Asahi Kasei Sunfort TA series dry-film photoresist enables high-resolution circuit patterning using conventional stepper exposure and laser direct imaging (LDI) systems. Offers ultra-fine patterning capabilities, permitting 1.0 µm resist width and 4 µm pitch design through LDI exposure.

Supports semiadditive processing (SAP) to create 3 µm wide conductive traces, overcoming historical limitations of dry-film photoresists in redistribution layer (RDL) formation. Is for large-areas, high-density multilayer interposers required in high-performance chip packages.

Asahi Kasei

https://www.asahi-kasei.co.jp/sunfort/en/products/ta.html

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