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Voltage in the GHz World

More on Via Temperatures

Using ECAD-MCAD Linkages to Enhance Avionics Thermal Design

How Rigid-Flex PCB Design Configurations are Advancing

Can Next-Gen Military Products Beat the Heat?

A Trade Problem in Search of Solutions.

Balancing your balance sheet.

Studying the Capability of Capability Studies – Part 3.

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Designing Printed Circuit Boards for the Internet of Things

Design Practices for Power Integrity in Printed Circuit Boards

The Complicated, Expansive World of IoT

For EDA, it's back to the future.

Data miners have much in common with manufacturers.

Plating selection for flex circuits.

Substrate thermal performance.

Champagne voiding: The not-so-tasty treat.

The benefits of old.

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The Layout of Fast Logic on Printed Circuit Boards

Are Transmission Line Signals Different from Conductor Signals?

Why IPC-2581 is the CAD Data Exchange Format of Today – and Tomorrow

The Next PC Evolution Will Bring a Richer User Experience

Apple iMac Pro Teardown

The time is now for PCBs in DC.

Should we be excited over the ramp in electronics demand?

A co-design solution for a wireless RF flip-chip design dilemma.

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FEATURES

RF CIRCUITS
The Impact of Final Plated Finishes on Insertion Loss for High-Frequency PCBs
Each final finish has its own concerns related to insertion loss. The impact of loss for an applied finish is generally dependent on frequency, circuit thickness, and circuit design configuration. Here, the author looks at microstrip transmission lines and two different versions of grounded coplanar waveguide.
by John Coonrod

INEMI ROADMAP
The Ongoing Convergence of Gaming Devices
Cost, power, bandwidth and form factor of these mobile devices continue to be driving factors for acceleration of integration of silicon and system capabilities into single package or single die.
by Kartik Ananth

TEARDOWNS
Microsoft Xbox One X Teardown
A custom chip built on the AMD platform powers the popular video game console.
by Mike Buetow

FIRST PERSON

• CAVEAT LECTOR
  Over inspection?
  Mike Buetow

MONEY MATTERS

• ROI
  Treasure hunt.
  Peter Bigelow
  

TECH TALK

• ON THE FOREFRONT
  Nepcon Japan: The marriage of ASICs and memory.
  Jan Vardaman
• DESIGNER’S NOTEBOOK
  EMC rule checking.
  Andy Buja
• MATERIAL GAINS
  Insulated metal substrates.
  Martin Cotton
• TEST AND INSPECTION
  Call of duty.
  Robert Boguski