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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • 2016 Magazine Archives
1612cover

December 2016

  • Price vs. Function
  • IPC-1782: The New Dawn of Electronics Traceability
  • 5 Common Mistakes in Board Design
  • In Memoriam
  • What the Mentor deal could portend for EDA.
  • A verified waste of time.
  • Changing of the generational guard.
  • Cutting the cost.
  • The limits of via-in-pad.
  • View the Digital Edition
1611cover

November 2016

  • How AC Currents Affect PCB Trace Temperatures, Part 2
  • Nano Anchoring Copper Foil for Next-Generation Printed Wiring Boards
  • How Can the IoT Be a Solid Rock to Build Products and Profits On?
  • Plugging the leaks.
  • Cybersecurity is all fogged up.
  • Making sense of the Philippines.
  • Where the supply chain begins.
  • For reference – or not?
  • Getting to the bottom of void problems on QFNs.
  • View the Digital Edition
1609cover

October 2016

  • Analyzing the DDR Simulation Results
  • Choosing Copper Foils for High-Frequency PCBs
  • Driven to excess?
  • Business planning.
  • Integrated training.
  • LED conspiracy.
  • When a little more class might be wrong.
  • View the Digital Edition
1609cover

September 2016

  • How AC Currents Affect PCB Trace Temperatures
  • Ensuring Reliable Products with New Rigid-Flex Design Rules
  • Breaking the (m)old.
  • Trying harder.
  • Dealing with protectionism.
  • Panel tabs.
  • Particle size vs. nanocoatings.
  • View the Digital Edition
1608cover

August 2016

  • TRACE MODELING
  • RIGID-FLEX DESIGN
  • IPC Material Declarations: Sufficient for Automotive Electronics?
  • Seller beware.
  • Printing money.
  • Researching your investments.
  • A broker is not a builder.
  • Big fans of fan-out.
  • Designing in “robustness.”
  • All wrapped up.
  • View the Digital Edition
1607cover

July 2016

  • CONDUCTOR TEMPERATURES
  • HIGH-SPEED DESIGN
  • SURFACE FINISHES
  • CONSORTIA
  • Ungoverned.
  • Working with the next generation.
  • The offshoring balance.
  • Don’t forget the fiducials.
  • View the Digital Edition
1606cover

June 2016

  • FLEX CIRCUIT DESIGN
  • HIGH-SPEED DESIGN
  • ZIW RECAP
  • BASE MATERIALS
  • In print.
  • Viasystems redux? Not exactly.
  • The permeation of ERP and shop-floor control.
  • Flex: All stacked up.
  • Weaknesses of the flex standard.
  • View the Digital Edition
1605cover

May 2016

  • STRIPLINE MODELING
  • EMS TOP 50
  • Designed for speed.
  • The local supply chain: endangered species.
  • What should boards cost?
  • Keeping tabs.
  • Understanding the “dot” matrix.
  • View the Digital Edition
1604cover

April 2016

  • PCB INSPECTION
  • APEX EXPO RECAP
  • FACTORY MANAGEMENT
  • From spec to standard.
  • Game-changer or game-breaker?
  • Getting aligned.
  • Your first time.
  • Taped shut.
  • View the Digital Edition
1603cover

March 2016

  • PI-DC ANALYSIS
  • BTC DESIGN
  • Putting the pieces together.
  • Before and after.
  • What’s driving Japan.
  • Too many constraints.
  • Assembly adjustments.
  • What tests can’t tell you.
  • View the Digital Edition
1602cover

February 2016

  • THERMAL MODELING
  • The cost of "free."
  • Older, but better?
  • Seven negotiation tips.
  • Don’t count China out yet.
  • How are you communicating data to your EMS partner?
  • It’s geometry, my dear.
  • View the Digital Edition
1601cover

January 2016

  • SIGNAL INTEGRITY
  • THERMAL OVERLOAD
  • SMT ASSEMBLY
  • SHOW RECAP
  • Putting the pieces together.
  • East beats West.
  • How small beats big.
  • All marked up.
  • Leading off.
  • Pin penetration.
  • View the Digital Edition

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Press Releases

  • Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
  • AGS Devices Licenses and Co-Brands CELUS Design Platform to Enable Faster Product Development and Sourcing
  • Duro Launches Technology Partner Program to Deliver Complete Digital Thread for Hardware Engineering
  • TTM Technologies, Inc. Announces Retirement of Founder and Board Member, Kent Alder
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