New Products

RO4835T laminates are offered in 2.5 mil, 3 mil and 4 mil core thicknesses, are 3.3 Dk, low loss, spread-glass reinforced, ceramic-filled thermoset materials.

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Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts library option. 

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Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.

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XYR-03-01 alignment stage is a high-resolution, high-repeatability x-y-theta stage for wafer alignment, semiconductor handling, laser cutting and drilling.

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HDTF substrates can incorporate conductor multilayers.

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Etchable gold thick film process for high-definition thick film circuitry is an alternative to thin films.

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