Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • Good Signs: IPC Apex Booth Traffic Suggests Busy Year Ahead

    Good Signs: IPC Apex Booth Traffic Suggests Busy Year Ahead

    Exhibitors hope new products will keep the order books filled in 2023.
      READ MORE...

  • Permittivity vs Permeability: What’s the Difference?

    Permittivity vs Permeability: What’s the Difference?

    Some areas of physics have considerable impact on PCB designs.
      READ MORE...

  • PCB Outline Transfer

    PCB Outline Transfer

    Tips for better communication and preparation.
      READ MORE...

  • A Quick Fix for Fillet Starvation

    A Quick Fix for Fillet Starvation

    Not enough solder? Blame the via design!
      READ MORE...

  • How Interconnects Work: Characteristic Impedance and Reflections

    How Interconnects Work: Characteristic Impedance and Reflections

    Understanding reflections caused by transmission line characteristic impedance and termination impedance mismatch.
      READ MORE...

Homepage Slideshow

  • Good Signs: IPC Apex Booth Traffic Suggests Busy Year Ahead

    Exhibitors hope new products will keep the order books filled in 2023.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17108-good-signs-ipc-apex-booth-traffic-suggests-busy-year-ahead

  • Permittivity vs Permeability: What’s the Difference?

    Some areas of physics have considerable impact on PCB designs.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17109-permittivity-vs-permeability-what-s-the-difference

  • PCB Outline Transfer

    Tips for better communication and preparation.


    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/17105-pcb-outline-transfer

  • A Quick Fix for Fillet Starvation

    Not enough solder? Blame the via design!


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17107-a-quick-fix-for-fillet-starvation

  • How Interconnects Work: Characteristic Impedance and Reflections

    Understanding reflections caused by transmission line characteristic impedance and termination impedance mismatch.


    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/17110-how-interconnects-work-characteristic-impedance-and-reflections

  • HOME
  • .
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Editorial
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • Columns/Op-Eds
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
  • Research
    • Market Data
    • Directory of EMS Companies
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • 2021 Magazine Archives
December Cover

December 2021

  • As the chair turns
  • A counterargument to cutting staff and inventory
  • Use of core vias in a PCB design
  • Implementing and sustaining quality management systems
  • VR/AR technologies
  • Selecting a flex circuit supplier
  • Tariffs: Help or harm?
  • Nearshoring from Latin America
  • From proper grounding to material selection, common best practices for optimal RF results
  • In memoriam
  • Download PDF
  • View the digital edition
November Cover

November 2021

  • PCEA makes its move
  • The supply chain crisis was years in the making
  • Flex circuit footprints
  • Adoption of a vendor-neutral data transfer standard
  • Volthub: connecting the supply chain
  • Etching defects
  • Keep an eye on IoT
  • Download PDF
  • View the digital edition
October Cover

October 2021

  • Making progress
  • Redefining craftsmanship
  • When to use microvias
  • PDN process oversight
  • Solder mask options for flex circuits
  • Smart manufacturing is coming
  • Solder paste alloys and surface finishes interactions, Part 2
  • 008004s: Impractical, but Possible
  • Download PDF
  • View the digital edition
September Cover

September 2021

  • Our annual design engineer salary survey
  • Getting started with blockchain technology
  • Local sourcing of PCBs
  • Why evenly distribute copper on a PCB?
  • Identifying loop inductance issues
  • What role will optical interconnects and graphene play
  • A positive message for surviving a pandemic
  • A pair of antidotes
  • Uncovering delamination causes
  • Download PDF
  • View the digital edition
2108cover

August 2021

  • View the digital edition
  • The world's largest printed circuit fabricators
  • Can Google compete in AOI?
  • Fine-tuning impedance and resistive loss
  • How cryptocurrency mining is affecting the PCB industry
  • Optimizing the bill of materials (BoM)
  • Conduction avenues for non-power signals
  • Flex material thickness
  • Download the pdf
  • View the digital edition
2107cover

July 2021

  • View the digital edition
  • Demystifying power integrity
  • Solder paste alloys and surface finish interactions
  • How electronics manufacturers are using blockchain technology
  • Component placement from the design perspective
  • Optical character recognition (OCR) as a data entry method
  • Download the pdf
2106cover

June 2021

  • View the digital edition
  • Controlling EMC in PCB design
  • Blockchain, and how it can solve problems for electronics manufacturers
  • How M&A and India will reshape the electronics manufacturing landscape
  • How to be a better worker
  • Finding employees post-Covid
  • Achieving a robust and functioning power distribution network (PDN)
  • Time to adopt data-driven planning methods
  • Money-saving tips for printed circuit board design
  • BGA vias and routing
  • Download the pdf
2105cover

May 2021

  • View the digital edition
  • PCB engineer training programs
  • Integrating passives with photosensitive glass ceramics
  • How AI and lab-on-a-chip pave the way for economical solutions
  • Eliminating repetitive data entry
  • Using logic devices on a PCB
  • Unresponsive PDNs
  • Why you pay too much for printed circuit boards
  • Download the pdf
2104cover

April 2021

  • View the digital edition
  • Artificial intelligence in electronics design
  • Nonlinear regression for determining PCB finish thicknesses
  • Keeping the PDN running smoothly
  • Eliminating electrical interference on PCBs
  • Laser depaneling
  • Automating data package processes
  • Laws of physics applied to printed circuit boards
  • 5 options for connector-less flex jumpers
  • Download the pdf
2103cover

March 2021

  • PCB design and fabrication concerns for millimeter-wave circuits
  • View the digital issue
  • 2021: Automation, flexibility and the "electronics supercycle"
  • How a new trade group is aiding the DoD’s desire for a trusted supply chain
  • Using IPC-2581C for embedded components
  • How much is more analysis worth?
  • Solderability is more than selecting the right solder
  • Power integrity analysis assumptions
  • Download the pdf
2102cover

February 2021

  • View the digital issue
  • What is the future for desktop ECAD?
  • Bidirectional data exchange between design houses and manufacturing
  • Overcoming Covid stagnation
  • Drawing standards
  • Crosshatches in flex circuits/a>
  • Eliminating latency in next-gen WiFi 6E devices
  • Download the pdf
2101cover

January 2021

  • View the digital issue
  • System-in-package implementation options in the chiplet world
  • Bidirectional data exchange between design houses and manufacturing
  • HDP: Are older standards still valid, or holding the industry back?
  • How to respond to supplier price increases
  • Estimating the PCB design cycle
  • A methodology for selecting the right material and the right price point
  • Download the pdf

Archives

  • 2021 Issues

  • 2020 Issues

  • 2019 Issues

  • 2018 Issues

  • 2017 Issues

  • 2016 Issues

  • 2015 Issues

  • 2014 Issues

  • 2013 Issues

  • 2012 Issues

  • 2011 Issues

  • 2010 Issues

  • 2009 Issues

  • 2008 Issues

  • 2007 Issues

  • 2006 Issues

  • 2005 Issues

  • 2004 Issues

  • 2022 Issues

MARCH ISSUE
current issue

View the Digital
Edition Here!

Press Releases

  • Schweitzer Engineering Laboratories Purchases Chemcut Equipment for New Printed Circuit Board Factory
  • Aspocomp’s Remuneration Report for Governing Bodies 2022 Has Been Published
  • Altair Announces Altair RapidMiner: One Converged Platform for Data Analytics and Artificial Intelligence
  • Nano Dimension European Headquarters Inaugurated by Government Minister, in Munich, Germany
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2023 Printed Circuit Engineering Association™, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association™ Privacy Policy