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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • 2017 Magazine Archives
1712cover

December 2017

  • 25 Years of the Designers Council
  • Design for Excellence: Inductor Form, Fit, Function Equivalence and New Design Rules
  • At Productronica, the Machines Did the Talking
  • Advantages of Organic Polymers vs. ITO in Capacitive Touch Keys
  • In Memoriam
  • Lots of talk about machine communication.
  • Annoyed by the acronyms.
  • Building a better BoM.
  • Tricks of the over-mold.
  • Are you capable?
  • View the Digital Edition
1710cover

November 2017

  • Reducing PCB Costs through Panel Optimization
  • Voice prompts.
  • Putting an end to the endless inspections.
  • Prepping for signal integrity.
  • View the Digital Edition
1710cover

October 2017

  • Adding Automated EMC Analysis to PCB Layout
  • Black Pad Revisited
  • Big problems.
  • What the P in IP really stands for.
  • When routing strategies increase crosstalk.
  • Control mechanisms.
  • View the Digital Edition
1709cover

September 2017

  • Guidelines for Improving PCB Design Manufacturability
  • Elements of Additive Manufacturing for Functional Printed Electronics
  • Automotive Driving Fabricator Gains
  • Altium Expands Its Reach
  • Soldering out of thin air.
  • North America: Better than you think.
  • The Limits of Certification.
  • Swiping right on a fabricator.
  • On the center.
  • View the Digital Edition
1708cover

August 2017

  • Among Designers, Compensation, Job Satisfaction on the Rise
  • What making PCBs looks like at 14.
  • Making a point about the “single point of failure.”
  • Big “fans” at ECTC.
  • Flexible products, flexible lead times?
  • View the Digital Edition
1706cover

July 2017

  • Methodology for Calculating Electrical Parameters of PCB Transmission Lines for High-Performance Computing Devices
  • Improving PCB Design Methods to Complement 3D Printer Technology
  • Jim Raby, RIP.
  • Supply chain separation.
  • All pinned up.
  • View the Digital Edition
1706cover

June 2017

  • Optimizing Component Selection by Connecting the Designer to the Supply Chain
  • PCB Designers Hold Smart Factories Ransom
  • Savings and Efficiencies with Printed Silver Flexible Circuits
  • The PCB tool continuum.
  • Measuring customer service.
  • Best friend, best customer.
  • Cutting the bottlenecks.
  • When HAL is not well.
  • Flex impedance.
  • View the Digital Edition
1703cover

May 2017

  • Managing Rule Checks
  • Algorithm for Constructing the Transient Process in a Meander Delay Line in PCBs
  • Automotive and Automation
  • Acquiring minds.
  • Doom and boom.
  • Procurement solutions.
  • Fiducial responsibility.
  • View the Digital Edition
1704cover

April 2017

  • Is Fan-out Wafer-level Packaging Right for Your Product?
  • Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates
  • Careful what you wish for.
  • Keep up with the data.
  • Coping with the (potential) border tax.
  • Using buildup layers and premium FPGAs to deal with SI challenges.
  • When to use ZIF connectors.
  • Halides present post-reflow can cause severe corrosion.
  • View the Digital Edition
1703cover

March 2017

  • Voltage Drops across Traces and Vias
  • Reinvigorated in San Diego
  • America, don’t hold your breath for Foxconn.
  • When to buy.
  • The relentless forecaster.
  • Robotics, wearables and the Smart Factory were hits at InterNepcon.
  • Power component footprints.
  • View the Digital Edition
1702cover

February 2017

  • Understanding PCB Design Variables that Contribute to Warpage during Module-Carrier Attachment
  • Cost and Risk Reductions Using the IPC Traceability Standard
  • Why the industry is looking up.
  • Driven to distraction.
  • The year of breaking paradigms.
  • Preparing the EMS industry for “radical flexibility.”
  • Simulation measurement.
  • Avoiding the pad sizing squeeze.
  • View the Digital Edition
1701cover

January 2017

  • Thermal Effects around Right-Angle Trace Corners
  • Creating Robust, Durable Overlap ZIF Connections in 4 Steps
  • Overcertification is standard fare.
  • Shades of 1933?
  • Going abroad.
  • Put on your best coat.
  • Tweaking the prints.
  • View the Digital Edition

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May cover

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Press Releases

  • Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
  • AGS Devices Licenses and Co-Brands CELUS Design Platform to Enable Faster Product Development and Sourcing
  • Duro Launches Technology Partner Program to Deliver Complete Digital Thread for Hardware Engineering
  • TTM Technologies, Inc. Announces Retirement of Founder and Board Member, Kent Alder
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