NEWS

DuPont Names New CEO

DuPont Names New CEO

23 May 2024

WILMINGTON, DE – DuPont's board of directors has selected CFO Lori D. Koch to succeed Edward D. Breen as the company’s CEO, effective June 1.  Read More...

Eltek Reports 3% Rise in Q1 Revenue

Eltek Reports 3% Rise in Q1 Revenue

21 May 2024

PETACH TIKVA, ISRAEL – Eltek announced $11.8 million in revenue for the first quarter, an increase of 3% over 2023's first quarter.  Read More...

Entegris Terminates MacDermid Alpha Distribution Deal

Entegris Terminates MacDermid Alpha Distribution Deal

21 May 2024

BILLERICA, MA – Entegris has announced the termination of a distribution agreement with MacDermid Alpha Electronics Solutions in exchange for $200 million.  Read More...

TPCA Releases Guide for Energy Conservation and Carbon Reduction

TPCA Releases Guide for Energy Conservation and Carbon Reduction

20 May 2024

TAOYUAN CITY, TAIWAN – The Taiwan Printed Circuit Association has published the “Guide to Energy Conservation and Carbon Reduction for PCB Factory Facilities an...  Read More...

AT&S Reports 13% Decrease in Annual Sales

AT&S Reports 13% Decrease in Annual Sales

16 May 2024

LEOBEN, AUSTRIA – AT S saw annual sales fall by 13% year-over-year to total €1.55 billion ($1.68 billion).  Read More...

PCEA Announces Free Technical Sessions for PCB East 2024

PCEA Announces Free Technical Sessions for PCB East 2024

16 May 2024

PEACHTREE CITY, GA – Registrants for the PCB East (https://www.pcbeast.com) exhibition this June will gain access to eight free technical sessions ranging from ...  Read More...

Electronics Industry Sentiment Falls in May

Electronics Industry Sentiment Falls in May

15 May 2024

BANNOCKBURN, IL – Sentiment among electronics manufacturers fell this month after hitting a new high in April, but still remains historically high, according to...  Read More...

Icape Group Sees 16% Q1 Revenue Decline

Icape Group Sees 16% Q1 Revenue Decline

15 May 2024

FONTENAY-AUX-ROSES, FRANCE – Icape Group announced €43.5 million ($47.3 million) in revenue for the first quarter, down 15.8% compared to the same period in 202...  Read More...

Chinese PCB Maker OCT to Build Thai Factory

Chinese PCB Maker OCT to Build Thai Factory

14 May 2024

HESHAN, CHINA – Olympic Circuit Technology has announced plans to invest up to $200 million to build a factory in Thailand to meet demand from existing and pote...  Read More...

Compeq Reports 15% Climb in Q1 Revenue

Compeq Reports 15% Climb in Q1 Revenue

13 May 2024

TAOYUAN, TAIWAN – Compeq's first quarter revenue of NT$15.6 billion was up 15% from the first quarter of 2023.  Read More...

Tech Visionary Harold Moss to Keynote PCB East 2024

Tech Visionary Harold Moss to Keynote PCB East 2024

13 May 2024

PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA (https://pcea.net)) today announced technology visionary Harold Moss will keynote the upc...  Read More...

Tripod Technology Announces 7% Increase in Q1 Revenue

Tripod Technology Announces 7% Increase in Q1 Revenue

13 May 2024

TAOYUAN, TAIWAN – Tripod Technology saw first quarter revenue of NT$15.3 billion, an increase of 7.4% from the first quarter of 2023.  Read More...

MKS Instruments Announces 9% Climb in Q1 Revenue

MKS Instruments Announces 9% Climb in Q1 Revenue

09 May 2024

ANDOVER, MA – MKS Instruments announced $868 million in first quarter revenue, up 9.3% from 2023's first quarter.  Read More...

PCB East 2024 to Offer Free Expert Advice Sessions

PCB East 2024 to Offer Free Expert Advice Sessions

08 May 2024

PEACHTREE CITY, GA – Experts in printed circuit design and manufacturing will be on hand at PCB East (https://www.pcbeast.com) 2024 to answer attendee questions...  Read More...

Hongxin Announces $207M AI Server Deal

Hongxin Announces $207M AI Server Deal

08 May 2024

XIAMEN, CHINA – Hongxin Electronics Technology Group has announced a CNY1.5 billion ($207.6 million) deal to provide AI computing servers to China's Qianyang go...  Read More...

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FEATURES

How the PCB Stackup Helps Control EMI

How the PCB Stackup Helps Control EMI

Power and signal placed on outer layers minimize radiated emissions. The PCB stackup is like a building's foundation; a product not built on a strong base will...  Read More...

Exploring the Impact of AI

Exploring the Impact of AI

A special panel discusses the growth of AI tools and its possible effects on the industry. “Will AI take my job?” That’s the question on the mind of many arou...  Read More...

Connecting the Industry, from Boards to Assemblies

Connecting the Industry, from Boards to Assemblies

HDP is embarking on new rounds of evaluations of laminates and lead-free solders. The High-Density Packaging User Group, the nonprofit consortium of electronic...  Read More...

Thermal Vias are Ineffective. Here’s Why.

Thermal Vias are Ineffective. Here’s Why.

Adding thermal vias can take up valuable board space with little benefit. We have developed several articles and publications in the past questioning the value...  Read More...

Creating the Ultra Library

Creating the Ultra Library

Building and maintaining what's said to be the world's largest CAD (http://www.pcdandf.com/pcdesign/menu-research/cad-cam-pcb-software) database requires strong...  Read More...

Building the Efficient Design System

Building the Efficient Design System

EMA founder Manny Marcano lays out his strategy for untethering methodology and technology. EMA Design Automation has for years been exclusive distributor of C...  Read More...

High-Density Interconnect Technology: An Overview

High-Density Interconnect Technology: An Overview

Design and manufacturing considerations for HDI PCBs. High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics ind...  Read More...

How Interconnects Work: Anatomy of Crosstalk

How Interconnects Work: Anatomy of Crosstalk

Models for understanding sources, quantification and mitigation of crosstalk. Crosstalk in PCB and packaging interconnects is arguably one of the most complica...  Read More...

Do Trace Coatings or Via Fillings Improve (Thermal or Electrical) Conductivity?

Do Trace Coatings or Via Fillings Improve (Thermal or Electrical) Conductivity?

Coating traces or filling vias is usually a wasted expense. We are often dismayed by the number of individuals (and especially board manufacturers) who suggest...  Read More...

Establishing Design Rules for Laser Depaneling of Printed Circuit Boards

Establishing Design Rules for Laser Depaneling of Printed Circuit Boards

Analysis and summary of the most fundamental design guidelines. Technological advantages associated with the use of laser systems include flexibility, material...  Read More...

Nothing Soft about PCB Design Tools Market

Nothing Soft about PCB Design Tools Market

Even after a long growth streak, observers still think the industry has life ahead. The Electronic Systems Design Alliance in October reported yet another stag...  Read More...

How to Calculate Transmission Line Impedance with Dispersion and Roughness, No Field Solver Needed!

How to Calculate Transmission Line Impedance with Dispersion and Roughness, No Field Solver Needed!

Analytical formulas, plus Microsoft Excel, are all you need. Look at just about any expert-level signal integrity guide and you will (or rather, should) see a ...  Read More...

Electrical and Thermodynamic Parallels

Electrical and Thermodynamic Parallels

Copper can conduct current and heat, but board materials conduct only heat. Most PCB designers have had at least some exposure to electrical engineering princi...  Read More...

'A Good First Step': PCBAA Talks Legislation Status

'A Good First Step': PCBAA Talks Legislation Status

PCBAA's executive director lauds recent funding wins but says the heavy lifting remains. Year-end is typically not the time when big announcements are made, bu...  Read More...

Why Making All Transmission Lines in a PCB 50Ω is Good Technological Practice

Why Making All Transmission Lines in a PCB 50Ω is Good Technological Practice

Simplify the stackups and make impedance and other measurements easier. As many as seven different impedances are called out in various design specifications. ...  Read More...

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PRODUCTS

Pasternack Launches Impedance-Matching Pads

Pasternack Launches Impedance-Matching Pads

Pasternack's matching pads for 50Ω and 75Ω transmission lines are said to provide seamless transition between the two types of lines.  Read More...

TTM Releases High-Performance Directional and Hybrid Couplers

TTM Releases High-Performance Directional and Hybrid Couplers

TTM Technologies' MC0812F1-20G and XMC0812F1-03G couplers are high-performance directional and hybrid couplers designed for applications such as power and frequ...  Read More...

Vishay Launches Automotive Grade Inductor

Vishay Launches Automotive Grade Inductor

Vishay Intertechnology's Custom Magnetics IHDF-1300AE-1A is a automotive grade IHDF edge-wound, through-hole inductor with a rated current up to 72A and saturat...  Read More...

Amphenol RF Rolls Out UWB Antennas

Amphenol RF Rolls Out UWB Antennas

Amphenol RF's ultra-wideband antennas can cover frequencies from 3.1 to 10.6GHz.  Read More...

Kyocera AVX Launches SNA and SNL Series Capacitors

Kyocera AVX Launches SNA and SNL Series Capacitors

Kyocera AVX's SNA and SNL Series snap-in aluminum electrolytic capacitors are said to deliver high-reliability, high-voltage and high-CV performance over long l...  Read More...

Vishay Releases Blue and True Green LEDs in MiniLED Package

Vishay Releases Blue and True Green LEDs in MiniLED Package

Vishay Intertechnology's VLMB2332T1U2-08 and VLMTG2332ABCA-08 surface-mount LEDs measure 2.2mm by 1.3mm by 1.4mm and feature a luminous intensity of 440mcd and ...  Read More...

Stackpole Rolls Out Automotive Grade Chip Resistor

Stackpole Rolls Out Automotive Grade Chip Resistor

Stackpole’s RPCA series chip resistor is AEC-Q200 qualified and is said to provide exceptional pulse handling.  Read More...

Samtec Releases Narrow Body RF Edge Launch Connectors

Samtec Releases Narrow Body RF Edge Launch Connectors

Samtec's RF edge launch connectors with a narrow body design that is said to be 33% smaller than traditional edge launch connectors.  Read More...

MKS Releases ESI Geode G2 Laser System

MKS Releases ESI Geode G2 Laser System

MKS Instruments' ESI Geode G2 laser drill system offers advancements in beam control capabilities, optical transmission, thermal management and AOD technology. ...  Read More...

Vishay Launches New TVS Series

Vishay Launches New TVS Series

Vishay Intertechnology's four new series of transient voltage suppressors (TVS) are designed to enhance protection and efficiency in automotive and industrial e...  Read More...

Würth Elektronik Expands WE-BMS Transformer Series

Würth Elektronik Expands WE-BMS Transformer Series

Würth Elektronik's WE-BMS transformer series for battery management systems now features versions for an operating voltage of 1500VDC.  Read More...

Doosan Releases New CCL Lineup

Doosan Releases New CCL Lineup

Doosan's new high-end copper-clad layer lineup features products suitable for memory, system semiconductors, communications networks and smart devices.  Read More...

DuPont Rolls Out Pyralux ML Laminates

DuPont Rolls Out Pyralux ML Laminates

DuPont's Pyralux ML double-sided metal-clad laminates were developed for optimal thermal management for high-reliability markets such as aerospace, defense, ele...  Read More...

Würth Elektronik Launches Sulfur-Resilient Resistors

Würth Elektronik Launches Sulfur-Resilient Resistors

Würth Elektronik's WRIS-RSKS family of anti-sulfur resistors is aimed at manufacturers of durable electronics for applications susceptible to exposure from sulf...  Read More...

HCLTech Rolls Out Cloud Hybrid EDA Solution

HCLTech Rolls Out Cloud Hybrid EDA Solution

HCLTech's cloud hybrid EDA solution uses NetApp's Design Anywhere to streamline the semiconductor design process, from concept to manufacturing.  Read More...

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PCB Chat

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