NEWS

IC Insights Raises 2021 Global IC Market Forecast to Growth of 24%

IC Insights Raises 2021 Global IC Market Forecast to Growth of 24%

16 June 2021

SCOTTSDALE, AZ – IC Insights raised its 2021 worldwide IC market forecast to growth of 24%. The global IC market is expected to exceed $500 billion for the firs...  Read More...

JEDEC Rolls Out JEP181 Standard for Thermal Model Sharing

JEDEC Rolls Out JEP181 Standard for Thermal Model Sharing

16 June 2021

ARLINGTON, VA – The JEDEC Solid State Technology Association established JEP181, a neutral file, XML-based standard for electronics cooling simulation for the m...  Read More...

Stephen Klare, Founder of ECAD Firm Intercept Technology, Has Passed Away

Stephen Klare, Founder of ECAD Firm Intercept Technology, Has Passed Away

15 June 2021

ATLANTA -- One of last of original founders to still run an ECAD company has passed away. Stephen Klare, 74, died at home on Jun. 10, from mesothelioma.  Read More...

Report: MKS Instruments Looking to Buy Atotech

Report: MKS Instruments Looking to Buy Atotech

15 June 2021

ANDOVER, MA -- MKS Instruments has made an offer to acquire Atotech, Reuters is reporting, citing confidential sources.  Read More...

Q1 Worldwide Smartphone Sales Grew 26%

Q1 Worldwide Smartphone Sales Grew 26%

15 June 2021

STAMFORD, CT – After a steep decline in 2020, global smartphone sales to end users grew 26% in the first quarter of 2021, according to Gartner. Overall, worldwi...  Read More...

Gartner: Global Chip Shortage to Continue Until Q2 2022

Gartner: Global Chip Shortage to Continue Until Q2 2022

14 June 2021

STAMFORD, CT – The worldwide semiconductor shortage will last through this year and not recover to normal levels until the second quarter of 2022, according to ...  Read More...

Element Solutions to Acquire Coventya for €420M

Element Solutions to Acquire Coventya for €420M

14 June 2021

VILLENEUVE LA GARENNE, FRANCE – Element Solutions has made a binding offer to acquire Coventya Holding in an all-cash deal of €420 million (US$509 million). ...  Read More...

DesignSpark integrates SnapEDA to Search Components, Download CAD Models

DesignSpark integrates SnapEDA to Search Components, Download CAD Models

14 June 2021

SAN FRANCISCO – A new collaboration will augment the DesignSpark website with the SnapEDA search engine, allowing engineers to discover and design-in millions o...  Read More...

UMass Researchers Create ‘Green’ Electronic Microsystems

UMass Researchers Create ‘Green’ Electronic Microsystems

11 June 2021

AMHERST, MA – A research team from the University of Massachusetts Amherst has developed an electronic microsystem that can intelligently, autonomously respond ...  Read More...

EIPC to Hold Technical Snapshot Webinar June 16

EIPC to Hold Technical Snapshot Webinar June 16

11 June 2021

GELEEN, THE NETHERLANDS – EIPC will hold its ninth technical snapshot webinar June 16.  Read More...

PCB Fab Equipment Maker Kunshan Dongwei to Debut IPO on Shanghai Exchange

PCB Fab Equipment Maker Kunshan Dongwei to Debut IPO on Shanghai Exchange

11 June 2021

KUNSHAN, CHINA – Kunshan Dongwei Technology will start trading on the Shanghai Stock Exchange Star Market on Jun. 16. The firm has issued 36.8 million shares pr...  Read More...

UN: Electronic Equipment Sales Down 30% in Lower Income Countries During Covid-19

UN: Electronic Equipment Sales Down 30% in Lower Income Countries During Covid-19

10 June 2021

NEW YORK – Electronic and electrical equipment sales were down 30% in low- and middle-income countries in the first three quarters of last year as a result of C...  Read More...

AT&S to Open 1st SE Asia Printed Circuit Production Plant in Malaysia

AT&S to Open 1st SE Asia Printed Circuit Production Plant in Malaysia

10 June 2021

LEOBEN, AUSTRIA – AT S will invest RM8.5 billion (US$2.1 billion) to open its first production plant in Southeast Asia.  Read More...

New Presentations On Very High-Speed Design, PCB Antennas Highlight PCB West 2021 Tech Conference

New Presentations On Very High-Speed Design, PCB Antennas Highlight PCB West 2021 Tech Conference

09 June 2021

ATLANTA, GA – Lee Ritchey and Rick Hartley headline a stellar list of technical experts presenting at PCB West (http://pcbwest.com/) this fall, UP Media Group I...  Read More...

Survey Finds DoD Suppliers Flummoxed Over CMMC Compliance

Survey Finds DoD Suppliers Flummoxed Over CMMC Compliance

08 June 2021

WASHINGTON – The costs and burdens of compliance with the Cybersecurity Maturity Model Certification (CMMC) may force some US electronics suppliers out of the D...  Read More...

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FEATURES

4 Areas for Controlling EMC in PCB Design

4 Areas for Controlling EMC in PCB Design

EMC for PCB design is anything but black magic. Electromagnetic compatibility (EMC) problems are often responsible for redesign cycles during the PCB design pr...  Read More...

What is Blockchain, and How Can It Solve Problems for Electronics Manufacturers?

What is Blockchain, and How Can It Solve Problems for Electronics Manufacturers?

Solving “track and trace” problems, even in reverse. To get a sense for how blockchain can address issues in the electronics industry, it may help to start wit...  Read More...

Designing for Higher Power in Smaller Form Factors

Designing for Higher Power in Smaller Form Factors

The redesign of a power adapter, using thermal modeling software. Much has been written about the benefits of moving thermal design activity higher up the prod...  Read More...

Maxwell and Transmission Lines

Maxwell and Transmission Lines

The famous mathematician can guide our understanding of electrical signals.  Read More...

Is Electrical Current Particle Flow or Wave Phenomenon?

Is Electrical Current Particle Flow or Wave Phenomenon?

Some engineers claim electrical current is not the flow of electrons. They are wrong.  Read More...

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PRODUCTS

Rohm Debuts BM2SC12xFP2-LBZ Converter ICs in TO263-7L Package

Rohm Debuts BM2SC12xFP2-LBZ Converter ICs in TO263-7L Package

TO263-7L package includes BM2SC12xFP2-LBZ AC/DC converter ICs with built-in 1700V SiC MOSFET.  Read More...

Zuken Announces Cloud Storage for E3.series

Zuken Announces Cloud Storage for E3.series

E3.series suite of products for wire harness and electrical cabinet design now has cloud storage.  Read More...

Cadence Announces Allegro X Electronics CAD Platform

Cadence Announces Allegro X Electronics CAD Platform

Allegro X Design Platform unifies schematic, layout, analysis, design collaboration and data management.  Read More...

3D Systems Adds 4 Figure 4 Resins

3D Systems Adds 4 Figure 4 Resins

3D Systems added four Figure 4 high-performance, production-capable resins designed for batch-run, end-use part manufacturing, and prototyping applications.  Read More...

Nano Dimension Launches DragonFly LDM 2.0 3-D Printing

Nano Dimension Launches DragonFly LDM 2.0 3-D Printing

DragonFly LDM 2.0 update introduces improved print quality, optimized ink utilization and smarter management for printer uptime.  Read More...

MacDermid Alpha Introduces Evabrite WS1, WS1-E Silver Anti-Tarnish Systems

MacDermid Alpha Introduces Evabrite WS1, WS1-E Silver Anti-Tarnish Systems

Evabrite WS1 and WS1-E water-based anti-tarnish systems protect functional silver surfaces and connectors from tarnish.  Read More...

AVX Releases UBC 550 Series Ultra-Broadband Capacitors

AVX Releases UBC 550 Series Ultra-Broadband Capacitors

UBC 550 series ultra-broadband capacitors are designed to deliver performance from 16KHz to 70+GHz in ultra-broadband microwave and millimeter-wave RF applicati...  Read More...

EasyLogix Upgrades PCB-Investigator v. 12.2 CAD/CAM Software

EasyLogix Upgrades PCB-Investigator v. 12.2 CAD/CAM Software

PCB-Investigator v. 12.2 provides the following enhancements: DRC analysis with overlap of copper/silkscreen with profiles;  Read More...

RS Components Updates DesignSpark PCB Pro v. 10.0 Software

RS Components Updates DesignSpark PCB Pro v. 10.0 Software

DesignSpark PCB Pro v. 10.0 features new disconnect from signal nets option;  Read More...

Vitech Rolls Out Genesys 2021 Systems Engineering Development Software

Vitech Rolls Out Genesys 2021 Systems Engineering Development Software

Genesys 2021 model-based systems engineering development platform can model objects specifying attributes, parameters, and properties once, and then inherit, sp...  Read More...

Samsung Releases I-Cube4 Chip Packaging Technology

Samsung Releases I-Cube4 Chip Packaging Technology

I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management and stable power supply.  Read More...

Antenova Offers Antenna Placement Tool

Antenova Offers Antenna Placement Tool

Antenna Placement Tool helps designers place antennas in a wireless design.  Read More...

Seica Debuts FlyPOD Module

Seica Debuts FlyPOD Module

FlyPOD module connects multiple hardware resources to mini fixture installed directly on flying probe.  Read More...

CAD Design Software Introduces EPD Suites for Windows

CAD Design Software Introduces EPD Suites for Windows

Electronics Packaging Designer (EPD) suites are powered by AutoCAD OEM. Used for complete PCB design or specific tasks such as bond wire exporting or translatio...  Read More...

Zuken Releases eCADSTAR v. 2021.0 PCB Design Software

Zuken Releases eCADSTAR v. 2021.0 PCB Design Software

eCadStar release 2021.0 includes numerous new features including 3-D creepage safety checks in the PCB design editor, improved bus management and sheet connecto...  Read More...

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PCB Chat

Tweets by Mike Buetow


Tweets by Mike Buetow