RO4835T laminates are offered in 2.5 mil, 3 mil and 4 mil core thicknesses, are 3.3 Dk, low loss, spread-glass reinforced, ceramic-filled thermoset materials.

Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts library option. 

Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.

XYR-03-01 alignment stage is a high-resolution, high-repeatability x-y-theta stage for wafer alignment, semiconductor handling, laser cutting and drilling.