advancements: “We are thrilled to bring our fully integrated inkjet solution and service model to this exciting project. Electra has been committed to inkjet technology from the very beginning, making significant investments in R&D. This dedication has positioned us as the largest global supplier of inkjet soldermask.
Our partnership with TLT PCB is not only a testament to our technological leadership but also reinforces our commitment to the European market and our customer-first approach.”
WESTFORD, MA – Zuken USA is pleased to announce the launch of Tech Tour 2025, a free, one-day event series designed to bring innovation and expertise directly to customers and industry professionals across the United States. The Tech Tour builds upon the legacy of Zuken Innovation World (ZIW), delivering a unique attendee experience tailored for engineers and engineering managers seeking to optimize E3.series-based processes and explore the application of digital engineering solutions.
The Zuken Tech Tour will feature stops in key cities across the U.S., offering attendees access to expert-led sessions, networking, and personalized learning opportunities. With a design process-focused agenda, this event is structured to inspire new ideas, streamline workflows, and foster meaningful industry connections.
Zuken is also pleased to welcome Komax as a sponsor for Tech Tour 2025. Their expertise in wire processing solutions will provide attendees with additional insights into automation and efficiency in harness manufacturing.
Event Highlights
Zuken’s Tech Tour will deliver an exceptional experience for all attendees. Expert-led sessions provide actionable tips and best practices from Zuken’s specialists in harness design and digital engineering. The onsite Expert Bar offers one-on-one guidance from product experts, allowing participants to address specific challenges and gain personalized insights. Additionally, dedicated networking opportunities enable attendees to connect with Zuken’s account teams, product specialists, and peers across the industry.
Locations and Dates:
Registration is now open, and attendance is complimentary. Event details, including schedules and resources, are available on the official Tech Tour website.