Log in / Register
  • ENEPIG Corrosion Mechanisms

    ENEPIG Corrosion Mechanisms

    Different types of nickel corrosion and potential mitigation strategies.
      READ MORE...

  • The Future is Thin, Flat and Flexible

    The Future is Thin, Flat and Flexible

    What’s ahead for antennas, heaters and inks.
      READ MORE...

  • Royalty Flush

    Royalty Flush

    A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
      READ MORE...

  • Rocking and Rolling at ZIW

    Rocking and Rolling at ZIW

    The annual user event was tuned into AI, but that’s not the only melody being played.
      READ MORE...

  • Can Thailand Pad its PCB Gains?

    Can Thailand Pad its PCB Gains?

    2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
      READ MORE...

Homepage Slideshow

Resolving Intermittent Area Array Packages with Video Simulation

Published: 17 December 2020
 by Bob Willis

Bob Willis

Excessive temperature or moisture may be to blame.

Open connections on area array packages can be difficult to spot, particularly if they are intermittent electrical failures like the examples in FIGURE 1. One or more open joints can occur between the package and solder sphere or at the PCB pad interface. Reflow soldering with either convection or vapor phase can cause packages to move and separate. This can be caused by warping of the package or in some cases minor popcorning due to moisture. Both faults can be simulated and recorded with video for reference.

 

 

 

To continue reading, please log in or register using the link in the upper right corner of the page.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article