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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
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  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
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  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
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Homepage Slideshow

2016 Magazine Archives

October 2016 issue

Published: 01 October 2016

1609cover

 

FEATURES

HIGH-SPEED DESIGN
Analyzing the DDR Simulation Results
After looking in past months at critical signal integrity concerns that engineers face designing the DDR bus, and points to consider while setting up the simulation, this month the author discusses what to look for in the results of the simulation.
by Nitin Bhagwath

HIGH-FREQUENCY MATERIALS
Choosing Copper Foils for High-Frequency PCBs
Perhaps surprisingly, the same type of electrodeposited copper processed with two different treatments can yield two different levels of circuit performance. Thinner materials for microwave boards benefit from smooth surfaces to decrease insertion loss.
by John Coonrod

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

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