Defect of the Month

Bob Willis

A look at solder mask contamination on pads.

This month we look at solder mask contamination on pads. FIGURE 1 is a very, very bad example that never should have made it to the customer. Solder mask residues are visible on the surface and around the edge of the pad. There is also a level of solder mask undercutting.

 

 

 

 

Read more: Avoid Green Solderable Finishes

Bob Willis

Get agreement on what constitutes “rework” – and a capable operator.

This month we look at etching defects and their removal – or presence, as in the case of FIGURE 1. A customer was surprised to find a batch of bare boards with this level of rework.

 

 

 

 

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Read more: Poor Fabrication and Rework

Bob Willis

Excessive temperature or moisture may be to blame.

Open connections on area array packages can be difficult to spot, particularly if they are intermittent electrical failures like the examples in FIGURE 1. One or more open joints can occur between the package and solder sphere or at the PCB pad interface. Reflow soldering with either convection or vapor phase can cause packages to move and separate. This can be caused by warping of the package or in some cases minor popcorning due to moisture. Both faults can be simulated and recorded with video for reference.

 

 

 

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Read more: Resolving Intermittent Area Array Packages with Video Simulation

Bob Willis

Moisture is only one of the potential culprits.

PCB delamination can be subtle or obvious. It is caused by expansion of moisture in the PCB laminate, but that may not be the root cause. Eliminating moisture often prevents the energy buildup that forces apart different layers, but this is not the complete story. Poor bonding during manufacturing of the multilayer board or some form of contamination may result in poor adhesion on innerlayers, permitting moisture to accumulate on these surfaces.

FIGURE 1 shows solder mask cracking around a through via. The PCB expanded during reflow, then contracted during cooling. This resulted in lifting and cracking of the solder mask, plus an intermittent electrical connection. FIGURE 2 shows the innerlayer surface of the board after separation. The through vias are separated and there is no visible adhesion on this layer.

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Read more: PCB Delamination Root Causes
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