The payoffs are seen in yield improvement and better customer communication.

How fully has AI taken over packaging, power and manufacturing priorities?

With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, fine process technology and printed wiring boards, plus halls devoted to automotive, smart factory and robotics.