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  • Chiplet Implementation via Virtual Prototyping

    Chiplet Implementation via Virtual Prototyping

    Assessing the cost vs. performance tradeoff.  READ MORE...

  • Cutting Your Losses Upfront in PCB Design

    Cutting Your Losses Upfront in PCB Design

    A methodology for selecting the right material and the right price point.  READ MORE...

  • Slicing Design-Manufacturing Time, Errors Using DfX

    Slicing Design-Manufacturing Time, Errors Using DfX

    Latest IPC-DPMX standard offers unique bidirectional data exchange between design houses and their manufacturing partners.  READ MORE...

  • Estimating the PCB Design Cycle with Limited Information

    Estimating the PCB Design Cycle with Limited Information

    And then making it happen.  READ MORE...

  • Who Needs S-Parameters?

    Who Needs S-Parameters?

    Consider these alternatives for advanced PCB design and analysis.  READ MORE...

Homepage Slideshow

  • Chiplet Implementation via Virtual Prototyping

    Assessing the cost vs. performance tradeoff.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15296-chiplet-implementation-via-virtual-prototyping

  • Cutting Your Losses Upfront in PCB Design

    A methodology for selecting the right material and the right price point.

    https://pcdandf.com/pcdesign/index.php/current-issue/266-material-matters/15291-cutting-your-losses-upfront-in-pcb-design

  • Slicing Design-Manufacturing Time, Errors Using DfX

    Latest IPC-DPMX standard offers unique bidirectional data exchange between design houses and their manufacturing partners.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15219-new-dfx-module-for-ipc-2581-slices-design-manufacturing-time-errors

  • Estimating the PCB Design Cycle with Limited Information

    And then making it happen.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/15290-estimating-the-pcb-design-cycle-with-limited

  • Who Needs S-Parameters?

    Consider these alternatives for advanced PCB design and analysis.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/15092-you-don-t-always-need-s-parameters

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  • 2020 Magazine Archives
2012cover

December 2020

  • View the digital issue
  • Accurate microsectioning for high-volume production
  • The PCEA comes alive
  • A look back at friends and colleagues who left us in 2020
  • Taming electromagnetic interference on a PCB 
  • The impedance implications of the trapezoidal trace 
  • What is the shortest flex length between rigid areas?
  • Download the pdf
2011cover

November 2020

  • View the digital issue
  • Alternatives to S-parameters for advanced PCB design and analysis
  • Automating high-speed constraints
  • Advanced packages in portable products
  • Implementing HDI in design
  • Will the US support R&D in manufacturing?
  • What can Industry 4.0 do for you?
  • Download the pdf
2010cover

October 2020

  • View the digital issue
  • Should BGA and CCA packages be bigger?
  • Design for rework
  • Embedded clearance
  • Covid: the ultimate organizational stress test
  • Is your customer service costing you business?
  • Download the pdf
2009cover

September 2020

  • View the digital issue
  • The NTI-100 list of the world's largest printed circuit fabricators for 2019
  • Enabling technologies for medical electronics
  • How to determine the critical length of a signal
  • Understanding drafting for printed circuit boards
  • What impedance is
  • Calculating copper thickness
  • Leveraging the IT department to reduce operation-caused variation
  • Updates in silicon and electronics technology
  • The role of AR and VR
  • Download the pdf
2008cover

August 2020

  • View the digital issue
  • Routing traces between pins on a 1mm pitch BGA
  • Ensuring long-term access to key component packages
  • Embedding magnetics in a PCB design
  • Footprint libraries
  • How to spend marketing dollars when travel is frozen
  • High reliability starts at the laminate
  • Why the flex circuit roadmap is broken
  • Download the pdf
2007cover

July 2020

  • View the digital issue
  • Differential signal design rules
  • Design rules and stackups for four-layer PCBs, the Lee Ritchey way
  • IoT standards
  • Bare board purchasing plans
  • Place and route recommendations
  • Controlling far-end crosstalk
  • Materials technology evolution
  • Why board orders go on hold, and how to prevent it
  • Benchmark Electronics opens a fab shop
  • Download the pdf
2006cover

June 2020

  • View the digital edition
  • Materials considerations for automotive radar designs
  • Current density and via temperature relationship
  • The 2020 PCD&F salary survey
  • What to do when your PCB supplier is acquired
  • PCB warpage
  • Via padstacks
  • Performance-centric materials specifications
  • Uneven layer counts on flex circuits
  • Download the pdf
2005cover

May 2020

  • View the digital edition 
  • Minimizing the effects of vias on very high-speed digital signals
  • Multi-board design for applications with different voltages
  • Is it time for a pandemic-resistant supply chain?
  • As we wait out Covid-19 at home, energy use and thermal management issues remain
  • An hour-by-hour look at the quickturn fabrication process
  • Who should be concerned about the fiber-weave effect?
  • What to bring to the PCB design review
  • the factory of the future, and what flexibility really buys us
  • Download the pdf
2004cover

April 2020

  • View the digital issue
  • BGA pitch impacts on bare board fabrication
  • Future aerospace and defense product requirements
  • Crisis communications strategies
  • Nepcon Japan recap
  • Assembly “gotchas” during the design phase
  • High-performance materials standards
  • Time and frequency domains
  • Flex circuit stiffeners
  • PCB manufacturing equipment advances
  • Download the pdf
2003cover

March 2020

  • View the digital edition
  • Differential pairs
  • Tight vs. loose coupling
  • IPC Apex Expo recap
  • Planning for supply chain disasters
  • Long parallel routing
  • Obtaining accurate Df numbers without building test boards
  • Download the pdf
2002cover

February 2020

  • View the digital edition
  • Using copper pour on routing layers
  • Next-generation PCB processes
  • Augmented reality (AR) solutions for the factory
  • What is the role of heterogeneous integration in the AI hardware ecosystem?
  • Can signal-integrity test vehicle results be accurately simulated?
  • Low-cost ways to expand your fabrication base
  • Via structure strategies
  • Download the pdf
2001cover

January 2020

  • View the Digital Edition
  • Signal-integrity test vehicle simulations
  • Mentor's post-Siemens merger plans
  • The electronics digital thread
  • Mist-based dispensing for fine lines
  • Protecting IP during purchasing
  • The future of PCBs
  • Download the pdf

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JANUARY ISSUE
January cover

View the Digital
Edition Here!

Press Releases

  • High Density Packaging User Group Announces Nippon Denkai Membership
  • Whitepaper: Maximizing the Next Generation of IoT Connectivity
  • TTM Technologies, Inc. Earns IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML)
  • NI and Konrad Technologies Sign Strategic Agreement to Accelerate Autonomous Vehicle Test
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