Printed Circuit Design & Fab Online Magazine

How to Run a Design of Experiments
A review of the six fundamental steps behind scientific process development.
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American Standard Circuits’ Push for UHDI is On
After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
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Collaborating Across the Industry
The High Density Packaging User Group drives innovation through active partnerships.
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Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag
Why a relatively unknown technology might be right for static bend applications.
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Embedded Sensors in Flex Circuits
From glob top to lamination, solutions for sealing parts in flex.
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FEATURES

HIGH-SPEED DESIGN
What Can Decision Feedback Equalization (DFE) Do for You?
Decision feedback equalization (DFE) has been around for some time in the SerDes world. Now it’s working its way into the world of DDR, where DDR5 is slated to incorporate DFE in DRAMs. What is DFE, and how does it work?
by Nitin Bhagwath

INEMI ROADMAP
The Diversity of High-End Systems
In this, the first of an occasional series highlighting the 2017 iNEMI Roadmap, the authors look at the primary segments of high-end systems – computing, networking and storage – and discuss the trends in bandwidth demands, power constraints, thermal requirements and environmental situations.
by Dale Becker

TEARDOWNS
IBM HS22V Blade Server Teardown
Going inside the popular high-density, high-performance server line, which features expandable processing and memory options.
by Mike Buetow