Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • Reflections from Discontinuities

    Reflections from Discontinuities

    Reflections can destroy a signal, but the effect of major discontinuities can be predicted with validated models.  READ MORE...

  • PCB Panelization Costs: It’s All About the Real Estate

    PCB Panelization Costs: It’s All About the Real Estate

    On arrays, a quarter or half-inch too long in one direction may mean a double-digit price difference.  READ MORE...

  • Covid Class Creations

    Covid Class Creations

    PCB East keynoter Gene Weiner gives a roundup of innovative technologies to come out of the pandemic.  READ MORE...

  • Will US Government Incentives Spur Domestic Investment?

    Will US Government Incentives Spur Domestic Investment?

    The PCBAA gets legislative good news. What’s next for the organization?  READ MORE...

  • Onshoring and Second Sourcing

    Onshoring and Second Sourcing

    The current difficulties call for a more strategic approach to arranging our global supply chains.  READ MORE...

Homepage Slideshow

  • Reflections from Discontinuities

    Reflections can destroy a signal, but the effect of major discontinuities can be predicted with validated models.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/16569-reflections-from-discontinuities

  • PCB Panelization Costs: It’s All About the Real Estate

    On arrays, a quarter or half-inch too long in one direction may mean a double-digit price difference.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/270-board-buying/16564-pcb-panelization-costs-it-s-all-about-the-real-estate

  • Covid Class Creations

    PCB East keynoter Gene Weiner gives a roundup of innovative technologies to come out of the pandemic.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/285-what-s-old-is-new/16563-covid-class-creations

  • Will US Government Incentives Spur Domestic Investment?

    The PCBAA gets legislative good news. What’s next for the organization?

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/16566-will-us-government-incentives-spur-domestic-investment

  • Onshoring and Second Sourcing

    The current difficulties call for a more strategic approach to arranging our global supply chains.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/262-material-gains/16565-onshoring-and-second-sourcing

  • HOME
  • .
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Editorial
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • Columns/Op-Eds
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
  • Research
    • Market Data
    • Directory of EMS Companies
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • 2018 Magazine Archives
1812cover

December 2018

  • Limiting radiation from logic circuit boards
  • Retrospective: 25 years of the IPC Roadmap
  • A look back at friends and colleagues who left us in 2018
  • US-China tariff implications
  • Five rules of thumb for mitigating the interference of things
  • Trace width effects on signal loss
  • White polyimide
  • View the Digital Edition
1811cover

November 2018

  • Modified semiadditive processing (MSAP)
  • When to choose custom footprints
  • What five decades of designing PCB taught
  • AltiumLive recap
  • Why most MES implementations in electronics manufacturing fail
  • Why do roadmaps?
  • View the Digital Edition
1810cover

October 2018

  • Branding
  • Is it time the PCB industry reinvented itself?
  • Routing differential pairs
  • PCB design tradeoffs
  • Flex circuit delamination
  • Understanding "normal" data
  • Critical to Function (CTF) quality methodology
  • PCB West 2018 recap
  • View the Digital Edition
1809cover

September 2018

  • Environmental Regulations
  • Industry 4.0 Isn't New
  • Mitigating Parts Shortages
  • PCB Waterproof Protection
  • PCB Geometric Dimensioning and Tolerancing
  • NTI-100
  • Largest PCB Fabricators
  • Medical Device Technology Trends
  • View the Digital Edition
1808cover

August 2018

  • How to Ensure Your Design Complies with Complex Flex Circuit Design-for-Manufacturing Requirements
  • For a Calculator, What Does ‘Accuracy’ Really Mean?
  • The Profile of an EMS Facility is an Elusive Study
  • Automotive Electronics Moving into the Next Generation
  • Defense Bill Attacks (Some) Industry Problems.
  • ‘Industry 4.0’ is Really 4,000 Years Old.
  • Capability and MSAs are Not the Same
  • View the Digital Edition
1807cover

July 2018

  • 7 Habits of Highly Efficient PCB Designers
  • Manage High-Current Traces by Thinking Outside the Box
  • The Researcher’s Playground.
  • ECTC Boasts Record Crowds, FO-WLP Sessions Overflow.
  • Engineering Multi-GHz Systems is Driving Design to Deeper Levels.
  • Maximizing High-Speed Performance in Flex Boards.
  • X-ray Magnification – Transmissive and Reflective Targets.
  • Gold Peeling.
  • View the Digital Edition
1806cover

June 2018

  • Voltage in the GHz World
  • More on Via Temperatures
  • Using ECAD-MCAD Linkages to Enhance Avionics Thermal Design
  • How Rigid-Flex PCB Design Configurations are Advancing
  • Can Next-Gen Military Products Beat the Heat?
  • A Trade Problem in Search of Solutions.
  • Balancing your balance sheet.
  • Studying the Capability of Capability Studies – Part 3.
  • View the Digital Edition
1805cover

May 2018

  • Designing Printed Circuit Boards for the Internet of Things
  • Design Practices for Power Integrity in Printed Circuit Boards
  • The Complicated, Expansive World of IoT
  • For EDA, it's back to the future.
  • Data miners have much in common with manufacturers.
  • Plating selection for flex circuits.
  • Substrate thermal performance.
  • Champagne voiding: The not-so-tasty treat.
  • The benefits of old.
  • View the Digital Edition
1804cover

April 2018

  • The Layout of Fast Logic on Printed Circuit Boards
  • Are Transmission Line Signals Different from Conductor Signals?
  • Why IPC-2581 is the CAD Data Exchange Format of Today – and Tomorrow
  • The Next PC Evolution Will Bring a Richer User Experience
  • Apple iMac Pro Teardown
  • The time is now for PCBs in DC.
  • Should we be excited over the ramp in electronics demand?
  • A co-design solution for a wireless RF flip-chip design dilemma.
  • View the Digital Edition
1803cover

March 2018

  • The Impact of Final Plated Finishes on Insertion Loss for High-Frequency PCBs
  • The Ongoing Convergence of Gaming Devices
  • Microsoft Xbox One X Teardown
  • Over inspection?
  • Treasure hunt.
  • Nepcon Japan: The marriage of ASICs and memory.
  • EMC rule checking.
  • Insulated metal substrates.
  • Call of duty.
  • View the Digital Edition
1802cover

February 2018

  • Is Electrical Current Particle Flow or Wave Phenomenon?
  • Acer AH101 Mixed Reality VR Headset
  • AR/VR: The New Interfaces of Humans
  • Breaking the contraction cycle.
  • Millennials, your time to take charge is now.
  • Data dumps.
  • More over-mold.
  • A deep dive into data distribution.
  • View the Digital Edition
1801cover

January 2018

  • What Can Decision Feedback Equalization (DFE) Do for You?
  • The Diversity of High-End Systems
  • IBM HS22V Blade Server Teardown
  • Will machine learning come at the expense of humans?
  • AI: Still aiming for prime time.
  • Simplifying debugging.
  • Picking materials for highest-speed boards.
  • View the Digital Edition

Archives

  • 2021 Issues

  • 2020 Issues

  • 2019 Issues

  • 2018 Issues

  • 2017 Issues

  • 2016 Issues

  • 2015 Issues

  • 2014 Issues

  • 2013 Issues

  • 2012 Issues

  • 2011 Issues

  • 2010 Issues

  • 2009 Issues

  • 2008 Issues

  • 2007 Issues

  • 2006 Issues

  • 2005 Issues

  • 2004 Issues

  • 2022 Issues

MAY ISSUE
MAY cover

View the Digital
Edition Here!

Press Releases

  • SEMI Foundation Awarded $1.5 Million Grant to Bolster Michigan’s Semiconductor Industry Talent Pipeline
  • ILFA Commits to LHMT/Schmoll Machine Group for Automation Strategy
  • New IPC Initiative Focuses on E-mobility Quality & Reliability
  • Prototron Circuits Upgrades Its’ Lamination Capabilities
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2022 Printed Circuit Engineering Association™, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association™ Privacy Policy