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  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

  • Elements of PCB Panelization

    Elements of PCB Panelization

    Panelize to optimize: faster builds, better boards.  READ MORE...

  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Dynamic Times

    Dynamic Times

    Component Dynamics is where market intelligence meets distribution.
      READ MORE...

  • Power Circuits

    Power Circuits

    Making power connections is a world unto itself.   READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

Homepage Slideshow

  • NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18878-tracking-giants-inside-the-world-s-top-pcb-fabricators

  • Elements of PCB Panelization

    Panelize to optimize: faster builds, better boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18838-elements-of-pcb-panelization

  • Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18794-optimizing-mixed-signal-circuit-designs

  • Dynamic Times

    Component Dynamics is where market intelligence meets distribution.


    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18880-where-market-intelligence-meets-distribution

  • Power Circuits

    Making power connections is a world unto itself. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18874-power-circuits-an-island-pov-on-pcb-design

  • Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18798-developing-organizational-culture-for-troubleshooting

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  • 2016 Magazine Archives
1612cover

December 2016

  • Price vs. Function
  • IPC-1782: The New Dawn of Electronics Traceability
  • 5 Common Mistakes in Board Design
  • In Memoriam
  • What the Mentor deal could portend for EDA.
  • A verified waste of time.
  • Changing of the generational guard.
  • Cutting the cost.
  • The limits of via-in-pad.
  • View the Digital Edition
1611cover

November 2016

  • How AC Currents Affect PCB Trace Temperatures, Part 2
  • Nano Anchoring Copper Foil for Next-Generation Printed Wiring Boards
  • How Can the IoT Be a Solid Rock to Build Products and Profits On?
  • Plugging the leaks.
  • Cybersecurity is all fogged up.
  • Making sense of the Philippines.
  • Where the supply chain begins.
  • For reference – or not?
  • Getting to the bottom of void problems on QFNs.
  • View the Digital Edition
1609cover

October 2016

  • Analyzing the DDR Simulation Results
  • Choosing Copper Foils for High-Frequency PCBs
  • Driven to excess?
  • Business planning.
  • Integrated training.
  • LED conspiracy.
  • When a little more class might be wrong.
  • View the Digital Edition
1609cover

September 2016

  • How AC Currents Affect PCB Trace Temperatures
  • Ensuring Reliable Products with New Rigid-Flex Design Rules
  • Breaking the (m)old.
  • Trying harder.
  • Dealing with protectionism.
  • Panel tabs.
  • Particle size vs. nanocoatings.
  • View the Digital Edition
1608cover

August 2016

  • TRACE MODELING
  • RIGID-FLEX DESIGN
  • IPC Material Declarations: Sufficient for Automotive Electronics?
  • Seller beware.
  • Printing money.
  • Researching your investments.
  • A broker is not a builder.
  • Big fans of fan-out.
  • Designing in “robustness.”
  • All wrapped up.
  • View the Digital Edition
1607cover

July 2016

  • CONDUCTOR TEMPERATURES
  • HIGH-SPEED DESIGN
  • SURFACE FINISHES
  • CONSORTIA
  • Ungoverned.
  • Working with the next generation.
  • The offshoring balance.
  • Don’t forget the fiducials.
  • View the Digital Edition
1606cover

June 2016

  • FLEX CIRCUIT DESIGN
  • HIGH-SPEED DESIGN
  • ZIW RECAP
  • BASE MATERIALS
  • In print.
  • Viasystems redux? Not exactly.
  • The permeation of ERP and shop-floor control.
  • Flex: All stacked up.
  • Weaknesses of the flex standard.
  • View the Digital Edition
1605cover

May 2016

  • STRIPLINE MODELING
  • EMS TOP 50
  • Designed for speed.
  • The local supply chain: endangered species.
  • What should boards cost?
  • Keeping tabs.
  • Understanding the “dot” matrix.
  • View the Digital Edition
1604cover

April 2016

  • PCB INSPECTION
  • APEX EXPO RECAP
  • FACTORY MANAGEMENT
  • From spec to standard.
  • Game-changer or game-breaker?
  • Getting aligned.
  • Your first time.
  • Taped shut.
  • View the Digital Edition
1603cover

March 2016

  • PI-DC ANALYSIS
  • BTC DESIGN
  • Putting the pieces together.
  • Before and after.
  • What’s driving Japan.
  • Too many constraints.
  • Assembly adjustments.
  • What tests can’t tell you.
  • View the Digital Edition
1602cover

February 2016

  • THERMAL MODELING
  • The cost of "free."
  • Older, but better?
  • Seven negotiation tips.
  • Don’t count China out yet.
  • How are you communicating data to your EMS partner?
  • It’s geometry, my dear.
  • View the Digital Edition
1601cover

January 2016

  • SIGNAL INTEGRITY
  • THERMAL OVERLOAD
  • SMT ASSEMBLY
  • SHOW RECAP
  • Putting the pieces together.
  • East beats West.
  • How small beats big.
  • All marked up.
  • Leading off.
  • Pin penetration.
  • View the Digital Edition

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SEPTEMBER ISSUE
September cover

View the Digital
Edition Here!

Press Releases

  • Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
  • Luminovo to Host First Spanish-Language Webinar on September 5th
  • ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
  • Eltek Receives $2.4 Million Defense Order for PCBs Delivery in 2026-2027
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