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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • 2021 Magazine Archives
December Cover

December 2021

  • As the chair turns
  • A counterargument to cutting staff and inventory
  • Use of core vias in a PCB design
  • Implementing and sustaining quality management systems
  • VR/AR technologies
  • Selecting a flex circuit supplier
  • Tariffs: Help or harm?
  • Nearshoring from Latin America
  • From proper grounding to material selection, common best practices for optimal RF results
  • In memoriam
  • Download PDF
November Cover

November 2021

  • PCEA makes its move
  • The supply chain crisis was years in the making
  • Flex circuit footprints
  • Adoption of a vendor-neutral data transfer standard
  • Volthub: connecting the supply chain
  • Etching defects
  • Keep an eye on IoT
  • Download PDF
October Cover

October 2021

  • Making progress
  • Redefining craftsmanship
  • When to use microvias
  • PDN process oversight
  • Solder mask options for flex circuits
  • Smart manufacturing is coming
  • Solder paste alloys and surface finishes interactions, Part 2
  • 008004s: Impractical, but Possible
  • Download PDF
September Cover

September 2021

  • Our annual design engineer salary survey
  • Getting started with blockchain technology
  • Local sourcing of PCBs
  • Why evenly distribute copper on a PCB?
  • Identifying loop inductance issues
  • What role will optical interconnects and graphene play
  • A positive message for surviving a pandemic
  • A pair of antidotes
  • Uncovering delamination causes
  • Download PDF
2108cover

August 2021

  • View the digital edition
  • The world's largest printed circuit fabricators
  • Can Google compete in AOI?
  • Fine-tuning impedance and resistive loss
  • How cryptocurrency mining is affecting the PCB industry
  • Optimizing the bill of materials (BoM)
  • Conduction avenues for non-power signals
  • Flex material thickness
  • Download the pdf
2107cover

July 2021

  • Demystifying power integrity
  • Solder paste alloys and surface finish interactions
  • How electronics manufacturers are using blockchain technology
  • Component placement from the design perspective
  • Optical character recognition (OCR) as a data entry method
  • Download the pdf
2106cover

June 2021

  • Controlling EMC in PCB design
  • Blockchain, and how it can solve problems for electronics manufacturers
  • How M&A and India will reshape the electronics manufacturing landscape
  • How to be a better worker
  • Finding employees post-Covid
  • Achieving a robust and functioning power distribution network (PDN)
  • Time to adopt data-driven planning methods
  • Money-saving tips for printed circuit board design
  • BGA vias and routing
  • Download the pdf
2105cover

May 2021

  • PCB engineer training programs
  • Integrating passives with photosensitive glass ceramics
  • How AI and lab-on-a-chip pave the way for economical solutions
  • Eliminating repetitive data entry
  • Using logic devices on a PCB
  • Unresponsive PDNs
  • Why you pay too much for printed circuit boards
  • Download the pdf
2104cover

April 2021

  • Artificial intelligence in electronics design
  • Nonlinear regression for determining PCB finish thicknesses
  • Keeping the PDN running smoothly
  • Eliminating electrical interference on PCBs
  • Laser depaneling
  • Automating data package processes
  • Laws of physics applied to printed circuit boards
  • 5 options for connector-less flex jumpers
  • Download the pdf
2103cover

March 2021

  • PCB design and fabrication concerns for millimeter-wave circuits
  • 2021: Automation, flexibility and the "electronics supercycle"
  • How a new trade group is aiding the DoD’s desire for a trusted supply chain
  • Using IPC-2581C for embedded components
  • How much is more analysis worth?
  • Solderability is more than selecting the right solder
  • Power integrity analysis assumptions
  • Download the pdf
2102cover

February 2021

  • What is the future for desktop ECAD?
  • Bidirectional data exchange between design houses and manufacturing
  • Overcoming Covid stagnation
  • Drawing standards
  • Crosshatches in flex circuits/a>
  • Eliminating latency in next-gen WiFi 6E devices
  • Download the pdf
2101cover

January 2021

  • System-in-package implementation options in the chiplet world
  • Bidirectional data exchange between design houses and manufacturing
  • HDP: Are older standards still valid, or holding the industry back?
  • How to respond to supplier price increases
  • Estimating the PCB design cycle
  • A methodology for selecting the right material and the right price point
  • Download the pdf

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Press Releases

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