How fully has AI taken over packaging, power and manufacturing priorities?

With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, fine process technology and printed wiring boards, plus halls devoted to automotive, smart factory and robotics.

Progress for glass-core substrates and RDL interposers highlighted ECTC’s 75th anniversary conference.

More than 2,500 attendees braved the stormy Texas weather to discuss the latest developments in packaging and assembly at the IEEE Electronics Components and Technology Conference (ECTC) in May. Among the many presentations were a number focused on high-performance packaging, with clear momentum for expanded use of molded redistribution layer (RDL) packages, wafer-level packaging and updates on the states of glass core substrates. IBM announced its license of Deca’s RDL technology and outlined production plans for North America. Many presentations described progress in hybrid bonding and co-packaged optics, while others highlighted thermal challenges and metrology needs.