New Products

AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

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FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.

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RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).

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SiP-id software is said to reduce design iterations and improve throughput, reducing time needed to design and verify ultra-complex SiP packages.

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OrCAD Capture Cloud, a free, web-based subset of the OrCAD Capture schematic design, is now integrated with Ultra Librarian, providing a cloud-based design tool that is fully scalable to a professional, production-ready printed circuit board design solution.

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OrCAD Entrepreneur software tool suite for OrCAD Capture Cloud is said to cut in half the time it takes to move from design to prototype, when compared to the traditional process of manually designing and simulating across separate systems.

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