WASHINGTON – Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association’s new executive director. USPAE is an IPC subsidiary that focuses on partnership with the U.S. Government to support a more robust defense electronics industrial base. Over its short history, USPAE has steered more than $30 million to industry for high priority projects.

As executive director of USPAE, Will is responsible for growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the Defense Business Accelerator (DBX), which aims to revolutionize how the Department of Defense (DOD) drives dual-use technology development by harnessing the size and speed of the commercial market to accelerate the growth of a resilient dual-use electronics ecosystem.

An engineer by training, Will comes to USPAE with a strong technical and operational background in the electronics industry and is active in industry organizations, including the National Defense Industrial Association (NDIA) and International Microelectronics Assembly and Packaging Society (iMAPS). His background includes leading and supporting enterprise A&D programs, from foundry to packaged and qualified high-reliability components. As a contractor to the Department of Energy National Nuclear Security Administration, he supported trusted foundry, semiconductor products and components, and assurance interests. Will, most recently, led aerospace and defense business development for SkyWater Technology Foundry. His additional commercial experience includes roles at Motorola and Infineon, from engineer to engineering management, including involvement in a 300mm fab startup.

“I am excited to build USPAE’s role as a trusted third party that connects industry and U.S. Government stakeholders to promote an assured electronics supply chain,” said Will. “Strengthening public-private sector collaboration is critical to both U.S. national security and economic growth. I am honored to leverage my experience developing solutions for the aerospace and defense industries to further USPAE’s mission of building a robust domestic ecosystem for electronics manufacturing.”

“With Jim’s extensive background in driving innovation and adopting solutions throughout the electronics supply chain, he is uniquely qualified in growing and positioning USPAE to help ensure the U.S. Government has access to trusted, secure, and resilient electronics,” said John Mitchell, USPAE Chairman of the Board. “Jim is well-respected in the defense manufacturing community, and we’re thrilled to have him at the helm of USPAE.”

For more information on USPAE, visit www.USPAE.org or send inquiries to This email address is being protected from spambots. You need JavaScript enabled to view it. 

PENANG – Sunshine Global Circuits (SGC) is renowned as a premier manufacturer of high-quality and cutting-edge PCBs. Specializing in a diverse range of requirements from high mix to low to high volumes and quick-turn prototypes, SGC boasts an impressive array of technical capabilities. These include expertise in 2L-50L, HDI, low Dk/Df materials, heavy copper, rigid-flex/flex, RF microwave, ATE PCBs, substrates, and thermal management solutions.

With manufacturing facilities spanning across two campuses in China, a factory in Malaysia, and another in Germany, SGC ensures global reach without compromising on quality. In the United States, their proficient team delivers localized sales and technical support, offering services such as stack-ups and same-day quoting.

As Sunshine Global Circuits (SGC) continues to uphold its high standards and global presence across multiple manufacturing facilities, Malaysia Sunshine PCB (Penang) Sdn. Bhd, formerly Vision Industries Sdn. Bhd., is thrilled to announce a series of transformative initiatives aimed at fortifying its position as a global leader in printed circuit board (PCB) manufacturing.

Since the acquisition of Vision Industries in July 2023, Sunshine PCB (Penang) has embarked on a journey of revitalization and growth. One of the most significant changes includes the renaming of the company, aligning its brand identity with its strategic vision for the future.

Over the past year, Sunshine PCB (Penang) has undergone a comprehensive overhaul, with extensive upgrades and enhancements to its manufacturing facility. These improvements have resulted in a modernized production hub that integrates efficiency, intelligence, and sustainability at its core. By optimizing resources and upgrading equipment, the company has achieved not only operational excellence but also a significant reduction in environmental impact.

One of the notable outcomes of this transformation is the enhancement of production capabilities, enabling Sunshine PCB (Penang) to offer improved turnaround times for its customers. With standard and quick turn options now available for 2L and M/L PCBs, the company is better equipped to meet the dynamic demands of the global market while maintaining the highest standards of quality and reliability.

Furthermore, Sunshine PCB (Penang) has solidified its position as a leader in the production of high-tech RF Microwave PCBs. Recent investments in advanced equipment, such as the DIS CCD Multilayer Layup System, have revolutionized production processes, resulting in increased efficiency and accuracy. The incorporation of innovative technologies, including Direct Optical Registration™, further enhances the company's ability to deliver precision-engineered PCB solutions tailored to meet the evolving needs of modern electronics applications.

In a strategic move to support its long-term growth objectives, Sunshine PCB (Penang) has successfully acquired land rights at Penang Technology Park. This acquisition, comprising eight plots spanning approximately 19.5 acres, lays the foundation for the construction of a state-of- the-art PCB production facility. The expansion into Southeast Asia underscores Sunshine's commitment to innovation and its vision of becoming a key player in the region's burgeoning electronics industry.

Sunshine PCB (Penang) are excited to announce these significant milestones in our company's journey, with the upgraded facilities and expanded production capabilities, Sunshine are well- positioned to meet the evolving needs of our customers while driving innovation and growth in the industry.

The acquisition of land at Penang Technology Park represents a strategic investment in the company's future, enabling Sunshine PCB (Penang) to further consolidate its position as a leading provider of advanced PCB solutions on a global scale.

In summary, Sunshine PCB (Penang) Sdn. Bhd's recent initiatives underscore its commitment to innovation and growth. With enhanced capabilities and a strategic expansion plan, the company is well-positioned to lead the global PCB manufacturing industry while delivering exceptional value to its customers worldwide.

FREUDENSTADT, GERMANY – Today, SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.

The Industry Challenge:

The need for more powerful and efficient chips to unlock the future of Artificial Intelligence and next- generation devices is massive. With innovation cycles outpacing Moore’s law and chip architecture needing to go 3D with more complex features – SCHMID’s Advanced IC Packaging solution helps to unlock what is possible for the Electronics industry.

Advanced IC Packaging has become a massive challenge for Semiconductor companies to overcome. Complexities from integrated chip designs are developing in a way that semiconductor chips are only optimized for their special task, paired with unique manufacturing needs and production technology. The chiplet then takes over the position and role to connect these single, optimized chips, based on the best available powerline and “highway” for signals. The challenge for these expanded requirements is manifold. First, large substrate sizes with increased chiplet sizes at the same time. Also, the need for smaller feature sizes, higher signal integrity, better thermal management and combined with the introduction of new materials.

Current Market Trend:

One current market trend is the introduction of glass cores in advanced packaging, which will take major market share from the traditional organic core as well as the traditional silicon-based applications. The idea of moving to glass core has started a new diversification in the supply chain enhancing the resilience and flexibility of the semiconductor industry.

The main beneficiaries today are the fast-growing AI and data center sectors but soon after, we also see glass cores expanding into any high-speed computing application, for example automotive applications.

SCHMID Solution:

Based on decades of experience in glass processing and substrate manufacturing, sourcing from our 3000 sqm unique world-class laboratory located at our headquarters in Freudenstadt, Germany – SCHMID has developed the capability to produce and metallize glass cores, as well as the redistribution layers on both sides. The SCHMID R&D center has the capability to add this full build up “fan out” layer on top based on the standard Semi Additive process (SAP), or with the most advance, SCHMID invented, ET (Embedded Traces) process. This gives customers and partners of SCHMID the unique opportunity to develop and sample full format packages substrates up to 24*24” with glass core thickness ranging from 200μm to 1.1mm comprising high aspect ratio through holes.

All the machines used are based on high volume manufacturing platforms and can be quickly expand to mass volume production. The installed pilot line is also offered to key customers to expand their R&D capability and interlink it with SCHMID`s own R&D activities to increase speed further.

SCHMID Expertise in Glass:

SCHMID has provided glass processing solutions to the PV, anti-glare and display industry for many years. Glass cleaning and etching of ultra-thin glasses including FOUP based automation is within the SCHMID standard machine portfolio. High aspect ratio through glass via formation requires a wide knowledge base for using the right laser and etching parameters for the different types of glasses as well as a profound electro plating experience for a void free through hole copper filling and planarization. All of this has been developed by SCHMID over the last years and will be provided along with the lab solution.

SCHMID Embedded Trace (ET):

Glass cores have the advantage of offering the required planarity and thermal stability to enable the required size reduction and layer-to-layer registration accuracy. However, this accuracy needs to be matched be the layer build up technology, too. The SCHMID ET process is the next generation of sequential build up production technology, offering not only a planar surface for each layer, but also the access to a new via formation, that does not use laser drilling, which in-return provides miniaturization of materials with much higher resilience and tolerance, as well as signal integrity capabilities.

The new SCHMID glass core substrate lab also includes the machine platforms that guide the SCHMID process to realize the next generation of ABF (Ajinomoto Build Up Films) based fan out.

“Depending on the final IC package, the material selection and process a customer could need may differ. Speed and process flexibility are now the main crucial elements to success.” explains Christian Schmid, CEO of the SCHMID Group, further adding, “Our SCHMID lab & pilot solution offers both and enables our customers to scale for high volume production quickly.”

Together with partners, SCHMID is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an advanced IC package.

WASHINGTON – The Printed Circuit Board Association of America today announced the end of Travis Kelly’s term as chairman, a position he has held since the association’s founding in 2021. He will be succeeded by Shane Whiteside, President and CEO of Summit Interconnect.

Kelly said, “It has been my honor to work with so many talented people bringing attention to the critical role printed circuit boards play in all aspects of daily life. The association is in good hands with Shane. He’s an industry veteran who will continue to grow our membership and increase our impact.”

Kelly, who also serves as CEO of Isola Group, is one of the five founding member companies. He oversaw significant growth and accomplishments that have propelled the industry into prominence on Capitol Hill and in the policy community in Washington.

Under his leadership the association has grown from five to sixty members representing printed circuit board (PCB) and substrate manufacturers, assemblers, and materials suppliers.

Working with industry and other association partners, he led efforts to:

• Create the Protecting Circuit Boards and Substrates Act (H.R. 3249) pending in Congress
• Successfully advocate for directive language in the National Defense Authorization Act
• Secure a Presidential Determination authorizing the use of Defense Production Act to support the nation’s domestic Printed Circuit Boards and Advanced Packaging industrial base.
• Secure robust funding for the Defense Production Act in the FY24 defense bill

New PCBAA Chairman Shane Whiteside is a Navy veteran, has over 30 years of experience in the microelectronics industry, and was a founding board member of the U.S. Partnership for Assured Electronics.

Whiteside said, “I look forward to the opportunities that lie ahead and am confident we will grow our roster of member companies and increase our visibility and impact in Washington. PCBAA will continue to fight for legislation and policies that support domestic production of PCBs and substrates.”