BOSKOVICE, CZECHIA – Prominent Czech company Gatema PCB, has enhanced its printed circuit board (PCB) production with a new press center featuring advanced equipment. The facility now operates three cutting-edge machines: two Lauffer presses, a Monolam MLP 25M high-temperature press, and an Optical Pinless Bonding 211/8 machine. After several weeks of testing, these machines—costing nearly one million euros— are now running at full capacity, significantly boosting the company’s production capabilities.
As a vital part of the Gatema Group, Gatema PCB has been providing high-quality PCBs for over 25 years, serving more than 800 customers across 15 countries. Known for its fast-turnaround prototype PCB production, the company continually invests in state-of-the-art machinery, process optimization, and advanced production information systems. The latest investment in new printing equipment reflects this ongoing commitment to innovation.
One of the key upgrades is the Lauffer press, which replaces a 30-year-old machine that had become difficult to maintain. Another addition is the Monolam MLP 25M, capable of pressing plates at temperatures up to 400ºC, enhancing the company’s ability to handle more complex production processes. The third new machine, the Optical Pinless Bonding 211/8, introduces a pinless pressing method, streamlining the production process.
After an initial familiarization period, the new machines have been fully integrated into Gatema’s production workflow. The total cost for the new press center equipment was €914,000. The company reports a notable increase in production capacity, including the ability to run an entire shift without an operator present, thanks to the system’s “ghost shift” feature.
This upgrade positions Gatema PCB to meet the growing demand for high-quality, quick-turnaround PCBs while enhancing operational efficiency and expanding production capacity.
GARBSEN, GERMANY – LPKF Laser & Electronics SE is pleased to announce that Peter Mümmler will be joining the Management Boad as Chief Financial Officer with effect from 1 April 2025, with an initial contract term of 3 years.
With a 30+ year career, which includes 20 years' experience in executive-level finance and strategic leadership roles, Peter Mümmler brings a wealth of knowledge and expertise to his new role at LPKF. He will be responsible, among other things, for overseeing LPKF’s financial operations, group-wide cost optimisation programmes, capital allocation, legal & compliance and supply chain. Furthermore, he will play a significant leadership role in guiding the company's financial and business strategy to support its long-term growth objectives and enhancing shareholder value.
"Mümmler’s experience is a powerful combination of deep technical knowledge and financial acumen, encompassing corporate finance, strategy, capital allocation and M&A," said Jean-Michel Richard, chairman of the Supervisory Board. "Mümmler’s proven track record of strategic vision, strong business leadership, and commitment to fostering a results driven positive culture will be invaluable as we continue to innovate and drive growth."
Mümmler continued, "I am excited to be joining LPKF at this important stage in its growth journey and contribute to the company's continued success. LPKF is a technology leader with a strong culture. I look forward to be working with Klaus Fiedler and the entire team to drive financial excellence, operational efficiency, and help accelerate the business transformation and value creation."
About Peter Mümmler
Prior to joining LPKF, Mümmler served as interim CFO and Managing Director at Heramba Plc (former Kiepe Electronic GmbH, a carve out of Knorr Bremse) where he led the company through a NASDAQ listing. His career started at Siemens where he spent 25 years having held various hands-on senior positions in purchasing, controlling, IT, M&A and integration, financial and assurance audit and global manufacturing operations in senior executive mangement postions including 4 years in both Dallas (USA) and Shanghai (China). Mümmler then joined Alstom Transportation as VP Finance, Europe where he led the integration of Bombardier before focusing on the DACH region for M&A and integration, cultural transformation and delivering cost synergies.
ORLANDO, FL – Laser Photonics Corporation (NASDAQ: LASE) (“LPC”), a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.
Laser processing has emerged as an effective method of PCB depaneling due to its non-contact nature, narrow kerf width, and precision. This method eliminates part-induced stress and the need for consumables like cutting oils, ensuring cleanliness and high-quality results.
Custom-tailored depaneling laser technology by CMS Laser features high speed, pinpoint accuracy and machine vision alignment. The company offers PCB depaneling systems integrating CO2 and UV laser types. The main deciding factor when determining which laser to use is the relative importance of cycle time versus the cleanliness of the cut edge. CO2 lasers provide fast cuts and cost efficiency, while UV lasers offer clean cuts with minimal charring.
“By bringing together the talented engineers and technicians of Control Micro Systems and Laser Photonics, we plan to boost the development of PCB depaneling systems to meet the growing demand in the market,” said John Armstrong, Executive Vice President of LPC.
Many manufacturers have chosen laser routing as it’s ideal for flexible, highly sensitive, small PCBs used across electronic devices. CMS Laser’s solutions offer precision and efficiency suitable for standalone or integrated SMT line operations.
CMS Laser’s Class I PCB depaneling systems feature Through the Optics Vision (TTOV) for precise processing and data verification and include CMS Process Engine software, offering a user-friendly interface and optional production line communication. Easy setup and quick changeovers ensure high throughput with excellent accuracy and repeatability, delivering high yield and customer value.
Leveraging CMS Laser’s specialized expertise, LPC is channeling resources into R&D in the PCB manufacturing area, aligning with its comprehensive diversification strategy. This move aims to enhance shareholder value and build resilience in evolving markets. For more information, visit the LPC website at www.laserphotonics.com
AURORA, CO – AdvancedPCB announces Gregory Halvorson has been appointed Chief Executive Officer, effective Monday, December 9th.
Halvorson’s career spans over 35 years at some of the most successful and respected printed circuit board (PCB) companies, including Dynamic Circuits, Dynamic Details, Streamline Circuits, and Summit Interconnect. His extensive expertise covers engineering management, strategic innovation, and operational excellence.
Notable roles include serving as Chief Technology Officer, President/Founder, and Chief Operating Officer, solidifying his reputation as a dynamic and transformative leader. Halvorson’s appointment comes at a pivotal time for the North American PCB market and will be an advantage for Aerospace and Defense, Industrial, Medical, Automotive, and many customers seeking solutions Made in America.
“We are excited to welcome Greg to the AdvancedPCB family,” said Eric Heglie, Chairman of the Board for AdvancedPCB. “Greg has a unique background and experience in the PCB industry. We are confident that he will be able to push AdvancedPCB’s operations, capabilities, and customer service to new levels.”
Halvorson commented, “I am honored to join AdvancedPCB and look forward to building on its strong foundation of innovation while creating lasting value for our customers.”
CHANDLER, AZ – Rogers Corporation (NYSE: ROG) ("Rogers") announced today that Laura Russell has been appointed to serve as the Company’s new Senior Vice President, Chief Financial Officer and Treasurer effective December 10.
"Since taking over as interim CFO in August, Laura has proven to be an invaluable addition to Rogers’ senior executive team," said Colin Gouveia, Rogers' President and CEO. "She has demonstrated outstanding leadership of critical finance functions and has already made significant contributions. Laura brings extensive business and financial expertise from leading companies, which will be a tremendous asset to Rogers as we continue to execute our strategic objectives."
Ms. Russell, age 49, joined Rogers in September 2023 as Vice President of Finance and served in that capacity until her appointment as interim CFO in August 2024. Prior to joining the Company, from July 2021 to September 2023, Ms. Russell served as the Vice President of Finance, Operations for Wolfspeed. From December 2015 to July 2021, Ms. Russell was the Vice President of Finance for the Radio Products business of NXP Semiconductors ("NXP"). Prior to NXP, from 1997 to December 2015, Ms. Russell served in multiple roles with Motorola and Freescale Semiconductors (later acquired by NXP). Ms. Russell earned her BA in Business Economics from the University of the West of Scotland and is a member of the Chartered Institute of Management Accountants.
MUNICH, GERMANY – Wurth Electronics Midcom Inc., German Branch, with EU headquarters in Munich, has opened a laboratory for the production of transformer prototypes at the Hightech Innovation Center in Munich-Freiham. The company, which specializes in transformers for switch-mode power supplies and customized inductive components, is part of the Würth Elektronik eiSos Group. In Munich, they produce custom magnetics prototypes using first-class equipment and high-quality materials. On November 11, 2024, the new facility was presented to customers and partners including a tour of the test fields, EMC chambers and the office and meeting areas designed according to modern New Work aspects.
The main purpose of the new capacities is to promote intensive and transparent collaboration with customers. In-house prototype development and production enables the design engineers to also accompany their process in its implementation. All products are tested individually using advanced equipment and methods. The facility's technical equipment offers new opportunities for R&D projects and patent development. Students and young talents also benefit from the site's extensive equipment for research and final theses. In the future, prototypes of high-performance products and wireless power coils will also be produced here at the Hightech Innovation Center in Munich.