Progress for glass-core substrates and RDL interposers highlighted ECTC’s 75th anniversary conference.

More than 2,500 attendees braved the stormy Texas weather to discuss the latest developments in packaging and assembly at the IEEE Electronics Components and Technology Conference (ECTC) in May. Among the many presentations were a number focused on high-performance packaging, with clear momentum for expanded use of molded redistribution layer (RDL) packages, wafer-level packaging and updates on the states of glass core substrates. IBM announced its license of Deca’s RDL technology and outlined production plans for North America. Many presentations described progress in hybrid bonding and co-packaged optics, while others highlighted thermal challenges and metrology needs.

What the time of “intelligent interrogation” means for today’s workforce.

Artificial intelligence (AI) is transforming education and learning – changing how we learn inside and outside of school, the workplace and other formal and informal settings.

Since the introduction of generative AI (GenAI) model in November 2022 and the release of the large language models (LLM), such as ChatGPT 4 in March 2023, and its later variations including ChatGPT 4o and ChatGPT 4o Mini on top of other GenAI apps and tools, the speed of the transformation is ever increasing.

The future best-in-class learning is expected to use AI-powered assistants and AI agents that are contextually aware of and fully integrated with the learning environment to deliver personalized, one-on-one guidance and feedback to learners at scale. The anchor term herein is “at scale.” The ready availability of GenAI and its continued development and advancement will propel new teaching and learning pathways, leading to heightened efficiency and effectiveness of on-campus learning, lifelong learning, professional upskilling and reskilling.