CAMBRIDGE, UK – Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, antennas were positioned on PCBs; now, there's a shift towards integrating antennas directly onto the same package as the RF chip. Known as Antenna-in-Package (AiP), this advanced packaging technique capitalizes on the short wavelengths of mmWave applications, allowing for the creation of notably compact antennas seamlessly embedded within semiconductor packages. Unlike traditional discrete antennas assembled on PCBs, AiP integrates the antenna with the transceiver on a single chip, offering advantages such as improved antenna performance and substantially reduced package footprints.
While 6G research is progressing, the 5G mmWave market remains in its early stages, awaiting widespread adoption across various applications and user ecosystems. The advancement of Antenna-in-Package (AiP) technology is closely intertwined with the growth of both the 5G mmWave and future 6G markets. With AiP expected to be integral to all 5G mmWave-based stations and 5G-enabled devices such as smartphones, its ongoing development is pivotal.
In the development of Antenna-in-Package (AiP) technology for high-frequency communication devices, cost-effectiveness is paramount, aiming for a target price of $2 per 1x1 AiP module to enable widespread adoption. Achieving affordability involves overcoming a chicken-and-egg challenge where adoption must precede cost reduction through economies of scale. Utilizing cost-effective packaging materials and processes and ensuring miniaturization are crucial, especially for integration into consumer devices like smartphones. High performance is vital, necessitating the fabrication and integration of high-gain, broadband mmWave antenna arrays, alongside addressing electromagnetic compatibility (EMC) and optimizing signal integrity (SI) and power integrity (PI). Reliability is ensured through efficient heat dissipation, while scalability enables modules to meet diverse application needs. IDTechEx's report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into key considerations such as antenna element choice, substrate technology, integration of passive devices, and supply chain maturity. This article will focus on the choice of substrate technology, as it is the key influencer of all the abovementioned requirements.
Various factors must be considered when determining the appropriate substrate technology for AiP. These include core material choices, such as coefficient of thermal expansion (CTE), Young's modulus, moisture absorption, and thermal conductivity. The manufacturing capability of chosen substrates, including via size, metal layer counts, and line/space features, is also crucial. Moreover, Dk and Df for antenna layers, bumping technology, embedding technology, among others, play significant roles. For instance, lower insertion loss correlates with reducing the number of metal layers in routing, necessitating scaling dimensions of microvias (blind vias). Additionally, high current densities from power amplifier ICs demand numerous through-vias or plated-through-holes (PTHs) on the package substrate, underscoring the importance of precise dimensions for supporting I/O density and signal integrity. Effective power delivery requires specific aspect ratios at < 20 µm pitch, highlighting the complexity of substrate design. AiP substrate material requirements significantly influence antenna performance. A lower dielectric constant (Dk) widens bandwidth and enhances gain, while a high Dk enables smaller AiP sizes. Low dielectric loss (Df) contributes to increased efficiency. High Young's modulus ensures stiffness and reduces warpage, while low coefficient of thermal expansion (CTE) cores better match silicon. Zero moisture absorption is crucial for stability. Smooth surface roughness is needed for low-loss interconnects. Passive component integration requires thicker metallization, low dielectric losses, and flexibility in metal layers.
Presently, four substrate candidates are being considered for AiP technology: HDI (High Density Interconnect) based on low-loss materials, LTCC (Low-Temperature Co-fired Ceramics), High-Density Fan-Out, and glass substrate technology. Among these options, HDI is currently the incumbent technology for AiP. On the other hand, LTCC technology finds its primary application in high-frequency communication sectors, notably in the defense and aerospace industries, where cost considerations hold less weight.
Comparing organic-based substrates like HDI and Fan-out, HDI-based AiP demonstrates the highest supply chain and market maturity, translating into price advantages. However, its routing features, including metal roughness, line/space features, and via diameter, as well as overall package thickness, lag behind emerging fan-out technology. With the ongoing trend of wearables miniaturization, fan-out technology is expected to play a pivotal role in AiP development. Turning to inorganic packages like LTCC and Glass, inorganic AiP offers superior device reliability due to its non-reactivity with moisture compared to organic-based substrates. Glass exhibits notably better routing features than LTCC. However, the primary challenge for glass substrates lies in their immaturity within the supply chain and ecosystem. While LTCC boasts manufacturing and supply chain maturity, it faces hurdles in improving routing features. LTCC substrates, produced through screen-printing and co-firing, feature large RDL features (~100 μm), resulting in decreased signal routing density and increased module complexity.
Back to the initial question - which substrate tech rules for 5G and 6G AiP? IDTechEx anticipates that HDI will maintain its leading position across both infrastructure and consumer devices in the foreseeable future. This is attributed to the maturity of its supply chain and its cost-effectiveness as primary drivers. Nevertheless, this doesn't discount the potential role of inorganic substrates. IDTechEx foresees continued growth in the LTCC and glass market for AiP, particularly with the expanding 5G mmWave market. As for consumer devices, the emergence of mmWave-enabled gadgets is expected to propel the adoption of fan-out technology for AiP despite HDI's current dominance. Fan-out technology offers advantages in package miniaturization and performance, with the higher cost being justified by economies of scale.
The IDTechEx report "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", delves into AiP technologies tailored for 5G mmWave and emerging 6G networks. It analyzes substrate technologies, including organic, LTCC, and glass, alongside packaging methods such as flip-chip and fan-out, from material properties to manufacturing feasibility. The report explores antenna integration beyond 100 GHz, offering case studies and addressing prevalent challenges, projecting a future driven by advanced semiconductor packaging solutions.
Key aspects of the report include
Overview of 5G mmWave Development and 6G Roadmap:
Explore the status of 5G mmWave development, technology innovation roadmap, key applications, and market outlook.
Understand the landscape of 6G, including potential spectrum, enabling THz communication technologies, key research and industry activities, roadmap, technical targets, and applications.
Deep Dive into Beamforming Technologies Enabled by Phased Array Antenna for 5G mmWave:
Compare beamforming technologies of 5G sub-6 vs mmWave.
Examine phased array technologies, including antenna, semiconductor, and packaging integration components, technical requirements, trends, and design considerations.
Antenna Integration Technologies for 5G mmWave:
Discuss antenna substrate technology, benchmarking, material requirements, and packaging for phased arrays.
Explore various antenna packaging technologies for 5G mmWave, including antenna on PCB and antenna in package (AiP), categorized by packaging technologies: Flip-chip vs fan-out. Also, discuss substrate material choices, such as LTCC, low-loss organic-based, and glass, covering production challenges, material choices and benchmark, solutions/case studies from key players, and substrate design considerations for each packaging technology.
Antenna Integration Technologies for Applications Beyond 100 GHz:
Address challenges in 6G transceiver development, focusing on power requirements, antenna gain, and phased array demands.
Discuss various potential packaging technologies for beyond 100 GHz applications, covering thermal management options and low-loss material choices for antenna substrates. Include case studies showcasing D-band (110-170 GHz) phased array technology.
10-year granular market forecast of:
5G infrastructure:
5G mmWave base station forecast 2023-2034
Antenna Elements Forecast (Infrastructure)
AiP for 5G mmWave infrastructure shipment forecast 2023-2034
AiP for mmWave 5G infrastructure shipment forecast by packaging technology 2024-2034
mmWave antenna substrate forecast for 5G infrastructure (m2) 2023-2034
mmWave antenna substrate forecast by material type for 5G infrastructure 2023-2034
5G consumer devices: Smartphone and CPE
AiP module shipment in mmWave compatible smartphone forecast 2023-2034
AiP module shipment in mmWave-compatible smartphones by packaging technology 2023-2034
mmWave smartphone antenna area substrate by packaging technology 2023-2034
5G CPE mmWave AiP substrate area forecast by packaging technology 2023-2034
To find out more about the IDTechEx report report "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets", including downloadable sample pages, please visit www.IDTechEx.com/AiP
West Chicago, IL – May 20, 2024 – American Standard Circuits (ASC) and ASC Sunstone Circuits are excited to announce their participation in PCB East 2024, a premier event for the printed circuit board and electronics design industry. The event will take place from June 4-6, 2024, at the Boxboro Regency Hotel and Conference Center in Boxborough, MA.
Visitors to the ASC Sunstone booth will have access to educational resources and physical samples showcasing the company's various PCB technologies. Experts from ASC Sunstone will be available to answer technical questions and provide guidance on selecting the best solutions for PCB quoting and ordering.
“We are thrilled to exhibit at PCB East 2024 and engage with the PCB community,” said Matt Stevenson, VP/General Manager of ASC Sunstone. “This event provides an excellent platform to share our latest advancements and connect with industry leaders and customers.”
Join Us at PCB East 2024
American Standard/Sunstone Circuits invites all attendees to visit booth 202 for an in-depth look at their products and to discuss how ASC Sunstone can meet the needs of their PCB projects. Whether you are a designer, engineer, or PCB enthusiast, ASC Sunstone promises to offer valuable insights and exciting advancements in technology. Register to attend HERE.
In addition to the exhibit, ASC Sunstone is proud to announce that Anaya Vardya, CEO of American Standard Circuits, will be a member of the UHDI Forum at PCB East 2024. This forum promises to provide valuable insights into the latest advancements and applications of UHDI in the PCB industry. For more details, register for the forum.
About ASC Sunstone
American Standard Circuits (ASC) and Sunstone Circuits have joined forces to become the ultimate PCB solution provider with over 50 years of combined industry experience. ASC excels in producing Ultra HDI, rigid, metal-backed/core, RF/microwave, flex, and rigid-flex PCBs for diverse industries, while Sunstone Circuits is known for quick-turn, high-quality PCBs and exceptional customer support. This strategic alliance combines ASC's certifications and expertise with Sunstone's commitment to excellence, setting a new standard in PCB manufacturing. Together, they provide full scale solutions for engineers, from design to prototype to large-scale production.
For more information about ASC Sunstone and their product lineup, please visit www.ascsunstone.com.
AUSTIN, TX – High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
"Our mission is always to become the most reliable printed circuit board manufacturer in the world. We are focused on innovation all the time with R&D investments of about 10% year over year. Kinwong has a highly advanced Central Lab that is ISO 17025 qualified and can be used as a 3rd party lab", said Vincent Wang, the Tech. R&D Director at Kinwong. “It’s really a great honor to join HDP and I strongly believe the interaction with the HDP community will provide insights to have better understanding of cutting-edge technologies. The one chain of upstream, middle-stream and downstream linked by HDP will give all of us the full picture of the industry and accelerate innovation.”
"I am pleased to welcome Kinwong to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on HDI for next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
INGLESIDE, IL – IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will highlight its automation capabilities and PCB labeling solutions at PCB East, June 4-7 in Boxborough, MA, Booth #301.
With automation a key theme, IDENTCO’s commitment to simplifying the automation process for PCB manufacturers is evident through the company’s comprehensive label and equipment packages. Designed for hassle-free integration, IDENTCO’s automation products offer plug-and-play functionality with most SMT equipment brands.
Attendees of the show will have the opportunity for a live demonstration of the IPS-30 Slimline Label Feeder. At a mere 30mm (1.18 in.) wide – half the size of conventional feeders – the IPS-30 requires only one feeder position on pick and place machines, freeing up valuable space along congested SMT production lines. Providing precise and accurate placement, it can also feed labels or die cut parts as small as 2mm x 2mm.
Additionally, IDENTCO offers the IPS-45, a presenter ideal for applications requiring a wider variety in label size.
The company will also be exhibiting their robust label solutions for printed circuit board (PCB) applications, including DuraTrack. This label series provides printed circuit assemblies with comprehensive traceability – an increasingly attractive internal quality control and supply chain transparency feature for brand owners producing high-leverage electronics.
Engineered for use in surface mount technology and throughout the entire assembly process, DuraTrack thermal transfer printable labels can endure harsh fluxes, the latest cleaning chemistries, and high temperatures encountered in today’s circuit board assembly processes, on both sides of the board.
CAMBRIDGE, UK – Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.
Historically, printed electronics technologies have nurtured a close relationship with the automotive sector, with printed force sensors pioneering passenger safety through seat occupancy and seatbelt detection. As such, the automotive sector continues to represent the lion's share of the global printed and flexible sensor market, which IDTechEx’s report on the topic evaluates as worth US$421M in 2024. However, if the automotive sector is to continue to be a reliable revenue stream, printed electronics technology providers must adapt to address the emerging technical challenges facing future mobility.
Augmenting autonomous vehicles with printed electronics
As vehicle autonomy levels advance, the increasing number and distribution of spatial mapping sensors required will need continuous performance improvements to ensure passenger safety. Emerging printed electronics technologies can augment these sensors, extending detection bandwidth and maximizing reliability during operation.
Transparent conductive films (TCFs) are being developed to heat and defog LiDAR sensor panels, ensuring the function is unperturbed by external environmental conditions. Properties such as high transparency and low haze are important for defogging. These properties can be easily tuned using the wide variety of material options available for TCFs, including carbon nanotubes and silver nanowires.
IDTechEx identifies printed heating as a leading application of transparent conductive films. This is attributed to diminishing growth prospects in capacitive touch sensing applications. Innovations in thin film coating techniques have enabled indium tin oxide (ITO) to dominate touch sensing applications, all but displacing TCFs completely.
Looking towards the future, printed electronics technologies could play a more active role in advanced autonomous driving. Emerging semiconductive materials, such as quantum dots, printed directly onto conventional silicon image sensor arrays can extend detection range and sensitivity deeper into the infrared region. Augmenting existing image sensor technology with enhanced spectral range could facilitate the competition of hybrid silicon sensors with established InGaAs detectors.
Printed sensors promise granularized battery health monitoring
Vehicle electrification is driving the sustained development and evolution of electronic management systems, particularly in the battery and electric drivetrain. A strong market pull exists for technologies that increase vehicle efficiency, range, and lifetime while reducing recharge times.
Printed pressure and temperature sensors measure battery cell swelling and thermal profiles, providing granularized physical data that can be used to optimize battery deployment and recharging. Moreover, hybrid printed sensors that combine integrated printed heating elements promise a solution to actively address battery temperature. IDTechEx estimates that printed sensor-enabled battery deployment and charging optimizations could be worth up to US$3000 in savings per vehicle.
There remains uncertainty about whether electrification trends will correspond to increased demand for physical sensors in electric vehicle batteries, owing to the utility of existing electronic readouts for managing deployment. Virtual sensors also pose a threat, where AI-enabled software models interpret data to predict and emulate physical sensor functions without the need for discreet components. However, emerging regulations regarding safety and sensor redundancy will likely favor measurable metrics and see automotive makers continue to adopt physical sensors. IDTechEx predicts that virtual sensors are unlikely to displace their physical counterparts – so long as low-cost sensors remain widely available.
Embedding printed electronics in the car of the future
IDTechEx predicts that global car sales will saturate over the next decade, with automakers increasingly looking for premium features and technical innovations to differentiate themselves from the competition. In-cabin technologies will be highly desirable – as the location where passengers reside and interact with the vehicle the most.
Lighting elements are emerging as a prominent differentiator, described as “the new chrome” by Volkswagen’s chief designer. The use of in-mold structural electronics (IMSE) enables the integration of embedded lighting elements using existing manufacturing processes. 3D electronics technologies are intrinsically attractive for automotive integration, as functional layers are conformable and lightweight while easily embedded within existing aesthetic elements.
Despite strong tailwinds, the adoption of in-mold electronics within automotive interiors has been sluggish. This is attributed to the challenges of meeting automotive qualification requirements, as well as stiff competition with less sophisticated alternatives such as applying functional films to thermoformed parts. Nevertheless, momentum is building, with technology providers like Tactotek partnering with Mercedes-Benz and Stallantis to progress the automotive validation of IMSE to TRL5.
Outlook for printed electronics in automotive applications
Just as printed force sensors heralded early passenger safety systems, printed electronics technology is poised to underpin next-generation innovations for the car of the future. But this time, the competition will be stiff. Critical cost requirements must be met, while desirable new functionality must address existing challenges faced by manufacturers. Printed electronics can play a role in supporting emerging electrified and autonomous mobility, such as augmenting LiDAR sensors or optimizing electric battery deployment. Demand for technologies that enhance passenger experience and vehicle aesthetics will continue to grow, and printed electronics can supply low-power, lightweight lighting solutions for these.
Sustained engagement from tier suppliers and manufacturers continues to make the automotive sector key to printed sensor market growth opportunities – a total market IDTechEx predicts will reach US$960M by 2034. Strong partnerships between material providers and printed electronics technology providers are complementary to those of the highly vertically integrated automotive value chains between tier suppliers and OEMs. Leveraging printing techniques to provide solutions that slot into existing manufacturing processes and designs will be crucial. In the medium term, the printed electronics technologies most likely to realize revenue potential are those that can adapt to service emerging challenges already known to the automotive industry.
SOUTHINGTON, CT – Uyemura has published “MEC from Uyemura: The Roadmap for High Density and Ultra-High Density Circuits.”
This is a concise, online overview of advanced surface treatment products, including copper surface treatments that have produced highest product reliability; adhesion enhancement products for high- frequency PCBs; processes that enhance fine wire pattern accuracy; microetchants and residue removal agents for every application; environmentally-favored black oxide replacements, and more. Many of these processes are available for the first time in North America.
