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Huawei Releases 122.88TB Enterprise SSD with Die-on-Board Packaging

Published: 26 May 2026

122.88TB enterprise SSD uses proprietary Die-on-Board packaging technology to increase storage density by approximately 33% through direct NAND die mounting on the PCB. Available in 61.44TB and 122.88TB capacities for AI inference, data center and scale-out storage applications. Integrated into Huawei’s OceanStor Pacific 9926 storage platform supporting up to 11PB effective capacity with compression. Designed to maximize storage density using domestic 232-layer NAND technology for high-capacity enterprise computing environments.

Huawei

huawei.com

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