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COVER STORY
Benefits and Challenges of 3D Semiconductor Packaging
By integrating multiple die elements within a single package outline, overall product functionality has increased and been made smaller than their predecessors, improving both performance and capability. Assembly of semiconductor die onto a substrate is essentially the same as those used for standard IC packaging in lead frames; however, substrate-based IC packaging for 3D applications can adopt a wider range of materials, and several alternative processes may be used in their assembly.
by Vern Solberg

FIRST PERSON

• Caveat Lector
  Standard problems.
  Mike Buetow
  
  
  

MONEY MATTERS

• ROI
  Ensuring onshoring.
  Peter Bigelow

• Focus on Business
  Talk, talk, talk.
  Susan Mucha

TECH TALK

• Signal Integrity Insights
  End games.
  Dr. Eric Bogatin

• Database
  Building the right library.
  Manny Marcano

• Designer’s Notebook
  Those crazy centroid files.
  Duane Benson

• Technical Abstracts
  In case you missed it.

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COVER STORY
The Price is Right
2010 was a comeback year for printed circuit board designers: Nearly 70% saw their pay rise – and perhaps more important – job security is improving. Our annual survey also shows designers aren’t as long in the tooth as some may have thought.
by Chelsey Drysdale

PCB PROCUREMENT
10 Tips for Purchasing PCBs
Four industry veterans with backgrounds in PCB materials, chemistry, fabrication and assembly provided their expert advice, often echoing each other’s recommendations. If you want to maximize PCB quality, price, performance, delivery or overall value, try following some of these insiders’ tips.
by Marissa Oskarsen

FIRST PERSON

• Caveat Lector
  Martin’s law.
  Mike Buetow
  
  
  

MONEY MATTERS

• Global Sourcing
  Making sense of the macros.
  Jennifer Read

• ROI
  Taken for granted.
  Peter Bigelow

TECH TALK

• On the Forefront
  Supply chain unlinked.
  E. Jan Vardaman

• Signal Integrity Insights
  Transparent via design.
  Dr. Eric Bogatin

• Database
  Parts management.
  Manny Marcano

• Designer’s Notebook
  Stacked up.
  Patrick Carrier
  
  
• Solar Technologies
  Solar conversion efficiency.
  Tom Falcon

• Technical Abstracts
  In case you missed it.

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FEATURES

Signal Integrity
Considerations for Proper Layout of a High-Speed PCB
An endless variety of software tools exist to ensure signal integrity at the board level. The critical tool, however, is careful evaluation of considerations to maintain PCB signal integrity. A review of the signal integrity demands of digital and analog components.
by Syed W. Ali, C.I.D.+

FIRST PERSON

• Caveat Lector
  Hedging turmoil.
  Mike Buetow
  
  
  

MONEY MATTERS

• Global Sourcing
  No stopping Thailand or Tunisia.
  Jennifer Read

• ROI
  Productivity lost.
  Peter Bigelow

• Focus on Business
  Building the EMS brand.
  Susan Mucha

TECH TALK

• Signal Integrity Insights
  Ferrite fear.
  Dr. Eric Bogatin

• Designer's Notebook
  Talk back to the librarian.
  Duane Benson

• Tech Tips
  The best tip(s).
  ACI Technologies Inc.

• Technical Abstracts
  In case you missed it.

• View the Digital Edition

   

FEATURES

HDI Plating
New Copper Electrolytes for Blind Microvia Filling
Problems related to conductive pastes as fillers have led to the development of certain electrolytes. To achieve the required coating properties, these processes use high-leveling sulphuric acid copper electrolytes containing organic bath additives alongside copper sulphate, sulphuric acid and chloride.
by Michael Dietterle, Ph.D.

EMS Top 50
The Great Rebound of 2010
The electronics manufacturing industry will remember 2010 for many reasons: rampant component shortages (and the rise of counterfeits), the tight financial markets and tense end-market conditions. But mostly, it will be remembered for recovery.
by Mike Buetow

FIRST PERSON

• Caveat Lector
  By a whisker.
  Mike Buetow
  
  
  

MONEY MATTERS

• ROI
  Not so golden.
  Peter Bigelow

TECH TALK

• Designer's Notebook
  Those tricky RF conductors.
  Mark Forbes

• Tech Tips
  Masked.
  ACI Technologies Inc.

• Solar Technologies
  Let’s get small.
  Tom Falcon

• Technical Abstracts
  In case you missed it.