NORTHFIELD, MN – All Flex’s Rigid Flex Center of Excellence has recently expanded expedited services for their rigid flex customers.

Recent capital improvements in All Flex Solutions’ rigid flex manufacturing facility are helping to accelerate production lead times on rigid flex designs. All Flex Solutions recently installed and qualified an innerlayer factory allowing them to issue materials to the floor and complete innerlayers in hours instead of days. The reduced cycle time gets product into lamination faster to complete the remainder of the manufacturing cycle.

Matt Tannehill, President of the Rigid Flex Center of Excellence commented “we’ve always been capable of building very high quality, very high reliability rigid flex circuit boards. A couple of months ago we defined a set of criteria, that would allow us to support faster turn cycles for our partners. We know that if we help our customers prototype and de-bug their parts at the beginning, we’ll likely have a partner when it comes to production volumes. This service will help us serve our customers better and collaborate with them on their initial designs.”

The quick turn service is based on capacity loading and material availability but offers designers of rigid flex printed circuits expedited services – typically two to four weeks after approval of artwork.

To learn more about All Flex Solutions rigid flex manufacturing, please contact Chris Eisenberg at (507) 664-7332 or This email address is being protected from spambots. You need JavaScript enabled to view it.. Visit All Flex Solutions online at AllFlexInc.com.

WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced a series of updates covering its repurchase plan, repeat customer success, and an R&D milestone.

Share buy-back

Nano Dimension’s previously disclosed share repurchase plan (the “Repurchase Plan”) recently commenced, allowing the Company to buy back up to $200 million worth of its American Depositary Shares (“ADSs”) until October 2024.

The Repurchase Plan authorizes the repurchase of ADSs, from time to time, in open market transactions, in privately negotiated transactions or in any other legally permissible way, depending on market conditions, share price, trading volume and other factors. Such repurchases will be made in accordance with applicable U.S. securities laws and regulations, including Rule 10b-18 under the U.S. Securities Exchange Act of 1934, as amended, and applicable Israeli law. The Company may repurchase all or a portion of the authorized repurchase amount. The Repurchase Plan does not obligate the Company to repurchase any specific number of the ADSs and may be suspended or terminated at any time.

Second machine sale – indicating a movement to higher manufacturing volumes

Nano Dimension announced the sale of a second advanced AME system, the DragonFly IV®, to a leading Western Defense agency, an existing customer, which has requested to remain anonymous.

With this purchase, Nano Dimension has partnered with and sold the DragonFly IV® to more than ten national defense organizations. Like other defense organizations, which include armies, navies, air forces, and government intelligence agencies, this most recent customer chose Nano Dimension based on the strategic advantages in leveraging AME and specifically the Company’s advanced industrial-level system, the DragonFly IV®. The benefits include intellectual property security, design freedom, and fast-tracked innovation.

R&D Milestone

Nano Dimension filed a patent application relating to INSU™ 200, a proprietary material, titled “Dielectric Ink Compositions and Uses Thereof” under the Paris Convention Treaty.

This material, or consumable as it is otherwise known, is part of the Company’s AME product suite, and is the first jettable ink capable of undergoing the commercial reflow process. It is critical for end-users’ applications, having improved thermal and mechanical properties, specifically the ability to undergo higher temperature and stress. Such advanced properties are necessary for printed applications to meet more demanding specifications in both commercial and defense fields. Nano Dimension designed this material with industry standards as a priority; thus, the improved properties meet reliability tests defined by IPC – the global trade associate for the electronics industry. It will be available to customers in April 2024.

Yoav Stern, Nano Dimension’s Chief Executive Officer and a Member of the Board of Directors, added: “For three years, I have been stating repeatedly that the news of advancement in material and processes will be the most important indications of breakthroughs in additive manufacturing, comparable to a BioTech company’s clinical testing success, but without the need for government agencies’ approval to validate them. This is one of a few expected achievements being announced today, and we hope for more to come, after years of ongoing R&D investments in AM and AME.

With these few announcements, we are pleased to share so many positive updates with our shareholders, all aiming to create shareholder value. The Repurchase Plan is a reflection of our constant assessment of the best uses of our capital. The follow-up second sale to such a quality customer demonstrates our continued success with the most demanding high mix designs manufacturing. The R&D material milestone speaks for itself. All in all – these are indications of the quality and commitment of Nano Dimension’s team members across the western continents, and an indication of expectations for more to come.”

HEIDEN, SWITZERLAND – Varioprint, a global player in high-end PCB manufacturing offering decades long RF expertise is thrilled to announce a strategic partnership with Fortify, an innovative additive manufacturing company enabling the design and production of advanced RF devices, based in Boston, US. This partnership marks a significant milestone as Varioprint and Fortify join forces to introduce this transformative RF design and manufacturing technology to the European market.

At Varioprint, we are more than excited to join forces with Fortify to introduce new RF materials and applications to our European customers. Our shared dedication to innovation and manufacturing excellence positions us as leaders in delivering cutting-edge solutions. This partnership reflects our commitment to providing our clients with the latest advancements in technology and reinforces our position as a trusted partner in the electronics manufacturing industry.

“As one of the world’s premier RF & electronics manufacturers, Varioprint is an ideal partner for us. I’m looking forward to leveraging our complementary leadership across both commercial and operational execution. Together, we are poised to redefine the possibilities in RF device manufacturing, particularly in the dynamic landscape of high-frequency communications and radar across commercial and defense” says Josh Martin, Chief Executive Officer and Co-Founder at Fortify.

Karlo Delos Reyes, Co-Founder and Chief Customer Officer added “This partnership underscores our dedication to spearheading advancements tailored for the exponential growth of 5G applications and the imperative needs of defense communications. Together, we are not just shaping the future of technology; we are amplifying the possibilities, paving the way for a new era of connectivity and innovation in the dynamic 5G ecosystem, as well as fortifying the foundation of secure and resilient defense communications”.

The benefits of this new partnership include

1. Introduction of RADIX to the European Market: The collaboration between Fortify and Varioprint aims to bring the transformative new materials and applications to Varioprint’s European customers innovating in commercial and defense communications, offering businesses and industries access to state-of-the-art RF devices with unmatched performance.

2. mmWave Applications and Beyond: This partnership addresses the growing demand for advanced RF components that play a crucial role in the deployment of 5G networks across various sectors.

3. Innovation and Manufacturing Excellence: Varioprint's longstanding commitment to innovation and manufacturing excellence, especially in advanced electronics, complements Fortify's forward-thinking approach. The combined strengths of both companies promise groundbreaking solutions for the European market.

Fortify is a full-stack materials science and additive manufacturing company based in Boston, MA. Its innovative Digital Composite Manufacturing (DCM) platform enables the production of complex structures with unique mechanical, electrical, thermal, and electromagnetic properties, revolutionizing the way advanced materials are developed and manufactured. For more information, visit www.3dfortify.com 

SUZHOU, CHINA – Ventec International Group Co., Ltd. (6672 TT), is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark. Both VT-441C and VT-447C FR15.1 materials have thus been recognized for achieving 150oC Maximum Operating Temperature (MOT) for electric and mechanical RTI (Relative Temperature Index).

UL's investigation of Ventec's mid-Tg VT-441C and high-tg VT-447C halogen-free substrates has been completed and full compliance with the applicable requirements including 150oC MOT (Maximum Operating Temperature) for electric and mechanical RTI (Relative Temperature Index) has been determined.

Offering exceptional UL RTI performance, both high-CTI substrate materials ensure reliability in the presence of high applied voltages in harsh and humid environments. With high voltage CAF resistance, Grade 0 (>600V) Comparative Tracking Index (CTI) and glass transition temperatures (Tg) of 155oC and 175oC, the versatile halogen-free materials are the perfect high-reliability PCB choice for use in extreme high-temperature/humidity applications. These include DC/DC power modules, IGBT applications, motor controllers, high lumen output LED devices, battery charging, OBC chargers for EV vehicles and several other automotive “underhood” applications.

The prepregs are available in roll or cut-to-size panel format, with laminates supplied in sheets or cut-to-size panels with core thicknesses of 0.004” (0.10mm) to 0.200” (5mm). They are also offered in a wide range of copper foil thicknesses including heavy coppers. This versatility is ideal for both single layer and multiple layer PCB designs.

Mark Goodwin, COO EMEA & Americas, commented: "Achieving UL authorization for our industry-leading 150oC MOT performance is fantastic news. As a complement to our full halogen-free and thermal management solution series, our customers have access to epoxy materials that meet virtually any high reliability performance requirements for the world’s most demanding applications."

Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com