TAIPEI – As SCHMID Group proudly celebrates its 160th anniversary, the company will mark this significant milestone by showcasing its latest innovations at the TPCA Trade Show in Taiwan. From October 23-25, 2024, SCHMID will present cutting-edge manufacturing solutions at Booth N917, demonstrating its continued leadership in advancing production technology for over a century and a half.
160 Years of Excellence: Founded in 1864, SCHMID Group has grown from its roots as a local company in Germany to become a global leader in high-tech manufacturing equipment and smart factory solutions. Throughout its long history, SCHMID has remained at the forefront of technological advancement, evolving to meet the ever-changing demands of industries including electronics, automotive, energy, and more. Today, the company operates worldwide, with a focus on providing innovative solutions that drive efficiency, sustainability, and profitability for its customers.
Highlighting Key Innovations at TPCA 2024:
Complete Manufacturing Solution for Advanced Glass Core Substrates
SCHMID is proud to introduce its comprehensive equipment and process solution for cutting- edge glass core packaging. This solution begins with the through glass via core, covering via formation and plating, and extends to the redistribution layer using either SCHMID's proprietary embedded trace technology or the SAP process.
Customers have the flexibility to choose between a lab version for pilot production or a full set of equipment for high-volume manufacturing, catering to diverse production needs. This new offering from SCHMID represents a robust and versatile solution for advanced glass core substrates, ensuring high performance at every stage of the manufacturing process.
Game-Changing Via Forming Process: HPPF (High Performance Plasma Forming)
As a second major highlight at the SCHMID booth, the HPPF (High Performance Plasma Forming) takes center stage, offering a next-generation via forming process designed to replace traditional laser-drilled vias for mSAP and SAP applications. The technology offers several unique advantages: flexible hole shapes (round, square, line-to-line), reduced hole sizes down to 5μm with the highest registration accuracy defined by photolithography (rather than laser drilling), precise depth control, and more—enabling a completely new level of miniaturization. It unlocks a whole new world of possibilities for HDI+ and advanced packaging designs. This innovation is further enhanced by its ability to maintain consistent process times and costs, whether producing 1 million or 10 million vias.
This cutting-edge process enhances precision in advanced substrate manufacturing, delivering superior performance while lowering production costs. SCHMID’s HPPF technology is poised to redefine industry standards, giving customers a competitive edge in the electronics sector.
A Legacy of Innovation: With 160 years of industry experience, SCHMID Group continues to prioritize research and development. The company is known for its forward-thinking solutions that address the needs of a wide range of industries. SCHMID’s portfolio spans automated wet processing equipment, high-precision etching, electroplating, and more. As a key player in the solar, PCB, and electronics industries, SCHMID has established itself as a trusted partner for companies aiming to implement state-of-the-art manufacturing technologies.
We invite all visitors to stop by Booth N917 at TPCA 2024 to see firsthand how SCHMID Group’s innovations are transforming the future of manufacturing. Our team of experts will be available to offer personalized consultations, and deeper insights into how our solutions can benefit your business.
