CAMBRIDGE, UK – In recent years, there has been a noticeable trend in optical transceiver technology, moving toward bringing the transceiver closer to the ASIC. Traditionally, pluggable optics—optical modules inserted and removed from the front panel of a switch—have been located near the edge of the printed circuit board (PCB). These pluggable optics are widely used in data center networks to interconnect switches and servers. While they offer flexibility, scalability, and easy upgrades, they come with significant challenges, particularly high power consumption and limited bandwidth density.

To overcome these limitations, the industry is experiencing a paradigm shift. Optical transceivers are being brought closer to the ASIC, with the goal of shortening the copper channel required for electrical signal transmission. However, despite advancements in reducing the length of the copper channel, the challenges posed by deviating from the industry-standard pluggable architecture are not yet fully resolved. As a result, the industry may move directly toward more advanced solutions, like Co-Packaged Optics (CPO). IDTechEx's report, "Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts", explores the latest advancements in CPO technology. It analyzes key technical innovations and packaging trends, evaluates major industry players, and provides detailed market forecasts, highlighting how CPO adoption will transform future data center architecture.

The rise of co-packaged optics (CPO)

Co-Packaged Optics (CPO) represents a significant leap in data transmission technology. CPO integrates the optical engine and the switching silicon onto the same substrate. This design eliminates the need for signals to traverse the PCB, further reducing the electrical channel path and significantly improving performance.

Reducing the electrical channel path is crucial because the core of data transfer relies on the copper-based SerDes (Serializer/Deserializer) circuitry, which connects switching ASIC to pluggable transceivers. As data demands grow, SerDes technology has evolved to enable faster transmission, but faster ASICs require better copper connections—either through more channels or higher speeds. However, as link density and bandwidth increase, a significant portion of system power—and thus cost—is consumed by driving signals from the ASIC to optical interconnects at the edge of the rack. The size limitations of ASIC ball grid array (BGA) packages, due to warpage concerns, require higher SerDes speeds to support increased bandwidth. However, this also results in higher power consumption because greater channel loss occurs at higher frequencies.

One of the key solutions to these challenges is to reduce the distance between the ASIC and the optical transceiver. A significant portion of system power is consumed in driving data signals from the ASIC to the optical interconnects at the edge of the rack. By bringing the optical transceivers closer to the ASIC, several advantages can be realized:

Reduced Signal Losses: Shortening the electrical path between the ASIC and the optical interconnect minimizes signal degradation.

Lower Power Consumption: Reducing the distance allows for the use of lower-power SerDes options, leading to overall lower system power consumption.

Enhanced Efficiency and Performance: By cutting down the power required for data transmission, system efficiency and performance are significantly improved.

Scalability: CPO technology supports future scalability for high-bandwidth systems, making it ideal for data centers that need to meet growing data demands.

How CPO will shape interconnect architecture for AI

CPO is set to transform interconnect architecture for AI. Here, IDTechEx uses Nvidia's cutting-edge DGX NVL72 server as an example to explain how IDTechEx predicts the next generation AI architecture. Nvidia, the market leader in AI accelerators, has designed the DGX NVL72 to redefine AI performance standards, supporting up to 27 trillion parameters—far surpassing ChatGPT 4’s 1.5 trillion parameters.

The DGX NVL72 contains 18 compute nodes, each equipped with four Blackwell GPUs and two Grace CPUs, along with nine NVLink switches. Modern AI accelerator architectures, such as this, employ multiple communication networks to manage data flow:

Backside Compute Network: In the DGX NVL72 architecture, each compute node connects to an L1 compute switch via Nvidia's NVLink Spine, a high-speed copper interconnect offering 1.8T bidirectional bandwidth through 18 lanes of 100G, using 36 copper wires per connection. L1 switches are similarly interconnected, resulting in a total of 5184 copper wires across the system. To maintain signal integrity over these distances, retimers are used at the switches, though they introduce latency and bandwidth limitations, especially at higher speeds like 100G per lane. Additionally, copper links like these, while cost-effective, face signal degradation issues such as channel loss and clock jitter over longer distances, which become more pronounced as bandwidth demands increase.

Optical interconnects present a compelling alternative to copper, offering much higher bandwidth density and greater efficiency over long distances—critical for AI workloads involving massive data transfers between GPUs. Looking ahead, it is expected that copper interconnects will be replaced by Co-Packaged Optics (CPO), enabling direct connections between compute nodes and eliminating the need for L1 compute switches in the backside network.

Frontside Network: Each AI compute node currently connects to an L2 switch using pluggable optical transceivers at speeds ranging from 400G to 800G. This optical setup facilitates long-distance data transmission between racks, offering lower signal loss and greater bandwidth density than copper. In the future, CPO is expected to be adopted at the network switch level, though pluggable optics may remain at the compute node level due to their flexibility and compatibility with various system configurations.

Ultimately, CPO will reshape AI interconnect architecture by improving data movement, reducing bottlenecks, and allowing for higher efficiency and scalability in next-generation AI systems. The future will likely see direct optical connections, eliminating compute switches and increasing bandwidth for AI workloads, though the complexity of connections will also rise.

IDTechEx's report on the topic, "Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts", offers an extensive exploration into the latest advancements within co-packaged optics technology. The report delves deep into key technical innovations and packaging trends, comprehensively analyzing the entire value chain. It thoroughly evaluates the activities of major industry players and delivers detailed market forecasts, projecting how the adoption of CPO will reshape the landscape of future data center architecture.

Central to the report is the recognition of advanced semiconductor packaging as the cornerstone of co-packaged optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

To find out more about this report, including downloadable sample pages, please visit www.IDTechEx.com/CPO 

For the full portfolio of semiconductors, computing and AI market research available from IDTechEx, please visit www.IDTechEx.com/Research/AI 

SHENZHEN – Victory PCB, a professional PCB manufacturer, has emerged as the leading specialized manufacturer for multiple species, small to medium series, and quick turn production, with a focus on providing 3Hs (high quality, high precision and high density). With a total plant area of 30,000sq.m, their monthly capability currently stands at 60,000sq.m with 3000 parts.

Serving more than 1000 customer groups, the company is a leading manufacturer of 1-16L layer Rigid PCBs, Flex PCBs, High-Frequency PCBs, HDI PCBs and Metal Base Aluminium PCBs. Adhering to the highest standards in high-speed development, continuous improvement, and persistent concentration in PCB production, the company exports over 80% of its products to Europe, America, and Asia, among others.

Victory PCB is known for its dedication to offering prompt, dependable service without sacrificing quality. The organization enables businesses to proceed with their projects effectively by providing prompt bids, frequently in less than an hour. Whether for prototypes or complete production runs, Victory PCB's quick lead times provide clients an advantage in meeting deadlines.

Clients regularly compliment Victory PCB for its prompt delivery, competitive pricing, and technical know-how. "Fast production lead time always exceeds our expectations, making us competitive and confident in front of our customers," says a pleased client. For companies trying to stay ahead of the competition in their particular areas, Victory PCB is a go-to supplier because of its high-quality goods, affordability, and dependable service.

Victory PCB provides tailored solutions that address the unique requirements of high-performance applications for a broad range of industries. Victory PCB's experience guarantees excellent outcomes for each use case, whether it is supplying edge-plated PCBs for industrial control applications or gold finger PCBs for precision electronics in the automobile industry.

The business is renowned for its state-of-the-art medical device PCBs, which are made to adhere to the stringent specifications of the medical electronics industry. Victory PCB's Roger PCBs are utilized in wireless networks, broadband, and transmission systems in the communications sector, demonstrating its adaptability in providing industry-specific solutions.

Learn more at https://www.victorypcb.com/, call +8613662250684 or email This email address is being protected from spambots. You need JavaScript enabled to view it.

SANTA ANA, CA – TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies and printed circuit boards (“PCB”s), today announced it has received Cisco’s 2024 Supply Chain Security Champion award. Cisco presented this esteemed honor at its annual Supplier Appreciation Event (“SAE”) to a live audience of several hundred executives representing its diverse component suppliers and partners in manufacturing, logistics, services, and repair operations.

The recognition honors TTM Technologies for demonstrating a shared commitment to Cisco’s success by proactively securing Cisco IP and protecting the Cisco brand by embedding security into its operations and creating a secure Supply Chain.

“Cisco connects and protects its customers in the era of AI by building modern and resilient infrastructure, providing cybersecurity solutions that protect against the threats of today and tomorrow, and helping them harness the power of AI and data,” said Marco De Martin, SVP of Global Supplier Management at Cisco. “Cisco suppliers and partners are crucial in providing the innovative technology that our customers rely on.”

Doug Soder, EVP of TTM’s Commercial Sector added, “TTM is honored to be recognized as Cisco’s 2024 Supply Chain Security Champion. TTM is highly committed to security excellence for our customers, protecting their IP and brands through systematic and robust operational and cybersecurity programs. We sincerely appreciate Cisco recognizing the strength of our customer security program. This important Cisco award is a tribute to the outstanding efforts of TTM’s IT and Operations teams.”

At the SAE, Cisco honored the achievements and contributions of its supply chain partners, recognizing those that performed exceptionally well in FY24. This event marked the 33rd consecutive year of such celebrations and served as a platform to share Cisco’s strategic priorities with its trusted global network of suppliers.

WALDENBURG, GERMANY – Würth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024. The manufacturer of electronic and electromechanical components for the electronics industry will showcase a host of innovations, primarily as a solutions provider in Hall A6 at Booth 502.

“Those who know us are aware that we’re so much more than just a component manufacturer,” stresses Alexander Gerfer, CTO at Würth Elektronik eiSos. “What drives our company's success is our high-quality, durable products, of course. But, of equal importance to us are services, such as knowledge transfer and targeted development support, for example through pre-compliance measurement. Creating Together, that’s our mission, especially at this important industry event.”

The global player’s strong service orientation is clearly apparent in many aspects of its trade show presence. Trade visitors can experience live demonstrations of the REDEXPERT digital design platform and the new MyWE customer platform at the 400 m2 booth. Developers looking to use components for their own projects can order free lab samples at the trade show booth and test them the next day in their development lab. Collaboration with IC manufacturers, which is crucial for developing reference designs, is also featured at the trade show. Partners live at the booth will be Analog Devices, Infineon, Microchip, Onsemi, STMicroelectronics and Texas Instruments.

Würth Elektronik also contributes valuable knowledge sharing with its practice-oriented reference guides. Alongside the brand-new “ABC of Shielding”, an expanded and revised version of the “Trilogy of Connectors” will also be presented at electronica. Those interested in power supply design will find valuable insights and tips for practical implementation in the newly published “DC/DC Converter Handbook”.

More components from a single source, straight from stock

“’More than you expect’ is also there to be found in our comprehensive product range, of course, whether from stock as standard, or as custom components,” Gerfer affirms. “Würth Elektronik offers everything from a single source: products from the fields of passive components, electromechanics, optoelectronics, power modules, digital isolators, thermal management, as well as wireless connectivity & sensors and components for the automotive sector. We offer more of everything: more partnership, more solutions, more service and more possibilities.”

A wealth of product highlights will be exhibited at the Würth Elektronik booth:

• Single Pair Ethernet Power over Data Line: reference design and demo board
• WE-MXGI SMT power inductors: Further designs for this new series of inductors will be unveiled at the trade show. They are made of an innovative metal alloy with extremely low RDC and AC losses. The compact, magnetically shielded design is optimized for high switching frequencies in excess of 1 MHz and is ideally suited as a DC/DC converter for high-current supplies and field programmable gate arrays.
• Transformers for battery management systems as well as AC and DC charging stations: ideally suited for applications such as wallboxes and energy storage systems
• High-current and high-temperature inductors: with an operating temperature of up to 150°C and without thermal aging effects, for example for DC converters in power supplies
• MagI³C-VDMM type power modules: with a wide input voltage range of 3.5-60 V for 48-V industrial bus applications
• WE-TORPFC PFC chokes: for charging stations or solar power system inverters
• WL-OSEN: a new optical sensor with a typical detection distance of 1 mm for optical switches or touch applications
• Radio modules & sensors: FeatherWing development boards
• Another focus is on crystals and oscillators, such as the ICPT-1 rubidium oscillator, as IQD Frequency Products is once again a co-exhibitor this year.
• High-current contacts for automotive applications and REDCUBE for direct current motors
• New COAX connectors
• Custom solutions: for connectors, inductors, transformers, crystals and oscillators, ferrites and inductors, thermal management, capacitors, or automotive-qualified components.

Good to know: components from Würth Elektronik are usually available straight from stock, even in larger quantities.

Networking and Young Talents Day

New at electronica 2024: The Würth Elektronik show truck will be located in the atrium between Halls A6 and B6. It acts as an additional meeting point for interaction. There will also be opportunities for expert discussions and networking at the ‘Get Together’ at the booth each evening from Tuesday to Thursday from 6:00 pm to 8:00 pm. The trade show program is complemented by a competition and a free luggage service. Young Talents Day on Friday is particularly interesting for students and and people just starting their careers.