PCB DESIGN
Using Systems Design Methodology to Manage Complex PCB Designs
Managing the hundreds of interconnections between boards and external connectors and controls, manually, and without error, is virtually impossible. Is there a better way to ensure new configurations communication and design synchronization?
by Rainer Asfalg And Andy Watts
RETROSPECTIVE
In Memoriam
A look back at friends and colleagues who left us in 2014.
CAVEAT LECTOR
Giving it away.
Mike Buetow
ROI
The fab sandwich.
Peter Bigelow
FOCUS ON BUSINESS
Cushioning the blows.
Susan Mucha
FABRICATION
Cost Comparison of Complex PCB Fabrication using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes become smaller, the cost of PCB fabrication goes up. Sequential lamination of complex circuit boards, in particular, is a time-consuming and expensive process. This study analyzes costs associated with traditional methods compared with an alternative that uses conductive paste as interconnect between cores.
by Chet A. Palesko, Amy J. Palesko, James Haley And Catherine Shearer
DESIGN TRADEOFFS
Are Tight Tolerances Costing You Money?
Does a tighter tolerance guarantee superior quality and better function, or just a higher unit cost? A look at the tradeoffs.
by Robert Simon
CHEMICAL LABELING
GHS Timeline Update
The latest OSHA hazard communication requirements go into effect next year, impacting manufacturers and all facilities which use chemicals. Are you ready?
by Scott Mazur
CAVEAT LECTOR
Who will we have left to rely on when the chips are down?
Mike Buetow
ROI
Too big not to fail?
Peter Bigelow
FOCUS ON BUSINESS
False promises.
Joseph Fama
COVER STORY
Fresh Faces in the Design Community
The annual PCD&F Salary Survey reveals some sharp contrasts between Western designers and their counterparts in Asia. Plus, is the workforce getting (gasp!) younger?
by Chelsey Drysdale
CAVEAT LECTOR
There may never be another like Viasystems.
Mike Buetow
ROI
Out of fashion but not out of factory.
Peter Bigelow
FOCUS ON BUSINESS
Maximizing the program manager.
Susan Mucha
FINAL FINISHES
The upside of rough topography.
Lenora Toscano
INSPECTION
Magnification vs. Resolution in Visual Examination Specifications
Widely used standards are inadequate when it comes to specifying visual inspection in terms of magnification, as the manner in which an optical aid is used impacts its magnification. Resolution is a critical parameter that we recommend specifying, along with magnification in requirements for visual inspection.
by Louis Hart and Robert Simmons
CAVEAT LECTOR
An industry icon passes on.
Mike Buetow
ROI
What we can learn from the grocer.
Peter Bigelow
FOCUS ON BUSINESS
In search of the real India.
Joseph Fama
DESIGNER’S NOTEBOOK
Differential serial data transmission.
Patrick Carrier
TECH TIPS
The race for whisker-free solder.
Karl Seelig and Tim O’Neill
PI SIMULATION
Power Integrity Analysis Using Free Software
While commercial software is more substantial, and freeware requires more clever ways to set up the simulation and interpret the results, the author finds the available tools surprisingly effective.
by Istvan Nagy
COVER STORY
A Two-Team Race?
Apple and Samsung are the top customers of nine of the 20 largest PCB fabricators, and as the annual NTI-100 list demonstrates, those makers did well in 2013. Is their success sustainable?
by Dr. Hayao Nakahara
BOARD RELIABILITY
Nonfunctional Pads: Should They Stay or Should They Go?
To understand the influence of NFPs on reliability, industry experts were surveyed. Will their response settle the debate?
by Greg Caswell and Cheryl Tulkoff
DATA TRANSFER
Latest IPC-2581 Revision Gaining Widespread Appeal
Enhancements to the stackup and assembly data have the supply chain signing on to the electronics data transfer format.
by Mike Buetow
ROI
On pride and perceptions.
Peter Bigelow
FOCUS ON BUSINESS
Staying on message in the EMS arena.
Susan Mucha
DESIGNER’S NOTEBOOK
Stick with the standard?
F. Scott Fillebrown
INSPECTION
What is FAI, and What is the Purpose?
While SAE AS9102 defines first article inspection and its purpose, there is often confusion regarding that definition and its importance to an OEM. These concerns cause havoc in both the design and production worlds. Here, a leading defense contractor clears up FAI.
by Karen Ebner, Charles A. Hill and G. Wilkish
PACKAGING
Characteristics of a Third-Level PCB Assembly
Under typical circumstances, engineers won’t know whether a design will work until the prototype is built. A package “implementation” approach, rather than package “installation” approach, can help EMS firms comply with OEM requirements.
by Mueed Khan
ROI
Service with a smile.
Peter Bigelow
FOCUS ON BUSINESS
Priced to win.
Joseph Fama
ON THE FOREFRONT
ECTC: a packaging heaven.
E. Jan Vardaman
DESIGNER’S NOTEBOOK
Moving targets.
Charles Pfeil
GETTING LEAN
Counting the data.
Ron Feyereisen
TECH TIPS
More whiskers.
Karl Seelig and Tim O’Neill
TEST AND INSPECTION
I’m your answer.
Robert Boguski