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  • Breaking the 100GHz Barrier

    Breaking the 100GHz Barrier

    Breaking through the 100GHz bandwidth limit for coplanar waveguide design.  READ MORE...

  • ICT vs. Flying Probe

    ICT vs. Flying Probe

    Effective factory testing is essential for delivering reliable products.  READ MORE...

  • PCB Stackups: A Brief History

    PCB Stackups: A Brief History

    The evolution of layer stackups.  READ MORE...

  • Using Ultra HDI Where Needed

    Using Ultra HDI Where Needed

    Applying UHDI only where density and performance demands require it.  READ MORE...

  • How to Validate PCB Backdrilling

    How to Validate PCB Backdrilling

    How to specify and monitor PCB backdrill requirements.  READ MORE...

  • Tolerances and Dimensions for PCB Fabrication

    Tolerances and Dimensions for PCB Fabrication

    The tolerances decide what actually ships.  READ MORE...

Homepage Slideshow

  • Breaking the 100GHz Barrier

    Breaking through the 100GHz bandwidth limit for coplanar waveguide design.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19362-breaking-the-100ghz-barrier-with-ground-guard-sheets-in-mmwave-pcb-design

  • ICT vs. Flying Probe

    Effective factory testing is essential for delivering reliable products.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19355-ict-vs-flying-probe-factory-testing-of-pcb-assemblies

  • PCB Stackups: A Brief History

    The evolution of layer stackups.

    https://pcdandf.com/pcdesign/index.php/current-issue/297-tips-tricks/19357-pcb-stackups-a-brief-history

  • Using Ultra HDI Where Needed

    Applying UHDI only where density and performance demands require it.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19364-selective-uhdi-using-ultra-hdi-where-needed-not-everywhere

  • How to Validate PCB Backdrilling

    How to specify and monitor PCB backdrill requirements.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19363-from-fab-note-to-process-control-how-to-validate-pcb-backdrilling

  • Tolerances and Dimensions for PCB Fabrication

    The tolerances decide what actually ships.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19202-tolerances-and-dimensions-for-pcb-fabrication

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  • 2016 Magazine Archives
1612cover

December 2016

  • Price vs. Function
  • IPC-1782: The New Dawn of Electronics Traceability
  • 5 Common Mistakes in Board Design
  • In Memoriam
  • What the Mentor deal could portend for EDA.
  • A verified waste of time.
  • Changing of the generational guard.
  • Cutting the cost.
  • The limits of via-in-pad.
  • View the Digital Edition
1611cover

November 2016

  • How AC Currents Affect PCB Trace Temperatures, Part 2
  • Nano Anchoring Copper Foil for Next-Generation Printed Wiring Boards
  • How Can the IoT Be a Solid Rock to Build Products and Profits On?
  • Plugging the leaks.
  • Cybersecurity is all fogged up.
  • Making sense of the Philippines.
  • Where the supply chain begins.
  • For reference – or not?
  • Getting to the bottom of void problems on QFNs.
  • View the Digital Edition
1609cover

October 2016

  • Analyzing the DDR Simulation Results
  • Choosing Copper Foils for High-Frequency PCBs
  • Driven to excess?
  • Business planning.
  • Integrated training.
  • LED conspiracy.
  • When a little more class might be wrong.
  • View the Digital Edition
1609cover

September 2016

  • How AC Currents Affect PCB Trace Temperatures
  • Ensuring Reliable Products with New Rigid-Flex Design Rules
  • Breaking the (m)old.
  • Trying harder.
  • Dealing with protectionism.
  • Panel tabs.
  • Particle size vs. nanocoatings.
  • View the Digital Edition
1608cover

August 2016

  • TRACE MODELING
  • RIGID-FLEX DESIGN
  • IPC Material Declarations: Sufficient for Automotive Electronics?
  • Seller beware.
  • Printing money.
  • Researching your investments.
  • A broker is not a builder.
  • Big fans of fan-out.
  • Designing in “robustness.”
  • All wrapped up.
  • View the Digital Edition
1607cover

July 2016

  • CONDUCTOR TEMPERATURES
  • HIGH-SPEED DESIGN
  • SURFACE FINISHES
  • CONSORTIA
  • Ungoverned.
  • Working with the next generation.
  • The offshoring balance.
  • Don’t forget the fiducials.
  • View the Digital Edition
1606cover

June 2016

  • FLEX CIRCUIT DESIGN
  • HIGH-SPEED DESIGN
  • ZIW RECAP
  • BASE MATERIALS
  • In print.
  • Viasystems redux? Not exactly.
  • The permeation of ERP and shop-floor control.
  • Flex: All stacked up.
  • Weaknesses of the flex standard.
  • View the Digital Edition
1605cover

May 2016

  • STRIPLINE MODELING
  • EMS TOP 50
  • Designed for speed.
  • The local supply chain: endangered species.
  • What should boards cost?
  • Keeping tabs.
  • Understanding the “dot” matrix.
  • View the Digital Edition
1604cover

April 2016

  • PCB INSPECTION
  • APEX EXPO RECAP
  • FACTORY MANAGEMENT
  • From spec to standard.
  • Game-changer or game-breaker?
  • Getting aligned.
  • Your first time.
  • Taped shut.
  • View the Digital Edition
1603cover

March 2016

  • PI-DC ANALYSIS
  • BTC DESIGN
  • Putting the pieces together.
  • Before and after.
  • What’s driving Japan.
  • Too many constraints.
  • Assembly adjustments.
  • What tests can’t tell you.
  • View the Digital Edition
1602cover

February 2016

  • THERMAL MODELING
  • The cost of "free."
  • Older, but better?
  • Seven negotiation tips.
  • Don’t count China out yet.
  • How are you communicating data to your EMS partner?
  • It’s geometry, my dear.
  • View the Digital Edition
1601cover

January 2016

  • SIGNAL INTEGRITY
  • THERMAL OVERLOAD
  • SMT ASSEMBLY
  • SHOW RECAP
  • Putting the pieces together.
  • East beats West.
  • How small beats big.
  • All marked up.
  • Leading off.
  • Pin penetration.
  • View the Digital Edition

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JULY ISSUE
July cover

View the Digital
Edition Here!

Press Releases

  • ECIA Welcomes Vice President of Industry Practices
  • SCHMID Group Secures Repeat Order Exceeding $43M for Advanced HDI-ML and mSAP Equipment
  • SEMI and TechSearch International Release 2026 Edition of Worldwide Assembly & Test Facility Database
  • Asahi Kasei Adds New Slitting Facility for Sunfort to Meet Growing Demand for Advanced Semiconductor Packaging
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