
When implementing a Lean plan, don’t leave out safety.

You may think your pull system is Lean, but what are you pulling?

Thousands of attendees gathered at ECTC to explore the latest advances in advanced packaging, AI-driven design, heterogeneous integration and thermal management.
More than 2,700 attendees conversed about the latest developments in packaging and assembly at the IEEE Electronics Components and Technology Conference (ECTC) in May in Orlando.