NEWS

Report: More than 50% of All Wireless Headphones Will Incorporate Hearable Tech by 2022

Report: More than 50% of All Wireless Headphones Will Incorporate Hearable Tech by 2022

12 December 2018

HAMPSHIRE, UK – An estimated 417 million hearables will be in use by 2022, says Juniper Research, including fitness-focused devices, hearing augmentation and au...  Read More...

Multek Names Reza Meshgin CEO

Multek Names Reza Meshgin CEO

07 December 2018

ZHUHAI, CHINA -- Multek has named Reza Meshgin chief executive, effective Dec. 1. Outgoing CEO Franck Lize has decided to move into an advisory role with DSBJ, ...  Read More...

Ventec Approved to Trade on TWSE Main Board Next Year

Ventec Approved to Trade on TWSE Main Board Next Year

06 December 2018

TAIPEI – Ventec has been approved to trade on the main board of the Taiwan Stock Exchange. The laminates manufacturer plans to start trading on the TWSE in Apri...  Read More...

Q3 AR/VR Headset Market Up More than 9%

Q3 AR/VR Headset Market Up More than 9%

05 December 2018

FRAMINGHAM, MA – The combined augmented reality (AR)/virtual reality (VR) headset market grew 9.4% year-over-year in the third quarter, according to Internation...  Read More...

Global Spending on Robotics, Drones to Grow 18% in 2019

Global Spending on Robotics, Drones to Grow 18% in 2019

05 December 2018

FRAMINGHAM, MA – Worldwide spending on robotics systems and drones will total $115.7 billion in 2019, up 17.6% over 2018, says International Data Corp. By 2022,...  Read More...

Global Computing Device Shipments to Decline 4% in 2018

Global Computing Device Shipments to Decline 4% in 2018

05 December 2018

FRAMINGHAM, MA – Unit shipments for the global personal computing devices market, comprised of traditional PCs (made up of desktops, notebooks and workstations)...  Read More...

iNEMI Hosts Webinars on Reuse and Recycling Metrics Project

iNEMI Hosts Webinars on Reuse and Recycling Metrics Project

05 December 2018

MORRISVILLE, NC – iNEMI is hosting webinars on its Reuse and Recycling Metrics Project, Phase 2, on Jan. 23 and 24.  Read More...

Q3 Global Semi Equipment Billings Up 11%

Q3 Global Semi Equipment Billings Up 11%

05 December 2018

MILPITAS, CA – Third quarter worldwide semiconductor manufacturing equipment billings were up 11% year-over-year and down 5% sequentially to $15.8 billion, says...  Read More...

Park Electrochemical Completes Sale of Electronics Business to AGC

Park Electrochemical Completes Sale of Electronics Business to AGC

05 December 2018

MELVILLE, NY – Park Electrochemical Corp. completed the sale of its electronics business to AGC for $145 million in cash.  Read More...

Ventec Completes 1st Phase of $300K Investment in German Service Center

Ventec Completes 1st Phase of $300K Investment in German Service Center

04 December 2018

KIRCHHEIMBOLANDEN, GERMANY – Ventec International Group completed the first phase of a $300,000 investment in its German Service Center here.  Read More...

IDC: Global Q3 Shipments of Wearables Up 22%

IDC: Global Q3 Shipments of Wearables Up 22%

04 December 2018

FRAMINGHAM, MA – Global shipments of wearable devices reached 32 million units in the third quarter, up 21.7% year-over-year, says the International Data Corpor...  Read More...

 Wearable Device Shipments to Increase 26% in 2019

Wearable Device Shipments to Increase 26% in 2019

03 December 2018

STAMFORD, CT – Worldwide shipments of wearable devices will reach 225 million in 2019, an increase of 25.8% from 2018, says Gartner.  Read More...

Oct. N. American PCB Shipments Up 5%

Oct. N. American PCB Shipments Up 5%

30 November 2018

BANNOCKBURN, IL – Total North American printed circuit board shipments in October were up 5.3% year-over-year and down 11.9% sequentially, says IPC. Year to dat...  Read More...

New White Paper Explains IPC Guidelines for Surface Finishes

New White Paper Explains IPC Guidelines for Surface Finishes

30 November 2018

To help those trying to meet IPC guidelines for surface finishes in a demanding production environment, Hitachi High-Tech has produced a white paper that helps ...  Read More...

UP Media Group Announces PCB West 2019 Exhibition Floor Sold Out

UP Media Group Announces PCB West 2019 Exhibition Floor Sold Out

29 November 2018

ATLANTA, GA – The exhibition floor is sold out for PCB West (http://pcbwest.com/), the largest conference and exhibition for printed circuit board design (http:...  Read More...

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FEATURES

Sputtering or Chemical Plating?

Sputtering or Chemical Plating?

More than 20 years ago, material manufacturers were competing to develop adhesiveless copper-clad laminates for next-generation flexible circuits.  Read More...

Maxwell and Transmission Lines

Maxwell and Transmission Lines

The famous mathematician can guide our understanding of electrical signals.  Read More...

A Broken Path

A Broken Path

The original IPC Roadmap was designed to pave the way for a new era of US manufacturing dominance. Was it effective?  Read More...

In Memoriam

In Memoriam

A look back at friends and colleagues who left us in 2018.  Read More...

Achieving Fine Lines and Spaces Using MSAP

Achieving Fine Lines and Spaces Using MSAP

A method to form fine-line circuits on organic substrates using traditional plating equipment.  Read More...

Limiting Radiation from Logic Circuit Boards

Limiting Radiation from Logic Circuit Boards

Once energy leaves a controlled path, the chances are it will cause interference and radiate from board edges.  Read More...

For a Calculator, What Does ‘Accuracy’ Really Mean?

For a Calculator, What Does ‘Accuracy’ Really Mean?

Many of the values we want to estimate are unknowable because the parameters themselves are unknown.  Read More...

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PRODUCTS

IPC Releases Comprehensive Video Training Library

IPC Releases Comprehensive Video Training Library

Comprehensive video training library includes 77 of IPC’s most popular video training titles as a subscription or as mini-libraries focused on hand soldering, e...  Read More...

ANSYS Develops ECXML Open File Format for Thermal Simulation

ANSYS Develops ECXML Open File Format for Thermal Simulation

ECXML (Electronics Cooling XML) open neutral file format makes it possible to share design models among different thermal simulation toolsets.  Read More...

ACL Staticide Rolls Out Nitrile ESD Gloves

ACL Staticide Rolls Out Nitrile ESD Gloves

Nitrile ESD gloves complement Nitrile ESD and Latex ESD finger cots.  Read More...

Panasonic Introduces Narrow-Pitch Connectors

Panasonic Introduces Narrow-Pitch Connectors

Narrow-pitch connectors use tough-contact technology and include flat printed circuit and flexible flat cable connectors, as well as board-to-board and board-to...  Read More...

ESI Launches Geode Laser Drilling System

ESI Launches Geode Laser Drilling System

Geode laser-based micro-via drilling system is for high-density interconnects on rigid printed circuit boards.  Read More...

TE Connectivity Introduces HD+ Card Edge Power Connectors

TE Connectivity Introduces HD+ Card Edge Power Connectors

High density plus (HD+) card edge power connectors reportedly deliver the highest current density of any card edge power connectors.  Read More...

EMA Launches Ultra Librarian Reference Design Cloud EDA Model Library

EMA Launches Ultra Librarian Reference Design Cloud EDA Model Library

Ultra Librarian Reference Design Cloud offers web-based access to reference design schematics and is said to enable faster design starts.  Read More...

Numerical Innovations Announces FAB 3000 V8 CAM

Numerical Innovations Announces FAB 3000 V8 CAM

FAB 3000 version 8 is full-featured CAM software for advanced DRC/DFM verification, component centroid generation, SMT stencil pads creation, PCB panelization, ...  Read More...

Genes’Ink Presents S-CS01520 Conductive Ink

Genes’Ink Presents S-CS01520 Conductive Ink

S-CS01520 conductive ink is said to enable fast prototyping and easy transition from laboratory equipment to commercial production scale when used with industri...  Read More...

ITEQ Launches IT-8338A, IT-8350A FR-4

ITEQ Launches IT-8338A, IT-8350A FR-4

IT-8338A and IT-8350A are for use in antenna and LNB applications.  Read More...

AVX Releases Lambda-Bridge Thermal Conductors

AVX Releases Lambda-Bridge Thermal Conductors

λ-Bridge (Lambda-Bridge) series thermal conductors are constructed with aluminum nitride or beryllium oxide materials.  Read More...

Hirose Offers CX Series Connectors

Hirose Offers CX Series Connectors

CX series USB 3.1 Gen2 Type-C connectors offer high current performance, waterproof certification and vertical orientation for enhanced design flexibility.  Read More...

Park Electrochemical Introduces RadarWave Prepreg Materials

Park Electrochemical Introduces RadarWave Prepreg Materials

RadarWave prepreg materials are used to manufacture radome systems for aerospace and defense applications.  Read More...

Ucamco Offers Free Reference Gerber Viewer v. 2.8

Ucamco Offers Free Reference Gerber Viewer v. 2.8

Reference Gerber Viewer v. 2.8 free, cloud-based online web service displays all meta-information contained in Gerber X2 files: layer structure, where via pads ...  Read More...

ESI Rolls out CapStone Flexible PCB Laser Drill

ESI Rolls out CapStone Flexible PCB Laser Drill

CapStone flexible printed circuit board laser drill processes blind and through-hole vias.  Read More...

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