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  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

  • Cloud Collaboration

    Cloud Collaboration

    Real-time breakdowns cost more than you think.  READ MORE...

  • The Experts' Take on AI

    The Experts' Take on AI

    What’s working now and what’s not (but should be).
      READ MORE...

  • Designing for High-Pin Count Devices

    Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”  READ MORE...

  • Bluetooth Design

    Bluetooth Design

    6 steps for limiting interference and data loss.  READ MORE...

Homepage Slideshow

  • Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18794-optimizing-mixed-signal-circuit-designs

  • Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18798-developing-organizational-culture-for-troubleshooting

  • Cloud Collaboration

    Real-time breakdowns cost more than you think.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18796-cloud-collaboration-avoiding-pcb-design-chaos

  • The Experts' Take on AI

    What’s working now and what’s not (but should be).


    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18760-ai-in-electronics-manufacturing-what-s-working-now-what-s-not-but-should-be

  • Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18755-designing-for-high-pin-count-devices

  • Bluetooth Design

    6 steps for limiting interference and data loss.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18758-bluetooth-circuit-board-design-guidelines

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  • 2016 Magazine Archives
1612cover

December 2016

  • Price vs. Function
  • IPC-1782: The New Dawn of Electronics Traceability
  • 5 Common Mistakes in Board Design
  • In Memoriam
  • What the Mentor deal could portend for EDA.
  • A verified waste of time.
  • Changing of the generational guard.
  • Cutting the cost.
  • The limits of via-in-pad.
  • View the Digital Edition
1611cover

November 2016

  • How AC Currents Affect PCB Trace Temperatures, Part 2
  • Nano Anchoring Copper Foil for Next-Generation Printed Wiring Boards
  • How Can the IoT Be a Solid Rock to Build Products and Profits On?
  • Plugging the leaks.
  • Cybersecurity is all fogged up.
  • Making sense of the Philippines.
  • Where the supply chain begins.
  • For reference – or not?
  • Getting to the bottom of void problems on QFNs.
  • View the Digital Edition
1609cover

October 2016

  • Analyzing the DDR Simulation Results
  • Choosing Copper Foils for High-Frequency PCBs
  • Driven to excess?
  • Business planning.
  • Integrated training.
  • LED conspiracy.
  • When a little more class might be wrong.
  • View the Digital Edition
1609cover

September 2016

  • How AC Currents Affect PCB Trace Temperatures
  • Ensuring Reliable Products with New Rigid-Flex Design Rules
  • Breaking the (m)old.
  • Trying harder.
  • Dealing with protectionism.
  • Panel tabs.
  • Particle size vs. nanocoatings.
  • View the Digital Edition
1608cover

August 2016

  • TRACE MODELING
  • RIGID-FLEX DESIGN
  • IPC Material Declarations: Sufficient for Automotive Electronics?
  • Seller beware.
  • Printing money.
  • Researching your investments.
  • A broker is not a builder.
  • Big fans of fan-out.
  • Designing in “robustness.”
  • All wrapped up.
  • View the Digital Edition
1607cover

July 2016

  • CONDUCTOR TEMPERATURES
  • HIGH-SPEED DESIGN
  • SURFACE FINISHES
  • CONSORTIA
  • Ungoverned.
  • Working with the next generation.
  • The offshoring balance.
  • Don’t forget the fiducials.
  • View the Digital Edition
1606cover

June 2016

  • FLEX CIRCUIT DESIGN
  • HIGH-SPEED DESIGN
  • ZIW RECAP
  • BASE MATERIALS
  • In print.
  • Viasystems redux? Not exactly.
  • The permeation of ERP and shop-floor control.
  • Flex: All stacked up.
  • Weaknesses of the flex standard.
  • View the Digital Edition
1605cover

May 2016

  • STRIPLINE MODELING
  • EMS TOP 50
  • Designed for speed.
  • The local supply chain: endangered species.
  • What should boards cost?
  • Keeping tabs.
  • Understanding the “dot” matrix.
  • View the Digital Edition
1604cover

April 2016

  • PCB INSPECTION
  • APEX EXPO RECAP
  • FACTORY MANAGEMENT
  • From spec to standard.
  • Game-changer or game-breaker?
  • Getting aligned.
  • Your first time.
  • Taped shut.
  • View the Digital Edition
1603cover

March 2016

  • PI-DC ANALYSIS
  • BTC DESIGN
  • Putting the pieces together.
  • Before and after.
  • What’s driving Japan.
  • Too many constraints.
  • Assembly adjustments.
  • What tests can’t tell you.
  • View the Digital Edition
1602cover

February 2016

  • THERMAL MODELING
  • The cost of "free."
  • Older, but better?
  • Seven negotiation tips.
  • Don’t count China out yet.
  • How are you communicating data to your EMS partner?
  • It’s geometry, my dear.
  • View the Digital Edition
1601cover

January 2016

  • SIGNAL INTEGRITY
  • THERMAL OVERLOAD
  • SMT ASSEMBLY
  • SHOW RECAP
  • Putting the pieces together.
  • East beats West.
  • How small beats big.
  • All marked up.
  • Leading off.
  • Pin penetration.
  • View the Digital Edition

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July cover

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Press Releases

  • High Density Packaging User Group Announces Lincstech Co., Ltd. Membership
  • Taiyo Holdings Announces Leadership Change
  • Innovative Circuits Inc Adds COBRA Laser System
  • SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
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