ATLANTA - ECIA is pleased to announce a new resource for component buyers and engineers at [www.ecianow.org/buyers-engineers]www.ecianow.org/buyers-engineers. Customers can find new information about how lead times are calculated, the difference between component cycle times and lead times, new tools for tracking tariffs on specific components, new videos about the industry, and important changes in thinking about date codes and much more.
“After the supply chain disruptions following the pandemic, our members became painfully aware of how much confusion exists in the marketplace about components,” explained David Loftus, ECIA CEO and President. “ECIA is seizing this opportunity to communicate with customers in order to solve industry challenges that for too long have held back overall supply chain efficiencies that would be mutually beneficial.”
“One example is date codes,” added Don Elario, VP of Industry Practices. “With the current excess inventory situation, now is the perfect time to finally institute rational policies and processes to prevent perfectly good components from being destroyed because they are out of date. The science is clear, and we are reaching out engineer to engineer to help customers understand the evidence about the impact of shelf life on component performance.”
The Electronic Components Industry Association (ECIA) is made up of the leading electronic component manufacturers, their independent manufacturer representatives and authorized distributors. ECIA members share a common goal of promoting and improving the business environment for the authorized sale of electronic components. Comprised of a broad array of leaders and professionals representing all phases of the electronics components supply chain, ECIA is where business optimization, product authentication and industry advocacy come together. ECIA members develop industry guidelines and technical standards, as well as generate critical business intelligence. For more information, visit www.ecianow.org or call 678-393-9990.
LEOBEN – Yesterday evening, the International Finance Corporation (IFC), a member of the World Bank Group and the largest global development institution focused on the private sector in emerging markets, and AT&S have signed a sustainability-linked loan agreement for 250 million US dollars at the AT&S headquarters in Leoben-Hinterberg. The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US dollars could be provided by local banks under the same agreement.
The sustainability-linked loan features financial incentives tied to AT&S lowering its annual greenhouse-gas emissions by 31 percent by the year ending March 31, 2028, compared to the baseline for fiscal year 2022.
“We are delighted to have the support of IFC as partner in our growth,” says CFO Petra Preining. “Despite a challenging market environment, we are continuing to expand our plant in Kulim; for AMD’s data center processors AT&S Malaysia will start delivering high-end integrated circuit substrates soon.”
“We’re excited to partner with AT&S on this financing, which ranks as one of the first sustainability-linked loans in Malaysia’s electrical and electronics products industry,” said Carsten Mueller, Regional Industry Director, Manufacturing, Agribusiness and Services, Asia and the Pacific at IFC. “Our investment will help to advance Malaysia’s semiconductor manufacturing ecosystem, while supporting the country in achieving its sustainability goals.”
The loan will support AT&S to further develop the new AT&S plants in Kulim, Malaysia to produce advanced IC substrates that are an integral part of processors for high-performance computing, data centers and AI infrastructure. The facilities in Kulim were built to the highest quality and sustainability standards, with state-of-the-art machinery, recycling systems and a sustainable energy concept.
IFC
IFC — a member of the World Bank Group — is the largest global development institution focused on the private sector in emerging markets. We work in more than 100 countries, using our capital, expertise, and influence to create markets and opportunities in developing countries. In fiscal year 2024, IFC committed a record $56 billion to private companies and financial institutions in developing countries, leveraging private sector solutions and mobilizing private capital to create a world free of poverty on a livable planet. For more information, visit www.ifc.org.
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced Technologies & Solutions
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for VR and AI applications. AT&S has a global presence with production sites in Austria (Leoben, Fehring) as well as plants in India (Nanjangud) and China (Shanghai, Chongqing). A new high-end production site for IC substrates is currently being established in Malaysia (Kulim). In Leoben, a European competence center including series production for IC substrate technologies is being built. Both sites will start production in the financial year 2024/25. The company currently employs 13,000 people. For further information please visit www.ats.net.
Oshkosh, WI: Mike Thiel President of Multicircuits, a leading provider of high-reliability printed circuit boards (PCBs), has announced the addition of a state-of-the-art automated copper via fill process to its advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
Copper via fill technology plays a crucial role in improving signal integrity, increasing thermal conductivity, and enhancing circuit density. This advanced process ensures superior performance for high-density interconnect (HDI) and multilayer PCBs, reinforcing Multicircuits' reputation as an industry leader in precision manufacturing.
“We continuously invest in cutting-edge technologies to provide our customers with the most advanced PCB solutions,” said Mr. Thiel when making the announcement, “The addition of copper via fill strengthens our commitment to innovation and positions us as a premier partner for high-performance electronics manufacturing.”
Dave Kemper, Process Engineering Manager at Multicircuits, highlighted the technical advantages of this new capability: “This new process allows us to manufacture more robust PCBs with improved electrical and thermal properties. Our team has worked diligently to ensure a seamless integration of this process, and we are excited to offer this enhanced service to our customers.”
With the introduction of automated copper via fill, Multicircuits continues to push the boundaries of PCB technology, delivering superior reliability and performance to customers across a wide range of industries.
For more information, visit www.multicircuits.com or contact: Jerry Smith Director of Sales at 920-279-5643 email This email address is being protected from spambots. You need JavaScript enabled to view it.
About Multicircuits:
Multicircuits is a premier manufacturer of high-reliability printed circuit boards, specializing in advanced solutions for aerospace, defense, medical, and telecommunications applications. With a strong commitment to innovation and quality, Multicircuits delivers cutting-edge PCB technology to meet the evolving needs of the electronics industry.
HILLSBORO, OR – The Northwest Electronics Design & Manufacturing Expo (NEDME) is gearing up for its 2025 event, and exhibitor registration is now open! Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This year’s keynote speaker is Quantum Computing hardware expert Jim Clarke.
Going 22 years strong, NEDME remains the Pacific Northwest’s premier trade show for electronics design and manufacturing professionals.
Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now.
Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics and manufacturing sector.
In addition to exhibitor registration, NEDME is accepting applications for breakout speaking sessions. Industry experts and thought leaders are encouraged to apply to present engaging, educational sessions on cutting-edge topics in electronics design, manufacturing and more.
Be a part of the Pacific Northwest’s top electronics industry event!
• Exhibitor Registration & Booth Reservations: Register online at www.nedme.com
• Speaker Applications: Submit proposals at www.nedme.com
• Event Date: Wednesday, October 22, 2025
• Location: Wingspan Event & Conference Center, Hillsboro, OR
If you have questions or need more details – email This email address is being protected from spambots. You need JavaScript enabled to view it..
Leoben, March 6, 2025 – AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates, is demonstrating its long-term commitment to Korea by opening a new sales office in Seoul. The office will serve as a central hub for regional customers and enable closer collaboration with partners.
Following the recent sale of the AT&S plant in Ansan to the Italian technology group Somacis, the establishment of the new office represents the next logical step in the company’s strategic direction. AT&S continues to view Korea as a key market for existing and future partnerships.
“With the new sales office in Seoul, we are strengthening our position in one of the most important markets in Asia. The proximity to our customers allows us to meet their requirements even more precisely and quickly,” emphasizes Peter Schneider, Spokesperson of the Board and Executive Vice President Business Unit Electronics Solutions.
He adds: “Expanding our presence in Korea is an essential pillar of the company’s global growth strategy. Korea is a dynamic high-tech location with great strategic importance for AT&S. The new sales office provides the foundation to support our customers even better and further expand our innovative strength in the region.”
The opening of the new office highlights the growing importance of the South Korean market for AT&S. “With the new sales office in Seoul, we are creating the foundation to deepen our partnerships with famous South Korean conglomerates in the Electronics and Automotive Industry and to offer innovative solutions for key industries such as AI, automotive, and wireless communication,” emphasized Andreas Wippel, Vice President Sales Electronics Solutions, in his opening speech.
AT&S’s commitment and presence in the Korean market
At the official opening on March 5, 2025, AT&S welcomed numerous guests, including His Excellency Dr. Wolfgang Angerholzer, Ambassador of the Republic of Austria to Korea, as well as representatives of partner companies and customers. “The opening of AT&S’ new sales office in Seoul shows the company’s commitment to the Korean market. The continued presence of AT&S in Korea highlights the importance of industrial cooperation and the leading edge of Austrian high-tech companies such as AT&S,” said Ambassador Angerholzer.
Wolfgang Köstinger, Commercial Counsellor at the Advantage Austria Office in Seoul also underlined the significance of the new sales office for Austrian-Korean economic relations: “As the Austrian Trade Commissioner for South Korea it makes me extremely proud that AT&S as one of Austria’s foremost high-tech companies has decided to open its sales office in Seoul,” says Wolfgang Köstinger.
A symbolic highlight of the ceremony was the ribbon-cutting, officially marking the start of the new office.
As a gesture of appreciation, guests received a special gift: a framed picture of a tiger made from printed circuit boards, a symbol of strength and resilience, representing the Korean Peninsula.
With this new presence, AT&S marks an important milestone in its global growth strategy. The new office will not only strengthen existing customer relationships but also open up new business opportunities in the region. By the 2026/27 financial year, AT&S aims to achieve revenue of around EUR 2,4 billion, further solidifying its position as a technology leader in the global microelectronics industry.
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced Technologies & Solutions
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance processors for VR and AI applications. AT&S has a global presence with production sites in Austria (Leoben, Fehring) and plants in India (Nanjangud) and China (Shanghai, Chongqing). A new high-end production site for IC substrates is currently being established in Malaysia (Kulim). In Leoben, a European competence center including series production for IC substrate technologies is being built. Both sites will start production in the financial year 2024/25. The company employs more than 13,000 people.
