Ultrafast laser cutting machine portfolio supports high-precision glass processing for consumer electronics, automotive displays, optical components and wearable device manufacturing. Systems use picosecond and femtosecond laser processing for low-heat glass separation with reduced chipping, microcrack suppression and improved edge strength retention. Supports processing of ultra-thin glass, sapphire, PET, polyimide and flexible printed circuit substrates through modification-and-splitting workflows. Includes integrated motion and vision systems for shaped cuts, contour profiles and complex geometries used in foldable devices, AR/VR systems and automotive display applications.

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