CAD SOFTWARE
Price vs. Function
Functionality, breadth of features and ease of use top what designers like most about their preferred CAD software. But their biggest concern is not speed; it’s cost.
by Chelsey Drysdale
STANDARDS
IPC-1782: The New Dawn of Electronics Traceability
Traceability is thought of as expensive, complex, unreliable, incomplete, a threat to business and different for everyone. Can a new standard for electronics overcome those hurdles?
by Michael Ford
PCB DESIGN
5 Common Mistakes in Board Design
From wrong component selection to thermal imbalance, many of the most frequent yield spoilers are fixable.
by Arbel Nissan
TRANSITIONS
In Memoriam
Remembering those who left us in 2016.
CAVEAT LECTOR
What the Mentor deal could portend for EDA.
Mike Buetow
ROI
A verified waste of time.
Peter Bigelow
THERMAL MANAGEMENT
How AC Currents Affect PCB Trace Temperatures, Part 2
Past articles looked at the relationship between trace current and temperature for pulses that propagated through the trace. A look at the slightly more complicated topic of analog waveforms to see if the same conclusions apply.
by Douglas G. Brooks, Ph.D. and Dr. Johannes Adam
PCB MATERIALS
Nano Anchoring Copper Foil for Next-Generation Printed Wiring Boards
Newly developed treatment technology for copper foil enables ultra-low profile surfaces.
by Osamu Suzuki, Akito Yoshii, Hironobu Tsubura, Makiko Sato, Naoki Obata and Yoshinobu Kokaji
How Can the IoT Be a Solid Rock to Build Products and Profits On?
by Jon Howes
CAVEAT LECTOR
Plugging the leaks.
Mike Buetow
ROI
Cybersecurity is all fogged up.
Peter Bigelow
HIGH-SPEED DESIGN
Analyzing the DDR Simulation Results
After looking in past months at critical signal integrity concerns that engineers face designing the DDR bus, and points to consider while setting up the simulation, this month the author discusses what to look for in the results of the simulation.
by Nitin Bhagwath
HIGH-FREQUENCY MATERIALS
Choosing Copper Foils for High-Frequency PCBs
Perhaps surprisingly, the same type of electrodeposited copper processed with two different treatments can yield two different levels of circuit performance. Thinner materials for microwave boards benefit from smooth surfaces to decrease insertion loss.
by John Coonrod
CAVEAT LECTOR
Driven to excess?
Mike Buetow
ROI
Business planning.
Peter Bigelow
TRACE MODELING
How AC Currents Affect PCB Trace Temperatures
Methods for estimating how AC currents behave on PCB traces, and verification with empirical testing.
by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam
RIGID-FLEX DESIGN
Ensuring Reliable Products with New Rigid-Flex Design Rules
Using both the rigid and the flexible areas of a PCB for component placement, while possible, introduces new design constraints that require more advanced PCB design strategies. Rules and guidelines for routing and placement.
by Jim Frey
CAVEAT LECTOR
Breaking the (m)old.
Mike Buetow
ROI
Trying harder.
Peter Bigelow
TRACE MODELING
How AC Currents Affect PCB Trace Temperatures
Methods for estimating how AC currents behave on PCB traces, and verification with empirical testing.
by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam
RIGID-FLEX DESIGN
Ensuring Reliable Products with New Rigid-Flex Design Rules
Using both the rigid and the flexible areas of a PCB for component placement, while possible, introduces new design constraints that require more advanced PCB design strategies. Rules and guidelines for routing and placement.
by Jim Frey
IPC Material Declarations: Sufficient for Automotive Electronics?
IMDS and IPC-1752A are different tools for reporting materials data, created by separate industries for different purposes. Suppliers of automotive electronics are obligated to use both, but should they?
by Derrik Snider
CAVEAT LECTOR
Seller beware.
Mike Buetow
ROI
Printing money.
Peter Bigelow
CONDUCTOR TEMPERATURES
The Dynamics of PCB Trace Heating and Cooling, and a Call to Action
After rigorous study, the authors have identified the major parameters responsible for trace heating and cooling, and quantified the effects of many of them. Here they highlight the most important parameters, illustrate their individual effects on trace heating and cooling, and then suggest two areas where additional research is needed.
by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam
HIGH-SPEED DESIGN
Preparing to Simulate DDR Memory Bus Interfaces
In order to increase the odds of a functional board on the first pass and reduce the number of spins required, it is usually wise to simulate the design before fabricating the board. That said, the time required to set up, run and analyze the simulation also needs to be fast enough to make the investment in simulation worthwhile. How to speed up the process of designing a functioning system.
by Nitin Bhagwath
SURFACE FINISHES
Extreme Long-Term Printed Circuit Board Surface Finish Solderability Assessment
Could the surface finishes of a group of test specimens, found some 20 years after their fabrication, hold up to today’s testing measures? And what impact does finish thickness have on future solderability?
by Gerard O’Brien and Dave Hillman
CONSORTIA
iNEMI Roadmap Gets Industry Aligned
Industry leaders are fast at work on the iNEMI 2017 Roadmap, the biennial tome that serves as an answer to the ongoing question of what’s next for manufacturing technology. And while other industry efforts to chart the future are losing steam, iNEMI’s are still going strong.
by Mike Buetow
CAVEAT LECTOR
Ungoverned.
Mike Buetow
ROI
Working with the next generation.
Peter Bigelow