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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

  • Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb

  • Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent

  • Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing

  • Implementing Flash Memory in PCB Design

    Routing flash has EMI implications. 

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design

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  • 2015 Magazine Archives
1512cover

December 2015

  • SIMULATION
  • HOLE RELIABILITY
  • RETROSPECTIVE
  • At Productronica, rise of the machines?
  • Sharpen your profitability plan.
  • Sizing up the strategic vs. tactical model conundrum.
  • Flex circuits: On the edge of good design.
  • Paste viscosity, and its effect on solder performance.
  • View the Digital Edition
1511cover

November 2015

  • SIGNAL INTEGRITY
  • SCHEDULING
  • CONFORMAL COATINGS
  • THE FUTURE
  • Supply chain woes.
  • It’s a material world, but it’s also a small one (and getting smaller).
  • A light look at LED rotation.
  • Bringing Lean to the third world.
  • View the Digital Edition
1510cover

October 2015

  • THERMAL MANAGEMENT
  • Standard procedures.
  • In PCBs and in life, tolerance is a virtue.
  • Getting to the root of STEM.
  • Where will package innovation go next?
  • A BoM that’s okay to talk about.
  • Impaneled for panel help.
  • Handle with care.
  • Lean test strategies.
  • View the Digital Edition
1509cover

September 2015

  • PCB DESIGN
  • SALARY SURVEY
  • COVER STORY
  • PLATING
  • On parts, programs and people.
  • Corporate complacency breeds stagnation. How do know when it's time to make changes?
  • Shapes of things to come.
  • The complications of laminate comparisons, and what we should do about it.
  • View the Digital Edition
1508cover

August 2015

  • MENTOR GRAPHICS
  • FLEX DESIGN
  • CAD TOOLS
  • Foxconn’s India rush.
  • Is there more to Moore’s Law?
  • The tradeoffs of Mexico.
  • Via-in-pad: only if you must.
  • How heavy is too heavy?
  • In search of the perfect solder paste.
  • View the Digital Edition
1507cover

July 2015

  • PCB DESIGN
  • THE PROFESSION
  • BASE MATERIALS
  • You deserve a break today.
  • No end to talk on finishes.
  • Where do we go from China?
  • Fanning out at ECTC.
  • The value of constraints.
  • The sixth ‘S’ of the Lean enterprise.
  • View the Digital Edition
1506cover

June 2015

  • THERMAL MANAGEMENT
  • PCB DESIGN
  • X-ray vision.
  • The software-hardware showdown.
  • Don’t make poor marketing your brand.
  • Suppressing unwanted emissions.
  • Good powder.
  • View the Digital Edition
May 2015 cover

May 2015

  • QUALITY CONTROL
  • EMS TOP 50
  • CAD merry-go-round.
  • The maintenance man.
  • East meets West.
  • Switching off the noise.
  • Trade show creatures.
  • View the Digital Edition
April 2015 cover

April 2015

  • IPC APEX RECAP
  • CONFORMAL COATINGS
  • QUALITY CONTROL
  • Attack of the OEMs.
  • When will the new guard arrive?
  • Putting manufacturing back into the local economy.
  • Watching the parts go ‘round.
  • The cost of getting bigger.
  • Is the Pull Signal Lean Enough?
  • LGA/QFN: Focus on the bottom.
  • View the Digital Edition
March 2015 cover

March 2015

  • CAD PREDICTIONS #1
  • CAD PREDICTIONS #2
  • CAD PREDICTIONS #3
  • RESIDUES
  • Too big to succeed?
  • Are you appropriately valuing your supply chain?
  • InterNepcon “wears” it well.
  • “Engineering” a new designer demographic.
  • View the Digital Edition
February 2015 cover

February 2015

  • View the Digital Edition
  • COMPONENT SELECTION
  • FLEX DESIGN
  • Data driven.
  • Looking inside.
  • Avoiding the commodity pitch.
  • Assumptions are meant to be challenged.
  • Base foil selection for flex stack-ups.
January 2015 cover

January 2015

  • View the Digital Edition
  • PACKAGING
  • COMPONENT PROCESSING
  • Is sharing for suckers?
  • What’s hot this year?
  • Governed solutions?
  • PCB design archiving.

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  • AGS Devices Licenses and Co-Brands CELUS Design Platform to Enable Faster Product Development and Sourcing
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  • TTM Technologies, Inc. Announces Retirement of Founder and Board Member, Kent Alder
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