PCD&F Magazine Issues

May 2013 cover

 

FEATURES

Design Hall of Fame
CAD Pioneers Lead Latest Hall Inductees
The father of the gridless router. The largest seller of CAD seats. A leading inventor of team-based design. The foremost signal integrity guru. These are the four latest inductees to the Dieter W. Bergman PCB Design Hall of Fame.
by Mike Buetow

Data Transfer
IPC-2581 Consortium Update
The consortium is on track to extend the standard to enable build-intent collaboration between PCB manufacturers and design houses before layout begins.
by Hemant Shah

Quality Assurance
Using Forensics to Improve PCB Design and Assembly
Where AOI and conventional x-ray peak, other methods can hone in on nettlesome defects.
by Zulki Khan

ESD
Static Control Standards: An Annual Progress Report
From components to wrist straps, a look at more than 60 documents that make up ESD control programs.
by The ESD Association

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

  • On the Forefront
    New life in Japan?
    E. Jan Vargerman

  • Designer’s Notebook
    Filling the roster.
    W. Scott Fillebrown

  • In Flex
    The power of polyimide.
    Dale Wesselmann

  • Technical Abstracts
    In case you missed it.

May 2013 cover

 

FEATURES

PCB Layout
Will a Via Fit in Between?
BGAs have never been easy to route, but with 0.3mm versions coming, via-in-pad becomes a consideration.
by Duane Benson

Thermal Management
Cool Runnings
The ongoing push to integrate mechanical and electrical design has now extended to electronics cooling simulation.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Rigid-flex.
    Peter Bigelow

 

TECH TALK

  • Designer’s Notebook
    Simulation accuracy.
    Patrick Carrier

  • The Flexperts
    Sticky situations.
    Mark Verbrugge

  • Tech Tips
    ‘Board’ talk.
    Robert Dervaes

  • Technical Abstracts
    In case you missed it.

April 2013 cover

 

FEATURES

Schematic Design
Advanced Block Organization in Schematic Design and Layout
Designs using blocks are much easier to check and maintain, saving precious design time. A lesser-known hierarchical capability called the virtual block is especially useful for smaller schematics.
by Abby Monaco

EMS Top 50
Bend, Don’t Break
If the EMS market in 2012 were a movie, it would have been the good (Nam Tai), the bad (the effects of RIM) and the ugly (Elcoteq). But most of the world’s 50 largest contract assemblers absorbed the blows from shrinking PC and cellphone margins and set their sights on the more profitable (if smaller) automotive and industrial sectors.
by Mike Buetow

ESD Basics
Managing Your ESD Program
Enjoy all the software tools, but don’t forget the procedures.
by The ESD Association

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Incorporating new technology.
    Peter Bigelow

  • Focus on Business
    Relationship make or breaks.
    Susan Mucha

 

TECH TALK

  • Designer’s Notebook
    Design for test.
    W. Scott Fillebrown

  • Final Finishes
    Microetch, major player.
    Lenora Toscano

  • In Flex
    Flex circuit integration.
    Dale Wesselmann

  • Solar Technologies
    Dual print processes.
    Tom Falcon

  • Technical Abstracts
    In case you missed it.

March 2013 cover

 

FEATURES

CircuitHub
In Search of the Designer’s Holy Grail
The latest in a yearlong PCD&F series highlighting promising new enterprises in printed circuit board design looks at startup CircuitHub’s user-driven parts library.
by Mike Buetow

ESD Basics
The ‘Simple’ Problem
“Does my process generate an electrostatic charge, and if so, how much?” A simple “yes or no” answer is rare.
by The ESD Association

Apex Expo Recap
Let’s Get Small
At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
by Mike Buetow

Cover Story
Bridging Technology between Conventional 3D and TSV 3D Stacking

Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
by  Belgacem Haba, Ph.D.

FIRST PERSON

  • Caveat Lector
    Acquiring minds.
    Mike Buetow

  • Talking Heads
    Gary Ferrari and the IPC-2221B.
    Mike Buetow

  • Talking Heads
    EMS Business on Block, Woods Still Sees Bright Side.
    Mike Buetow

 

MONEY MATTERS

  • ROI
    I will, I promise.
    Peter Bigelow

 

TECH TALK

  • Designer’s Notebook
    High speeds, small boards.
    Randall Myers

  • The Flexperts
    Going for gold.
    Mark Finstad

  • Technical Abstracts
    In case you missed it.

February 2013 cover

 

FEATURES

Signal Integrity
Addressing ‘Power-Aware’ Challenges of Memory Interface Designs
Memory interfaces are challenging signal integrity engineers from the chip level to the package, to the board, and across multiple boards. As the latest DDR3 and DDR4 speeds support multi-gigabit parallel bus interfaces with voltage swings smaller than previous generation interfaces, there is no room for error in any modern memory interface design. The combination of complete model libraries, advanced tools and engineering expertise addresses modern buses and data rates.
by Ken Willis and Brad Brim

Cover Story
Lead-Free Assembly Design for Manufacturability Considerations
The changeover to lead-free has brought with it serious implications for many key design rules. A look at the system-level management requirements and key DfM elements shown to improve overall yield, quality and reliability of high-complexity, high-reliability hardware.
by Matt Kelly and Mark Hoffmeyer, PH.D.

Quality Assurance
Availability Index and Minimized Reliability Costs

A model for quantifying how the total cost of improving and maintaining reliability can be minimized, and the relationship of that minimized cost to the availability index.
by Ephraim Suhir, Ph.D., and Laurent Bechou, PH.D.

ESD Basics
How Much Protection Is Enough?
Five questions to ask concerning ESD protection.
by The ESD Association

FIRST PERSON

 

MONEY MATTERS

  • ROI
    The great equalizer.
    Peter Bigelow

  • Focus on Business
    Evaluating technology improvements.
    Susan Mucha

 

TECH TALK

  • Designer’s Notebook
    Footprints' accuracy.
    W. Scott Fillebrown

  • In Flex
    Reducing flex assembly thickness.
    Dale Wesselmann

  • Tech Tips
    Solvent approval.
    Brian Ellis

  • Technical Abstracts
    In case you missed it.

January 2013 cover

 

FEATURES

Upverter
Designing Hardware in the Cloud
A startup company leveraging online collaborative tools to perform printed circuit design using a web browser and, in doing so, driving what it says is the first real technology transformation since Windows.
by Mike Buetow

Thermal Management
Direct Thermal Exchange and Its Impact on LED Heat Removal
A cutting-edge PCB construction methodology for highly-efficient heat removal or thermal dissipation creates a direct thermal path conduction capability and reduces LED junction temperature far more efficiently when compared to traditional FR-4, metal core or aluminum PCB constructions.
by Pratish Patel

High-Speed Backplanes
Predictability and Efficient Initial Backplane PCB Fabrication

The total signal loss is the combination of the losses by the conductor and dielectric laminate, and a successful design requires understanding SI design and low-loss material properties.
by Carl F. Hornig

Moisture Protection
Influences on Barrier Performance of UV/EB Cured Polymers.
by Joshua M. Oliver and Dale S. Babcock

 

FIRST PERSON

Caveat Lecto

Let’s get small.

  • Mike Buetow

 

TECH TALK

  • On the Forefront
    25 and counting.
    E. Jan Vardaman

  • Designer’s Notebook
    Stifling emissions.
    Patrick Carrier

  • ESD Basics
    Getting the Most from ESD Standards.
    The ESD Association

  • The Flexperts
    How many layers?
    Mark Verbrugge

  • Moisture Protection
    Influences on Barrier Performance of UV/EB Cured Polymers
    Joshua M. Oliver and Dale S. Babcock

  • Technical Abstracts
    In case you missed it.

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