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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • 2018 Magazine Archives
1812cover

December 2018

  • Limiting radiation from logic circuit boards
  • Retrospective: 25 years of the IPC Roadmap
  • A look back at friends and colleagues who left us in 2018
  • US-China tariff implications
  • Five rules of thumb for mitigating the interference of things
  • Trace width effects on signal loss
  • White polyimide
  • View the Digital Edition
1811cover

November 2018

  • Modified semiadditive processing (MSAP)
  • When to choose custom footprints
  • What five decades of designing PCB taught
  • AltiumLive recap
  • Why most MES implementations in electronics manufacturing fail
  • Why do roadmaps?
  • View the Digital Edition
1810cover

October 2018

  • Branding
  • Is it time the PCB industry reinvented itself?
  • Routing differential pairs
  • PCB design tradeoffs
  • Flex circuit delamination
  • Understanding "normal" data
  • Critical to Function (CTF) quality methodology
  • PCB West 2018 recap
  • View the Digital Edition
1809cover

September 2018

  • Environmental Regulations
  • Industry 4.0 Isn't New
  • Mitigating Parts Shortages
  • PCB Waterproof Protection
  • PCB Geometric Dimensioning and Tolerancing
  • NTI-100
  • Largest PCB Fabricators
  • Medical Device Technology Trends
  • View the Digital Edition
1808cover

August 2018

  • How to Ensure Your Design Complies with Complex Flex Circuit Design-for-Manufacturing Requirements
  • For a Calculator, What Does ‘Accuracy’ Really Mean?
  • The Profile of an EMS Facility is an Elusive Study
  • Automotive Electronics Moving into the Next Generation
  • Defense Bill Attacks (Some) Industry Problems.
  • ‘Industry 4.0’ is Really 4,000 Years Old.
  • Capability and MSAs are Not the Same
  • View the Digital Edition
1807cover

July 2018

  • 7 Habits of Highly Efficient PCB Designers
  • Manage High-Current Traces by Thinking Outside the Box
  • The Researcher’s Playground.
  • ECTC Boasts Record Crowds, FO-WLP Sessions Overflow.
  • Engineering Multi-GHz Systems is Driving Design to Deeper Levels.
  • Maximizing High-Speed Performance in Flex Boards.
  • X-ray Magnification – Transmissive and Reflective Targets.
  • Gold Peeling.
  • View the Digital Edition
1806cover

June 2018

  • Voltage in the GHz World
  • More on Via Temperatures
  • Using ECAD-MCAD Linkages to Enhance Avionics Thermal Design
  • How Rigid-Flex PCB Design Configurations are Advancing
  • Can Next-Gen Military Products Beat the Heat?
  • A Trade Problem in Search of Solutions.
  • Balancing your balance sheet.
  • Studying the Capability of Capability Studies – Part 3.
  • View the Digital Edition
1805cover

May 2018

  • Designing Printed Circuit Boards for the Internet of Things
  • Design Practices for Power Integrity in Printed Circuit Boards
  • The Complicated, Expansive World of IoT
  • For EDA, it's back to the future.
  • Data miners have much in common with manufacturers.
  • Plating selection for flex circuits.
  • Substrate thermal performance.
  • Champagne voiding: The not-so-tasty treat.
  • The benefits of old.
  • View the Digital Edition
1804cover

April 2018

  • The Layout of Fast Logic on Printed Circuit Boards
  • Are Transmission Line Signals Different from Conductor Signals?
  • Why IPC-2581 is the CAD Data Exchange Format of Today – and Tomorrow
  • The Next PC Evolution Will Bring a Richer User Experience
  • Apple iMac Pro Teardown
  • The time is now for PCBs in DC.
  • Should we be excited over the ramp in electronics demand?
  • A co-design solution for a wireless RF flip-chip design dilemma.
  • View the Digital Edition
1803cover

March 2018

  • The Impact of Final Plated Finishes on Insertion Loss for High-Frequency PCBs
  • The Ongoing Convergence of Gaming Devices
  • Microsoft Xbox One X Teardown
  • Over inspection?
  • Treasure hunt.
  • Nepcon Japan: The marriage of ASICs and memory.
  • EMC rule checking.
  • Insulated metal substrates.
  • Call of duty.
  • View the Digital Edition
1802cover

February 2018

  • Is Electrical Current Particle Flow or Wave Phenomenon?
  • Acer AH101 Mixed Reality VR Headset
  • AR/VR: The New Interfaces of Humans
  • Breaking the contraction cycle.
  • Millennials, your time to take charge is now.
  • Data dumps.
  • More over-mold.
  • A deep dive into data distribution.
  • View the Digital Edition
1801cover

January 2018

  • What Can Decision Feedback Equalization (DFE) Do for You?
  • The Diversity of High-End Systems
  • IBM HS22V Blade Server Teardown
  • Will machine learning come at the expense of humans?
  • AI: Still aiming for prime time.
  • Simplifying debugging.
  • Picking materials for highest-speed boards.
  • View the Digital Edition

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Press Releases

  • Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
  • AGS Devices Licenses and Co-Brands CELUS Design Platform to Enable Faster Product Development and Sourcing
  • Duro Launches Technology Partner Program to Deliver Complete Digital Thread for Hardware Engineering
  • TTM Technologies, Inc. Announces Retirement of Founder and Board Member, Kent Alder
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