MORRISVILLE, NC – iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.
Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.
Registration This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Mark Schaffer (This email address is being protected from spambots. You need JavaScript enabled to view it.).
Monday, September 30, 2024 11:00 a.m. – 12:00 p.m. EDT (Americas) 5:00-6:00 p.m. CEST (Europe) Register for this webinar
CAMBRIDGE, UK – Additive manufacturing offers geometric flexibility and relatively fast go-to-market times without coming at a large expense for low to medium-volume applications. Some very established printing technologies already widely utilized include selective laser sintering, thermoplastic filament extrusion, and direct metal laser sintering. IDTechEx's report, "3D Printing and Additive Manufacturing 2024-2034: Technology and Market Outlook", looks at these methods in detail and explores trends impacting new additive manufacturing approaches.
New, complex, and optimized structures could possibly be manufactured as the industry finds new ways to use materials and hardware to address customers' needs. Materials innovation is opening opportunities for newer applications, so the additive manufacturing market is by no means done growing yet.
Why is additive manufacturing consistently gaining traction?
Improving on established technologies and innovating new printing hardware allows startups to take a shot at entering the market. New methods include the extrusion of thermosets using gel beds as a support for the print, developed by Rapid Liquid Print, while another company, 3Deus Dynamics, has created a new method for the extrusion of soft materials into a powder bed. This can act as both a means of support and a strengthening mechanism for the print. Companies like Vitro3D focus on volumetric additive manufacturing, providing speed and other advantages when compared to layer-by-layer approaches.
Binder jetting as a technology is also gaining traction, which is very beneficial for metal powder providers. Due to the high throughput of binder jetting, higher material utilization can be realized, leading to higher sales and lots of opportunities for these companies.
The benefits of AI and automation
The role of automation is becoming more prevalent all the time, with the usage of AI and robotics potentially making the utilization and adoption of additive manufacturing more successful. IDTechEx reports that AI could detect early errors in the printing process and defects after printing, and be able to correct them, changing the 3D model if necessary to prevent reoccurring errors. Additionally, AI can assist with the creation and development of more complex structures, and with the accompaniment of robots, the amount of labor required for additive manufacturing processes can be reduced. This use of AI and robotics could lower the barriers to entry across the different stages of the market, as there is less need for specialized knowledge and large numbers of employees to work around the clock on these 3D printers.
Markets for additive manufacturing
Automotive OEMs have begun to realize the potential of additive manufacturing with Tesla's introduction of Giga Casting - a technology invented to create different parts of cars that are ordinarily made of lots of welded parts. Sand binder jetting can be used to create molds, which can then be used in the Giga Casting process, streamlining the manufacturing process to make producing large numbers of electric vehicles more straightforward. IDTechEx names this a major application for 3D printing within the EV market, with other automotive manufacturers are now considering this approach.
Uses of additive manufacturing within the consumer electronics sector include Apple's use of binder jetting to produce the steel chassis for Apple Watches and their consideration of the process for other parts, demonstrating the trust in this technology from large global companies.
Additive manufacturing is clearly a diverse field, with room for players to optimize and innovate. IDTechEx's report on the topic, "3D Printing and Additive Manufacturing 2024-2034: Technology and Market Outlook", explores different applications further and predicts the industry to surpass US$44 billion in revenue by 2034, reflecting the expectations of growth and success in the near future. The report goes into further detail about how current and emerging methodologies could lead to more sustainable successes within the 3D printing industry.
To find out more about this report, including downloadable sample pages, please visit www.IDTechEx.com/3D
For the full portfolio of 3D printing market research available from IDTechEx, please see www.IDTechEx.com/Research/3D
SAN DIEGO – Altium, a global leader in electronics design systems, announced today that it has launched the Requirements & Systems Portal Application into the Altium 365 cloud platform for electronics design collaboration. The Requirements & Systems Portal helps to ensure visibility and awareness of functional requirements from concept to manufacturing, improving upon cost, quality, and risk in the product development process.
The launch follows Altium’s acquisition of Valispace earlier this year. Valispace is a game-changing Systems and Requirements Engineering tool that joins system design and requirements engineering with an AI-assisted and data-driven approach.
The electronics design process is disconnected and plagued by rework because the work of PCB design engineers is often disconnected from system requirements. The Requirements & Systems Portal ensures that electrical teams can write, manage, and verify their requirements directly in the Altium 365 ecosystem, allowing team members from different disciplines to view requirements in the context of their designs. When electrical engineers, electrical managers, systems architects and external stakeholders all have access to the same information, everyone on the team knows they are working with the latest values and up-to-date specifications.
The integration of the Requirements & Systems Portal into Altium 365 extends the platform’s capability as an end-to-end development platform and supports Altium’s goal of connecting everyone involved in the electronics development process.
"The Requirements & System Portal on Altium 365 supercharges innovation and accelerates time to market,” said Ananth Avva, VP and GM of Cloud Platform, Digital Industries, at Altium. “By bringing product-level context to the entire electronics design process, engineers can effortlessly ensure requirements are met across applications like supply chain and simulation. This puts systems thinking at the forefront, empowering engineers to thrive in today’s competitive landscape and deliver world-class electronic products.”
HILLSBORO, OR – The Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
NEDME is the region’s largest event dedicated to advancing the electronics manufacturing industry. It’s your chance to connect with suppliers, industry leaders, and innovators who are driving the future of electronics design and manufacturing. Whether you’re involved in PCB design, product development, sourcing materials, or working in manufacturing operations, NEDME has something for you.
Highlights of NEDME 2024 Include:
Exhibit Hall: Discover the latest products and services from vendors and suppliers, showcasing the newest technology and solutions.
Keynote Speakers: Gain insights from top thought leaders in the industry as they share their expertise on current trends, challenges, and opportunities in electronics design and manufacturing.
Technical Sessions & Workshops: Stay ahead of the curve with informative sessions covering a range of topics, in the design, manufacturing and business categories.
Networking Opportunities: Meet and collaborate with peers, potential partners, and industry experts throughout the day.
Event Details:
Date: Wednesday, October 30, 2024
Time: 9:00 AM – 4:00 PM
Location: Wingspan Event & Conference Center, 801 NE 34th Ave, Hillsboro, OR 97124
How to Register: Attendee registration is now open! Secure your spot today by visiting www.nedme.com and clicking on the registration link. Early registration is highly encouraged to get seats at your preferred sessions.
About NEDME: Northwest Electronics Design & Manufacturing Expo (NEDME), launched in 2003, is a premier event created by the Electronics Manufacturing Association (EMA) to support the electronics design and manufacturing industry in the Pacific Northwest. NEDME provides a platform for industry professionals to connect, explore new and exciting technologies, and stay ahead of industry trends.
For additional information, please contact: NEDME Email: This email address is being protected from spambots. You need JavaScript enabled to view it. Website: www.nedme.com
PETACH TIKVA, ISRAEL – Eltek Ltd. (NASDAQ: ELTK), a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, is pleased to announce the appointment of Tomer Segev as its new Vice President of Marketing and Sales, effective immediately.
With over 20 years of experience in the technology and electronics industries, Tomer Segev brings a wealth of knowledge in driving global sales growth, executing strategic marketing initiatives, and expanding market presence. He will oversee Eltek's global sales operations, lead the marketing team, and play a pivotal role in expanding the company's footprint across key markets.
"We are excited to welcome Tomer to the Eltek leadership team," said Eli Yaffe, CEO of Eltek. "His proven track record of building high-performance teams and driving significant revenue growth will be instrumental as we continue to innovate and deliver high-quality PCBs to our clients around the world. Tomer's leadership will help us strengthen our position in the industry and accelerate our growth strategy."
Prior to joining Eltek, Tomer held senior leadership roles at several prominent global technology companies, including PCB Technologies, Camtek, Orbotech, and KLA. In these positions, he excelled in sales and marketing, business management, and business development. Tomer holds a B.Sc. in Physics and Materials Engineering from the Technion and an MBA from the Kellogg-Recanati Executive MBA program of Northwestern University and Tel Aviv University.
"I am thrilled to join Eltek and contribute to the company's growth and success in this rapidly evolving market," said Tomer Segev. "I look forward to working with the talented team at Eltek to continue delivering cutting-edge solutions and unparalleled service to our customers."
SEOUL – LG Innotek said Wednesday it is showcasing its innovative semiconductor substrates at this week's KPCA Show 2024, held at the Songdo Convensia in Incheon, from Wednesday to Friday.
The KPCA Show is the largest annual exhibition of printed circuit board and electronic packaging, hosted by the Korea PBC and the Korea Printed Circuit Association for 21 years.
LG Innotek plans to unveil its package substrate and tape substrate products along with high-value semiconductor substrates, called Flip Chip Ball Grid Array. The company will boast the latest technology applied to its new growth engine, FC-BGA.
FC-BGA is a high-density printed circuit board that incorporates semiconductor substrate implementation technologies, including micropatterning and subminiature processing. With 3D models showing the inner structure of FC-BGA, visitors can see its multilayer, high-density structural features.
LG Innotek will also present the multilayer core substrate technology, essential for manufacturing large-area substrates. The maker has improved signal efficiency by diversifying the material composition of the core layer.
Additionally, next-generation substrate technology such as the glass core for advanced substrates and high-frequency noise elimination will be revealed at the KPCA Show.
LG will showcase its FC-BGA products for PCs, servers and autonomous driving. In the mobile zone, the company will display semiconductor substrates used in wireless front-end modules and application processors, while showcasing Chip on Film in the display zone.
“This year’s KPCA Show can create the momentum for our 50-year substrate technology to gain recognition. By launching high-value substrate products, we will further solidify our position as a market leader,” said LG Innotek Vice President Kang Min-seok.
