Printed Circuit Design & Fab Online Magazine

How to Run a Design of Experiments
A review of the six fundamental steps behind scientific process development.
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American Standard Circuits’ Push for UHDI is On
After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
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Collaborating Across the Industry
The High Density Packaging User Group drives innovation through active partnerships.
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Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag
Why a relatively unknown technology might be right for static bend applications.
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Embedded Sensors in Flex Circuits
From glob top to lamination, solutions for sealing parts in flex.
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August 2014 cover

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FEATURES

PI SIMULATION
Power Integrity Analysis Using Free Software
While commercial software is more substantial, and freeware requires more clever ways to set up the simulation and interpret the results, the author finds the available tools surprisingly effective.
by Istvan Nagy

COVER STORY
A Two-Team Race?
Apple and Samsung are the top customers of nine of the 20 largest PCB fabricators, and as the annual NTI-100 list demonstrates, those makers did well in 2013. Is their success sustainable?
by Dr. Hayao Nakahara

BOARD RELIABILITY
Nonfunctional Pads: Should They Stay or Should They Go?
To understand the influence of NFPs on reliability, industry experts were surveyed. Will their response settle the debate?
by Greg Caswell and Cheryl Tulkoff

DATA TRANSFER
Latest IPC-2581 Revision Gaining Widespread Appeal
Enhancements to the stackup and assembly data have the supply chain signing on to the electronics data transfer format.
by Mike Buetow