AUSTIN, TX – Cetec ERP is excited to announce its participation at the Electrical Wire Processing Technology Expo (EWPTE) 2025, taking place May 6-8 at the Wisconsin Center in Milwaukee, WI. Attendees can visit Cetec ERP in booth 1347 to explore how its all-in-one platform helps manufacturers streamline operations, enhance quality management, and reduce costs.
As part of the event’s technical conference, Jordan Jolly, Director at Cetec ERP, will present a session titled "Integrating Internal Failure Tracking and Cost of Quality into Manufacturing Processes" on Wednesday, May 7 at 10:30 a.m. This session will provide valuable insights into tracking internal failures, optimizing cost allocation, and leveraging integrated ERP systems to improve profitability and quality management.
In manufacturing, understanding the Cost of Quality (CoQ) is essential for identifying inefficiencies and improving bottom-line performance. Jolly’s presentation will focus on the importance of tracking labor, finished goods material, and raw material costs associated with internal failures. By integrating real-time inspection failure tracking into ERP systems, manufacturers can visualize total material and labor costs, enabling data-driven quality improvements.
“With proper inspection and failure tracking, companies can gain actionable insights to reduce costs and enhance operational efficiency,” said Jordan Jolly, Director, Cetec ERP. “Our goal is to help manufacturers integrate CoQ principles seamlessly into their ERP systems for smarter decision-making.”
Manufacturers attending EWPTE 2025 are encouraged to visit Cetec ERP’s booth to learn how its fully integrated platform simplifies quality tracking, cost management, and production optimization. Cetec ERP provides an affordable, cloud-based solution that combines ERP, MES, QMS, CRM, MRP, and Accounting into a single, streamlined system tailored for modern manufacturers.
For more information, stop by Cetec ERP’s booth at EWPTE 2025 or visit www.cetecerp.com.
HANAU – Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled to take place May 6-8, 2025 in Nuremberg, Germany. Visitors can explore Heraeus Electronics' wide range of material solutions at Hall 6, Booth 6-310.
Among the highlights at PCIM will be the debut of DTS® Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost. The Heraeus Die Top System (DTS®) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS® enhances electrical and thermal conductivity, strengthens die connection reliability, and optimizes overall module performance. The innovative solution DTS® Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.
Heraeus Electronics will also showcase Condura®.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura®.ultra maintains outstanding reliability. Condura®.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (>80 W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.
Experts from Heraeus will deliver two insightful presentations at the e-Mobility & Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:
“Heraeus Electronics Introduces the Next Generation DTS®”
Speaker: Christian Kersting
Date & Time: May 6, 12:30 PM
“Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications”
Speaker: Oliver Mathieu
Date & Time: May 7, 12:55 PM
Heraeus Electronics will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials:
DTS® Silver – The innovative solution for cost-optimized, high-performance applications
Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
Condura®.ultra – A cost-effective, silver-free Silicon Nitride AMB for demanding applications
Live Presentation: May 6th, 11:00 PM and May 8th, 13:00 PM
Fastlane – An EU-funded project accelerating the European value chain for power electronics
Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
Heraeus Electronics invites attendees to visit Hall 6, Booth 6-310 to experience these solutions and more firsthand and engage with technical experts.
About Heraeus
The Heraeus Group is a broadly diversified and globally leading family-owned technology company, headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660. Today, Heraeus bundles diverse activities in the Business Platforms Metals and Recycling, Healthcare, Semiconductor and Electronics as well as Industrials. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership. In the 2022 financial year, the group generated revenues of €29.1 billion (US$30.6 billion*) with approximately 17,200 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets. (* calculated with 2022 average exchange rate, 1€ = 1.0530 US$)
About Heraeus Electronics
Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio - from materials and material systems to services.
WALTHAM, MA -- Nano Dimension Ltd., a digital manufacturing leader, today announced the appointment of Mr. Ofir Baharav as its new Chief Executive Officer, effective immediately. This strategic move underscores the Company's commitment to swiftly realizing merger synergies, restoring profitability, and delivering substantial shareholder value.
The Board of Directors, having worked closely with Mr. Baharav as Chairman, recognized his unique qualifications. Mr. Baharav has a proven track record in transformation and innovation, along with a deep background in capital equipment for the electronics industry and additive manufacturing, 3D printing technologies, making him the ideal candidate to lead Nano Dimension through this pivotal phase.
“Mr. Baharav’s proven ability to drive strategic change and operational efficiency is precisely what Nano Dimension needs at this critical juncture,” stated Robert Pons, Nano Dimension new Chairman of the board of directors, “His deep industry expertise and leadership will be instrumental in navigating the integration, achieving rapid profitability, and delivering significant value to our shareholders.”
Mr. Baharav brings nearly three decades of experience in capital equipment, spanning additive manufacturing and electronics. His prior roles as CEO of Maxify, VP Products at Stratasys, CEO at Xjet, EVP Products at Credence Systems, and President at Optonics, demonstrate a consistent pattern of driving strategic vision, technological innovation, cost optimization, and accelerated growth.
Driven by a passion to build disruptive manufacturingtechnology organizations, but also the capabilities to drive necessary transformation, Mr. Baharav has already stewarded significant changes since becoming Chairman on December 15th, 2024, including:
Strategic Realignment: Refocused R&D and sales on products and services where the Company can innovate, maintain long-term competitiveness, and partner with customers in the fabrication of high-value, high-performance applications.
Cost Reduction: Implemented immediate measures to reduce G&A expenses, which are expected to deliver over $20 million of fully annualized savings by year-end; with further reductions expected from post-merger operational consolidation
High-impact Negotiations: Successfully negotiated with CFIUS to remove restrictive limitations on post-merger cost reductions and synergy realization, enabling the company to achieve projected operational efficiencies.
Governance Enhancement: Initiated amendment proposals to the Articles of Association (pending shareholder approval) along with removal of poison pill to better align with shareholder interests, which reinforces transparency and accountability.
Operational Optimization: Streamlined and relocated field operations to enhance sales in the U.S. and China, improving market penetration and customer responsiveness.
Accountability and Transparency: Implemented comprehensive performance metrics and reporting systems, ensuring clear accountability and data-driven decision-making.
“We are confident that Mr. Baharav’s leadership will drive the rapid and decisive actions necessary to achieve profitability and refocus the company,” said David Stehlin, a Board Director, “His combined expertise in electronics and additive manufacturing is uniquely suited to our strategic direction, ensuring we capitalize on the significant opportunities ahead.”
The board wishes to thank Mr. Julien Lederman for his strong leadership and execution having stepped into the role of Interim CEO in the most challenging of times with both board and management completely afresh. As Nano Dimension’s Chief Business Officer, Mr. Lederman will be leading the corporate transformation with a strategic focus on post merger integration, communications, investor relations, along with spearheading a systematic operational planning and performance tracking framework to drive organizational excellence and accountability.
“It is a privilege to lead Nano Dimension in creating value for shareholders, working with a talented cohort of colleagues and partnering with industry leading customers. Nano Dimension, which now includes Desktop Metal and is expected to include Markforged, is composed of exciting opportunities to build an enduring digital manufacturing leader. Strategic integration efforts and transformations are underway, creating an exceptional company - one with a sustainable business model built upon innovative technologies focused on high value applications for digital manufacturing that will deliver financial results. I want to thank Mr. Lederman for his leadership during this time, and I look forward to working closely with him.”
Mr. Zivi Nedivi, President, and Mr. Tomer Pinchas, Chief Financial Officer and Chief Operating Officer are departing the Company. Mr. Baharav has resigned from the Board, while Robert Pons, a director since December 2024, becomes Chairman of the board.
About Nano Dimension
Driven by strong trends in onshoring, national security, and increasing product customization, Nano Dimension (Nasdaq: NNDM) delivers advanced Digital Manufacturing technologies to the defense, aerospace, automotive, electronics, and medical devices industries, enabling rapid deployment of high-mix, low-volume production with IP security and sustainable manufacturing practices.
HUIZHOU, CHINA – Tom Yang, CEO of CEE-PCB, is pleased to announce the appointment of Fred E. Hickman III as Vice President of Sales for North America. A seasoned industry leader with over 40 years of experience, Hickman has built a reputation for delivering exceptional customer experiences. His expertise spans technical sales, customer engagement, and strategic business development, making him a trusted partner for OEMs seeking cutting-edge PCB solutions.
"Fred brings the talent, experience, and reputation we need as we continue to expand our North American technology sales operations," said Tom Yang, CEO of CEE-PCB. "His deep industry relationships and commitment to customer success align perfectly with our mission to be themost caring, helpful, and attentive PCB provider in the world. We are confident that Fred will play a key role in driving growth and strengthening our presence in North America."
Hickman expressed his enthusiasm for joining the company: "CEE-PCB is exactly the kind of company I have been searching for at this stage of my career. I am highly selective about the PCB solutions I bring to my customers, and I am confident that CEE- PCB can provide the comprehensive, high-quality solutions they need to succeed."
About CEE-PCB
Huizhou CEE Technology Inc. (Stock Code:002579), founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. Our offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F) and flexible printed circuit assembly (FPCA). With three state-of-the-art factories located in key industrial hubs, we are recognized as a key high-tech enterprise under the National Torch Program, hold the position of Vice Chairperson in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters.
Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff. They are: Field Service Engineer, Juan Garcia; Quality Assurance Manager, Joanna Rafalowicz; Director of Operations, David Liston, and Analytical Chemist, Matthew Natelli.
Six Sigma certification demonstrates a deep understanding of statistical analysis, problem-solving, and project management. It signifies an individual's ability to lead process improvement initiatives, drive change, and deliver measurable results. Black Belt is the program’s highest certification level.
Uyemura International Corporation, 240 Town Line Road • Southington, CT 06489. (800) 243-3564. www.uyemura.com.
CEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and will offer local support starting March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice. Markus Voeltz, an experienced sales professional with over 20 years of experience in the PCB/FPC and EMS industries, will head the new European branch. He will be the direct contact for customers and prospects across various industries, offering tailored solutions and support.
CEE PCB is known for its comprehensive product range, which includes multilayer PCBs with up to 30 layers, HDI PCBs, and flexible printed circuits. The company delivers high quality solutions for a wide range of applications, from prototype development to mass production. Notably, CEE PCB is highly flexible and able to handle both small and medium batch sizes efficiently. The company is certified not only to ISO 9001 but also to the demanding standards of IATF 16949 and ISO 13485, which are particularly important in the automotive and medical technology sectors. These certifications ensure a robust quality management system that meets the highest industrial standards.
“The decision to offer direct support in Europe is another step toward serving our customers even faster and more effectively,” says Tom Yang, CEO of CEE “Our long-standing experience and extensive product portfolio, combined with our local presence, allow us to address the specific needs of our customers more directly.” With this expansion, CEE PCB reinforces its ambitions to strengthen its market position as a reliable partner for PCB and FPC solutions while enhancing its proximity to European customers.
About CEE PCB
CEE PCB is a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 25 years of successful international operations. With three production facilities and a team of over 5,000 employees, CEE PCB provides high-quality solutions for a wide range of industries, including automotive, medical technology, telecommunications, and consumer electronics. The company offers innovative manufacturing technologies and comprehensive consulting, covering everything from prototype development to mass production.
